Flexible Substrate

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Issue 121

Letter from the publisher: Picoscience…by Mark Fihn

Flexible Substrate news from around the world:  Penn State University, E Ink, PragmaticIC, PragmatIC/Schreiner MediPharm, McGill University, Nanjing University, KAIST, Zhejiang University, Electroninks, Rice University, Linköping University, University of Cambridge, UIUC, Argonne National Labs, Sungkyunkwan University, Skoltech, University of Colorado Boulder, UC Santa Clara, Brookhaven Labs, Empa, Nanjing Tech, Drexel University, Daegu Gyeongbuk Institute of Science and Technology, Columbia University, Swansea University, Prelonic, University of Bristol, E Ink/RyPax, Noctiluca, Ynvisible Interactive/Circuit Scribe, Creative Materials, ZEN Graphene Solutions/Deutsches Zentrum für Luft-und Raumfahrt, ETH Zurich, Stanford, Apple, Dell, Strategy Analytics, Motorola, National University of Singapore, Lintec, Parker Hannifin, C2MI/Varitron, Renata

UbiComp/ISWC, September 9-13, 2019, London, England; Papers from Aalborg University/Stockholm University, University of Lapland/Aalborg University, University of Electro-Communications, Queen Mary University of London/Imperial College London/Rachel Freire Studio

Display Week 2019, May 12-17, 2019, San Jose, California; Papers from Tianma Micro-electronics Group, BOE Technology (x2), XTPL SA/Korea Advanced Institute of Science and Technology (KAIST), Tohoku University, Japan Display, DuPont Electronics & Imaging, Global Optical Solutions/CEREBA AIST/Yamagata University, Semiconductor Energy Laboratory, Shenzhen China Star Optoelectronics, KITECH (x2), AGC Inc., Corning, University of Central Florida, Peking University Shenzhen Graduate School/Shenzhen China Star Optoelectronics Semiconductor Display Technology, Wuhan China Star Optoelectronics Semiconductor Display Technology, Electronics and Telecommunications Research Institute, Sichuan University/Beihang University

IDTechEx Show! April 10-11, 2019 Berlin, Germany; Presentations from PragmatIC, TactoTek, TNO/Holst Centre, First Graphene, Advanced Decorative Systems, ZSK Technical Embroidery Systems, Pireta, Quad Industries, Nissha Si-Cal, Sheldahl Flexible Technologies, Quest Integrated, LOOMIA Technologies, Joanneum Research, Armor, Statex Produktions & Vertriebs, Saule Technologies, infi-tex, Prismade, Holst Centre TNO, Wiliot, Schreiner MediPharm

Interview with Dr. Ching W. Tang

Korean OLED manufacturers have their ups and downs by Ken Werner

Form AND function with 3D electronics by Raghu Das

The graphene market research tipping point by Khasha Ghaffarzadeh

Last Word: Will 5G and the plastic electronic-fueled IoT destroy pollinators? by Chris Williams

Display Industry Calendar

Issue 120

Letter from the publisher: Bandages…by Mark Fihn

Flexible Substrate news from around the world:  MIT, University of Warwick, SunMan Energy, Tsinghua University, Georgia Institute of Technology, Merck/UDC, ResearchAndMarkets, Institute of Photonic Sciences, Plessey, Solliance/Miasolé, Dell, RMIT, UDC/LG Chem, LG, ETH Zurich, Strategy Analytics, Linköping University, Fraunhofer FEP, Stanford, UDC/EMT, Purdue University, University of Bristol/Telecomm ParisTech/Sorbonne University, Centre for Process Innovation, Xiaomi, UBI Research, IHS Markit, UBS, Technavio, Microsoft, MarketsAndMarkets, Max Planck Institute for Polymer Research, Fraunhofer IWM, Lenovo, Spinnova, University of Maryland, ABI Research, University of Warsaw, Mercedes, Samsung, Washington University in St. Louis, E Ink/DCI,

TCL, Display Supply Chain Consultants

Display Week 2019, May 12-17, 2019, San Jose, California; Papers from Sharp Corporation, Fudan University/National Sun Yat-Sen University, Hong Kong University of Science and Technology, Kyung Hee University, Samsung Display (x2), Applied Materials/National Taiwan University, Sungkyunkwan University/Samsung Display, LG Display (x2), Hewlett Packard Labs/University of California/Stanford University/Georgia Institute of Technology/Peking University/Hong Kong University of Science and Technology, Technische Universität Dresden, Kyulux, IT&E Materials, cynora GmbH, Kyung Hee University, Academia Sinica/National Taiwan University/Kyushu University

CHI 2019, May 4–9, 2019, Glasgow, Scotland; Papers from University of Colorado, University of Toulouse – ENAC/Ingenuity i/o/Berger-Levrault/Intactile Design/Astrolab, University of Minnesota, Aalborg University/University of Lapland, Syddansk Universitet/Aalto University, Zurich University of the Arts, University of Tokyo, RWTH Aachen University/Saarland University

IDTechEx Show – Europe 2019, April 10 - 11, 2019, Berlin, Germany; Presentations from IDTechEx (x3), Beko, Airbus, NanoXplore, MacDermid Alpha Electronics Solutions, Europlasma, Information Mediary Corporation, Samsung Advanced Institute of Technology, Continental

Electronic Displays Conference 2019, February 27-28, 2019, Nuremberg, Germany; Presentations from Kimoto Tech and SOKEN Chemical & Engineering

Opportunities for flexible OLED smartphone displays by Sweta Dash

Fones with folding displays will fall flat by Ken Werner

Printed Electronics: The defining trends in 2019 by Raghu Das

Stretchable electronics: Commercialization progress and challenges by Khasha Ghaffarzadeh

Design considerations for electronic textiles by James Hayward

Last Word: Must technology kill the artisan? by Chris Williams

Display Industry Calendar

Issue 119

Letter from the publisher: Foldable laptops…by Mark Fihn

Flexible Substrate news from around the world:  University of Cordoba, British Airways/ViewTag, Isorg/Sumitomo Chemical, Okinawa Institute of Science and Technology, Cambridge University, Mattrix Technologies, SPIE Sensor Conference, Texas A&M, Meyer Burger Technology/Oxford Photovoltaics, Swinburne University, Imec, KTH Royal Institute of Technology, University of California San Francisco, University of Toledo, Rice University, RIKEN/University of California San Diego, Karlsruhe Institute of Technology, Microsoft, Universiti Malaysia Pahang, Michigan State University, MIT, Chalmers University, Trackwise, Berkeley Labs, Yonsei University, Louis Vuitton, University of Toronto, Cynora, Hong Kong Polytechnic University, Carnegie Mellon University, University of Texas at Austin, IHS Markit, XoSoft, BeBop Sensors, Baoshen/PragmaticIC, Osaka University, Universal Display Corporation, South China University of Technology/Hong Kong University of Science and Technology/Jianghan University, Daegu Gyeongbuk Institute of Science and Technology, Royole, Samsung, Saarland University, Norwegian University of Science and Technology, CLEARink/FLEx ,Korea Institute of Science and Technology, University of Oxford, C Seed, Penn State Materials Research Institute, North Carolina State University, University of California Irvine, University of California San Diego, TCL, Oak Ridge National Laboratory, Vanguard LED Displays, Nubia, Florida State University, HTF Market Intelligence, Huawei, Sony, Clevetura, Osaka University, Technical University of Munich, Nankai University, University of Manchester, TU Dresden, Max Planck Institute for Polymer Research, University of Arkansas at Little Rock, University of Rochester, KTH Stockholm/DESY, University of Science and Technology of China/Sungkyunkwan University/Daegu Gyeongbuk Institute of Science and Technology/Osong Medical Innovation Foundation

PerDis ’19, June 12-14, 2019, Palermo, Italy; Papers from University of Lapland (x2), University of Glasgow/Universidad Publica de Navarra

CHI 2019, May 4-9, 2019, Glasgow, Scotland; Papers from University of Toulouse/Ingenuity i/o/Berger-Levrault/Intactile Design, University of Minnesota, Zurich University of the Arts Zurich, Aalborg University/University of Lapland, Syddansk Universitet/Aalto University, University of Colorado, RWTH Aachen University/Saarland University, University of Tokyo

TEI ’19, March 17-20, 2019, Tempe, Arizona; Papers from KTH Royal Institute of Technology, University Bordeaux, Concordia University, Aalto University/Syddansk Universitet, University of Colorado

Emerging applications for electronic skin patches by James Hayward

Stretchable conductive pastes: Challenging market segmentation by Khasha Ghaffarzadeh

Last Word: Interview with Chris Williams

Display Industry Calendar

Issue 118

Letter from the publisher: Pfoldable…by Mark Fihn

Flexible Substrate news from around the world:  FEP/EMDE, Terminator, KAIST, TrendForce, Corning, University of Houston, PragmatIC, Texas State University, Tokyo Institute of Technology, IDTechEx, Northwestern University, J.Flex, Cleer, Samsung, Georgia Institute of Technology/University of California San Diego/Massachusetts Institute of Technology, Lenovo, BCC Research, Google, Microsoft, Dresden University of Technology, Hokkaido University, University of Michigan, Tufts University, Tohoku University/Mitsui Mining & Smelting, Ludwig-Maximilians-Universität München, Linköping University, Universities of Birmingham/Bristol/Colorado Boulder, IMDEA Nanociencia, Rutgers University, ITMO University, University of Manchester, National Institute of Standards and Technology, Columbia University, Nanyang Technological University, and Paragraf

OLEDs World Summit, September 24-26, 2019, San Jose, California; Presentations from Display Supply Chain Consultants, Yole Développement, Hendy Consulting, CYNORA, TCL Corporate Research, OLED Association, Boeing, Universal Display Corporation, Pixelligent Technologies, OTI Lumionics, Fraunhofer FEP, Bardsley Consulting, Kyulux, Luflex, BOE, Holst Centre, Sumitomo Chemical, Corning, OLEDWorks, Kateeva, Dow-DuPont Electronics and Imaging, and BASF New Business

WEAR, June 11-13, New York City, New York; Presentations from Myant, Sensing Tex, Liquid X Printed Metals/FunxionWear/ North Carolina State University, EMS, and WEELTechnologies

IDTechEx Europe, April 11-12, 2018, Berlin, Germany; Presentations from Multek, Alpha Assembly Solutions, Neotech AMT GmbH, IDTechEx, FlexEnable, Interlink Electronics, DoMicro, Nano Dimension, NovaCentrix, Nottingham Trent University, Joanneum Research, PragmatIC, and Saati

Foldable displays present challenges galore by David Hsieh

OLED panel revenues to exceed $50 billion by 2023 by Bob O'Brien

Powering the flexible world by Xiaoxi He

Is flexible glass the ultimate solution? by Khasha Ghaffarzadeh

Technologies to watch in 2019 by Raghu Das

Progress towards flexible surface lighting sources by Norman Bardsley

Last Word: Old markets are screaming out for innovative solutions? by Chris Williams

Display Industry Calendar

Issue 117

Letter from the publisher: Big things from small packages…by Mark Fihn

Flexible Substrate news from around the world:  Fujian Normal University, PPG/National Hockey League, University of Cambridge, Friedrich-Alexander-Universität Erlangen-Nürnberg, Hong Kong Polytechnic University, PPG/Powercast, University of Massachusetts Amherst, NovaCentrix/Intrinsiq Materials, WitsView, ANTI Ordinary, University of Cambridge/Jilin University, University of Exeter, Freie Universität, Mitsubishi Electric, PragmaticIC, Vubiq Networks, Lyteus, Islamic Azad University, University of Bayreuth, UC Berkeley, Korea Advanced Institute of Science and Technology, Holst Centre/NovaCentrix, Alta Devices, Nottingham Trent University, Centre for Process Innovation/Pireta Limited, MIT, University of Illinois Urbana-Champaign, OLEDWorks, Harvard/Xi’an Jiaotong Universities, Royole, Kyoto University, Tampere University of Technology, Imec/University of Ghent/SEED, Stanford University, Samsung, and LG

ISS '18, November 25-28, 2018, Tokyo, Japan; Papers from University of Hawaii at Manoa, Meiji University, Indian Institute of Technology-Guwahati, and Meiji University

UIST ’18, October 14-17, 2018, Berlin, Germany; Papers from Carnegie Mellon University/ETH Zurich, University of Applied Sciences Upper Austria/Johannes Kepler University, Université Grenoble Alpes, Bauhaus-Universität Weimar, Inria/Univ. Paris-Sud & CNRS (LRI)/Université Paris-Saclay

ISWC '18, October 8-12, 2018, Singapore; Papers from MIT Media Lab, Ulm University, University of Lapland, University of Minnesota, and State University of New York

UbiComp, October 8–12, 2018, Singapore; Papers from Robert Bosch, University of California Davis, University of Auckland, Carnegie Mellon University/University of Illinois at Urbana-Champaign, Microsoft Research/Porsche/Ludwig-Maximilians-Universität/Northumbria University/Oxford University, Northwestern University, University of Minnesota, Utrecht University/University of Lapland

Display Week 2018, May 22-24, 2018, Los Angeles, California; Papers from Seoul National University, Silvaco Europe/CENIMAT, I3N, FCT-UNL, BOE Technology Group, TNO/Holst Centre/IMEC/Chungwha Picture Tubes, Hong Kong University of Science and Technology, Hitachi Chemical/Yamagata University, Chonbuk National University/Dong-A University, Kyung Hee University/Corning Research & Development Corporation/Korea University/SUN MOON University, Korea University/Samsung Display/SUN MOON University, KITECH, Korea University/SUN MOON University, Chinese Academy of Sciences, and Hongik University

IDTechEx Europe, April 11-12, 2018, Berlin, Germany; Presentations from Applied Materials Italia, Agfa Gevaert, Blue Spark Technologies, Ceradrop, Fraunhofer IISB, BreathDX, GE Healthcare, CIC energigune, CeNTI, Armor, and CPI

LOPEC, March 13-15, 2018, Munich, Germany; Presentations from Fraunhofer IVV, Cambridge University, National Research Council Canada, Karlsruhe Institute of Technology, Eurecat Technology Centre, Technische Universität Chemnitz, Nanomatch, Fraunhofer FEP, Dongguk University

PIQO pocket projector moves towards production by Arthur Berman

What educators think about flexible displays by Len Scrogan

Stretchable and conformable electronics: Materials, components, products by James Hayward

The global RFID industry / World firsts in Printed Electronics in 2018 by Raghu Das

Last Word: Roll up! roll up! roll up! The future of displays is here! Or is it? by Chris Williams

Display Industry Calendar

Issue 116

Letter from the publisher: Know when to fold ‘em…by Mark Fihn

Flexible Substrate news from around the world:  University of California San Diego, Australian National University, Drexel University, KAUST, Isorg, Linköping University, Heliatek, Yokohama National University/University of Tokyo, Duke University, MIT, Ulsan National Institute of Science and Technology, Binghamton University, E Ink/Fujitsu Semiconductor, University of Delaware, University of Colorado, Colorado State University, Aalto University, University of Waterloo, Carnegie Mellon University, DSCC, RMIT University, TU/e/Keio University, Fraunhofer FEP, University of St. Andrews, Pix, Panasonic/JOLED, IDTechEx, Thin Film Electronics, Queen’s University, Imec/ EnergyVille/Solliance/Centre for Solar Energy and Hydrogen Research, Flexolighting Project,Korea Advanced Institute of Science and Technology, University of Massachusetts Amherst,UC Santa Cruz/Lawrence Livermore National Laboratory, and Georgia Tech 

Display Week 2018, May 22-24, 2018, Los Angeles, California; Papers from Tosoh Corporation, AU Optronics/Merck Chemicals/Merck KGaA, LG Display x2, Semiconductor Energy Laboratory, Nanosys/DIC Corporation, Kyung Hee University/Silvaco Korea, Korea Advanced Institute of Science and Technology, TNO/Holst/IMEC/Chunghwa Picture Tubes, JXTG Nippon Oil & Energy, KAIST, POSTECH, University of Stuttgart/Evonik Industries, Korea Institute of Industrial Technology, Chungnam National University, Samsung Display, NHK Research Laboratories/Nippon Shokubai, UniJet, Ares Materials, Hong Kong University of Science and Technology, Kunshan New Flat Panel Display Technology Center/Kunshan Govisionox Optoelectronics, OLEDWorks LLC/OLEDWorks GmbH, Fraunhofer Institute for Applied Polymer Research/TNO/Holst Centre/Queen Mary University of London/PVI Precision Varionic International, AU Optronics, AKT Applied Materials, Université Grenoble-Alpes/Polyrise

LOPEC, March 13-15, 2018, Munich, Germany, Presentations from Fraunhofer IKTS, INM – Leibniz-Institute for New Materials, University of Tokyo, Fraunhofer FEP, National Research Council Canada, JLR Research, Cidetec, Konkuk University

Electronic Displays Conference, February 28 – March 3, 2018, Nuremberg, Germany; Presentations from Merck (x2), INURU, Dai Nippon Printing, FlexEnable, MSWTech, Pervasive Displays, Etulipa, Cynora, MSC Technologies, and LightnTec

IMID industry forum brings new technology insights by Bob O’Brien

How bad is the OLED-TV burn-in problem? by Ken Werner

Flexible, printed and thin film batteries by Xiaoxi He

OLED display market to reach $25.5 billion in 2018 by Raghu Das

Flexible thin film encapsulation: Evolution of the technology mix by Khasha Ghaffarzadeh

Last Word: Well actually, where there’s muck, there’s plastic…by Chris Williams

Display Industry Calendar

Issue 115

Letter from the publisher: VeV-metrics…by Mark Fihn

News from around the world:  Royole, Samsung, RIKEN, University of Cincinnati, Purdue, University of Texas at Arlington, Binghamton University, Georgia Tech, Osaka University, Tufts University, NUST MISIS Laboratory of Superconducting Metamaterials, Rice University/Northwestern University, Stony Brook University, University of Washington, KAUST, Chinese Academy of Sciences/Dalian University of Technology, MIT, Myant/Butler Technologies, Indian Institute of Science, National Institute of Technology/New York University-Abu Dhabi, KAIST, Lyteus, University of Glasgow, J.Flex, Skolkovo Institute of Science and Technology/MIT

DIS 2018, June 9-13, 2018, Hong Kong; Purdue University, City University of Hong Kong/Chalmers University of Technology/ Yildiz Technical University

Display Week 2018, May 22-24, 2018, Los Angeles, California; Papers from Semiconductor Energy Laboratory, Japan Display, Osaka University, Material Science Co., cynora GmbH, Princeton University, Yuan Ze University/National Taiwan University, Korea Advanced Institute of Science and Technology/Seoul National University Bundang Hospital, BOE Technology Group, Kyung Hee University, ETRI, Cambrios Advanced Materials, FlexEnable, Asahi Glass, Zeon Corporation, KAIST, Seoul National University, National Taiwan University/Academia Sinica/Ming Chi University of Technology/National Taiwan Ocean University

CHI 2018, April 21-26, Montréal, Canada; Papers from Saarland University and the University of California Berkeley

LOPEC, March 13-15, Munich, Germany; University of California Berkeley, Emerson & Renwick, NovaCentrix, Copprint, INURU, Coatema, BASF, Multek, Smithers Apex, ITRI, Meyer Berger, Optitune, N&B, TSE Troller, Technische Universität Dresden, Merck, IKEA

IDTechEx USA, November 15-16, 2017, Santa Clara, California; Presentations from Paper Battery Company, Bosch, Solvay Specialty Polymers, TactoTek, Universal Display Corporation, NovaCentrix, Tacterion, SRI International, PI-Crystal, PragmatIC, StretchSense, The Graphene Council, and Thin Film Electronics

OLEDs: Ready to excel in next generation smartphones by Sweta Dash

Conformal 3D-shaped coatings are a game-changing success? by Khasha Ghaffarzadeh

Last Word: Are Flexible Substrates running down a road to nowhere? by Chris Williams

Display Industry Calendar

Issue 114

Letter from the publisher: Plates and stickers…by Mark Fihn

News from around the world:  University of Michigan, IHS Markit, University of Manchester/Shandong University, PragmatIC, Light Polymers, MIT, Rice University, Terrada Music Score, Tianma, Northwestern University, University of Southern Denmark, FlexEnable, LG Electronics, Tokyo Metropolitan University/Shimane University, Yonsei/Chung-Ang Universities, Ecole Polytechnique Fédérale De Lausanne, SpiraSense, Beihang University/UT-Dallas, Aalto University/Université de Montréal, Strong/MDI Screen Systems, Fraunhofer FEP/VTT, Pennsylvania State University, University of Tokyo, Cordis, University of St. Andrews, Tokyo Institute of Technology, University of Connecticut, Oregon State University, Visionox/Universal Display, University of Minnesota/NanoLumens, Korea Advanced Institute of Science and Technology, KAUST, King Jim/E Ink, E Ink, LG Display, Intel, Beijing Engineering Research Center for BioNanotechnology, Wisechip/Kyulux, Chung-Ang University/Kyungpook National University/Sejong University, UT-Dallas, Tufts University, Wake Forest University, University of Hong Kong, Thin Film Electronics, Microsoft, CLEARink Displays, Absen, Alta Devices, Karlsruher Institute of Technology, Tokyo Tech, FP3, University of Cincinnati, Hokkaido University, Purdue University/University of Virginia, Purdue University, University of Glasgow Bendable Electronics and Sensing Technologies, and City University of Hong Kong

Tangible, Embedded and Embodied Interactions 2018, March 18–21, 2018, Stockholm, Sweden; Papers from Keio University, Eindhoven University of Technology/Ting Gong Studio, MIT Media Lab/SEEDS Studio Lab, Arizona State University, TU Wien, Rachel Freire Studio/University of Copenhagen/Sorbonne Universities/University of Michigan

IDTechEx USA, November 15-16, 2017, Santa Clara, California; Presentations from Joanneum Research, MacDermid Enthone, Multek, FlexEnable, Imprint Energy, Kateeva, N&B, NextFlex

SEMICON Europa, November 14-17, 2017, Munich, Germany; Presentations from Universitat Duisburg, Fraunhofer Institute for Organic Electronics, Airbus, HZDR/JKU Linz/University of Sussex, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, Masdar Institute Khalifa University, and Zinergy

DSCC updates OLED shipments after slow Q1 2018 by Ross Young

MicroLED displays vs. LCD and OLED by Lawrence Gasman

MicroLED displays: Even more than they seem by Ken Werner

Skin patches: the advantages of the ultimate wearable by James Hayward

Emerging technology trends featured at IDTechEx by Monika Dunkel

Progress reported in video rate electronic paper by Arthur Berman

China to dominate graphene commercialization by Khasha Ghaffarzadeh

Last Word: When will enough be enough? by Chris Williams

Display Industry Calendar

Issue 113

Letter from the publisher: Kirigami…by Mark Fihn

News from around the world:  Linkoping University, Texas A&M University, Chalmers University of Technology, Donghua University, OE-A, UC Berkeley, Penn State University, TU Graz, Linköping University/NTU, University of California San Diego, Cambridge University, Pervasive Displays, Rice University, Duke University, University of Bath, CLEARink, Dartmouth College, Purdue University, City University of Hong Kong, National Renewable Energy Laboratory, INM Leibniz Institute, Peratech, OLED Licht Forum, Fraunhofer Institute FEP, Moscow State University/Royal Institute of Technology, Fraunhofer IAP, ZTE, CNET, University of Illinois, IDTechEx, and ESPResSO

OLED Technologies Summit, November 24, 2017, Berlin, Germany; Presentations from Simbeyond, Cynora, PSA Group, and Beneq

IDTechEx USA, November 15-16, 2017, Santa Clara, California; Presentations from Agfa Gevaert, Cotton Incorporated/Principled Design, EnCap Energy, Chromera, University of California, Berkeley, DuPont Teijin Films, DS Hi-Metal, CLEARink, Electroninks, Etulipa, Galvani Bioelectronics, Haydale

SEMICON Europa, November 14-17, 2017, Munich, Germany; Presentations from Würth Elektronik, PragmatIC, Meyer Burger, Molex, FlexEnable, and Hahn-Schickard

OLEDs World Summit, September 21-22, 2017, San Francisco, California; Presentations from LG Display, Sumitomo Chemical, JOLED, Holst Centre/ TNO, and Fraunhofer FEP

Review of systems for printable multi-layer OLED fabrication by Matthew Aldred and Luke Judd

Optovate comes out of stealth mode by Bob Raikes

YOCTA process boosts equipment market by Ross Young

Flexible displays are here so why can't they fold? by Steve Sechrist

Stretchable electronics is about more than just form factor by James Hayward

Conductive inks: recent and emerging market trends by Khasha Ghaffarzadeh

Last Word: April Fool! The joke’s on us by Chris Williams

Display Industry Calendar

Issue 112

Letter from the publisher: Where’s the killer application?…by Mark Fihn

News from around the world:  University of Washington, Skoltech/Aalto University, Rutgers University-New Brunswick/Oregon State University, University of Colorado, Tsinghua University, Ionic Materials, AFRL/NextFlex, Computer Science and Artificial Intelligence Laboratory, GVO/UDC, Samsung Display/UDC, NextFlex, Linköping University, University of Buffalo, Korea Advanced Institute of Science and Technology, Columbia University, GE Ventures/FLEXCEED, Carnegie Mellon University, NextFlex/HPE Labs/SI2 Technologies/Lorain County Community College/Georgia Tech/US Army Research Laboratory/AFRL, Iowa State University, AFRL/American Semiconductor, ITMO University, Northwestern University, DNP/University of Tokyo, LG Display, UNIST, ASUS/JOLED, BOE, Nanyang Technological University, National University of Singapore, IHS, Sharp/UDC, Sharp, University of Glasgow, E Ink Holdings/Papercast, Linköping University, Cooledge, University of Illinois at Urbana-Champaign,  University of Connecticut, Skanska, Nanjing University/Peking University/CNRS-Ecole Polytechnique, University of São Paulo/University of Campinas, University of Sussex, Visa/Dynamics, University of Michigan, King Abdullah University of Science and Technology, Sciencemag.org, Georgia Institute of Technology, Umeå University/Linköping University, North Carolina State University, University of Manchester, LG Display, Rice University, WPI-MANA, Chonnam National University, Starcell Project, OE-A, Stanford University, IHS Markit, and University of British Columbia

Augmented Human International Conference, February 7-9, Seoul, Korea; Paper from the University of Electro-Communications

OLEDs World Summit, September 21-22, 2017, San Francisco, California; Presentations from EMD Performance Materials, Acuity Brands Lighting, Cynora, OLEDWorks, Kolon Industries, Simbeyond, Solip Tech, Vitriflex, and Kateeva

SID Display Week, May 23-26, 2017, Los Angeles, California; In this final report, Phillip Hill covers papers from Korea University/Sun Moon University, 3M Company, Korea Advanced Institute of Science and Technology (KAIST), Industrial Technology Research Institute, and IMEC/TNO/Holst Centre/KU Leuven/Chungwha Picture Tubes/Eindhoven University of Technology

Flexible OLEDs: Savior for the smartphone market? by Sweta Dash

Do flexible OLEDs have a differentiation problem? by Ross Young

The evolving opportunity for smart antimicrobials by Lawrence Gasman

E-Textiles 2017-2027: Technologies, markets, players by James Hayward

Stretchable electronics to reach $600M by 2027 by Khasha Ghaffarzadeh

Last Word: Wearable electronics comes of age? by Chris Williams

Display Industry Calendar

Issue 111

Letter from the publisher: Searching for an identity…by Mark Fihn

News from around the world:  Toyohashi University of Technology, TALKIN’ THINGS/PragmatIC, University of Manchester, Stanford, Royole/UDC, Binghamton University, SOLEDLIGHT, BAE Systems, MIT, Pervasive Displays, PragmatIC, Northwestern University, North Carolina State University, Imperial College London/Cambridge University, Wyss Institute, University of Sussex, City University of New York, National University of Singapore, A*STAR, Deposition Sciences, University of Cambridge, University of Massachusetts Amherst, US Naval Academy, Deakin Institute, LBNL, RPI, Princeton, University of Liverpool, RIKEN, JOLED, Henkel/Copprint, Adhesive Technologies, Modulit Project, and Kateeva

OLED Technologies Summit, November 23-24, 2017, Berlin, Germany; Phillip Hill covers presentations from Osram, Fraunhofer FEP, SAES Getters SpA, and Humboldt-Universität zu Berlin

IDTechEx USA, November 15-16, 2017, Santa Clara, California; In the first of four reports, Phillip Hill covers presentations from AzTrong Inc., BASF New Business GmbH, MGI Group, and CondAlign

SEMICON Europa, November 14-17, 2017, Munich, Germany; In the first of two reports, Phillip Hill covers presentations from Institut für Mikroelektronik Stuttgart, Trelic Ltd, E Ink Corporation, Yole Développement, and Robert Bosch GmbH

User Interface Software and Technology Symposium, October 22-25, 2017, Quebec City, Quebec; Phillip Hill covers presentations from ETH Zurich/EPFL/Chalmers University of Technology, Carleton University/University of Lille, Keio University/The University of Tokyo, Dartmouth College/NTUST/Academia Sinica/Carnegie Mellon University, University of Applied Sciences Upper Austria/Saarland University/Google Inc., and Purdue University

Interactive Surfaces and Spaces, October 17-20, 2017, Brighton, England; Phillip Hill covers papers from University of Sussex/Swansea University, Carleton University, Technische Universitat Dresden, Swansea University, and Saarland University

SGIA Printed Electronics Symposium, October 10-12, 2017, New Orleans, Louisiana; Phillip Hill covers presentations from VCE Solutions, and Sefar

OLEDs World Summit, September 21-22, 2017, San Francisco, California; In the first of two reports, Phillip Hill covers presentations from Audi AG, Fraunhofer FEP, 3M, Electronics and Imaging Business (Dow/DuPont), Sungkyunkwan University (SKKU), and Universal Display Corporation

SID Display Week, May 23-26, 2017, Los Angeles, California; In the fifth of five reports, Phillip Hill covers papers from Industrial Technology Research Institute (ITRI), Korea Advanced Institute of Science and Technology (KAIST)/Ulsan National Institute of Science and Technology (UNIST), University of Stuttgart, Kent Displays, Kyung Hee University, AU Optronics Corp., and Yamagata University

LOPEC, March 28-30, 2017, Munich, Germany; In this final report, Phillip Hill covers presentations from BotFactory, American Semiconductor Inc., VTT Technical Research Centre of Finland Ltd/Eurecat Technology Centre of Catalonia, Korea Institute of Machinery and Materials (KIMM)/GJM Co., EXAKT Advanced Technologies GmbH, MMC Ryotec, and AU Optronics

Stretchable and conformable electronics by Khasha Ghaffarzadeh and James Hayward

Roll-to-roll production of OLED displays and lighting by Norman Bardsley

Last Word: Out with the old – in with the new! by Chris Williams

Display Industry Calendar

Issue 110

Letter from the publisher:  Not yet convinced…by Mark Fihn

News from around the world:  Nanyang Technological University, University of Nebraska-Lincoln, Harvard Medical School/MIT, Ulsan National Institute of Science and Technology, Georgia Tech/Korea University, Empa, KAUST, Chalmers University of Technology, Pennsylvania State University, Pyreos, National Renewable Energy Laboratory, University of Wisconsin-Madison, MIT, Huazhong University of Science and Technology, Meggitt Training Systems, Rutgers University-New Brunswick, Johns Hopkins University Applied Physics Laboratory/University of Maryland, University of Sussex/Swansea University, University of California-Davis, TU Delft, Air Force Research Laboratory/Harvard University, NextFlex, MIT/Brigham and Women’s Hospital, KAIST, FlexTech Alliance/PARC, University of Nottingham, Michigan State University, Carnegie Mellon University, Kyushu University, Cambridge University, Georgia Institute of Technology, University of Manchester, DGIST, and University of Cambridge/CPI/NPL

Ubicomp, September 13-15, 2017, Maui, Hawaii; Phillip Hill covers papers from Shirley Ryan Ability Lab/Northwestern University, The University of Tokyo, Ulm University, and Brighton and Sussex Medical School/University of Sussex/Brighton and Sussex University Hospital

International Symposium on Wearable Computers, September 11-15, 2017, Maui, Hawaii; Phillip Hill covers papers from University of Minnesota, University of Siegen/University of Freiburg, NTT Corporation, and Georgia Institute of Technology/Safety Third Productions

SIGGRAPH, July 30-August 3, 2017, Los Angeles, California; Phillip Hill covers papers from Nippon Telegraph and Telephone Corporation, Tokyo Metropolitan University/National Institute of Advanced Industrial Science and Technology (AIST), Foolish Products LLC, Columbia College Chicago, and Cornell University/Nvidia Corporation

SID Display Week, May 23-26, 2017, Los Angeles, California; In the fourth of five reports, Phillip Hill covers papers from NHK Science & Technology Research Laboratories/Kobe Steel Ltd., BOE Technology Group, China Star Optoelectronics Technology, Peking University/South University of Science and Technology of China, Electronics and Telecommunications Research Institute (ETRI)/Advanced Vacuum and Clean Equipment Optimizer (AVACO), Silvaco Korea Co. Ltd/Kyung Hee University, Shanghai Jiao Tong University, Peking University, AU Optronics, Mitsubishi Electric Corporation, China Star Optoelectronics Technology, University of Victoria, LG Display, AU Optronics, and Korea Advanced Institute of Science and Technology (KAIST) (x2)

IDTechEx Printed Electronics Europe, May 10-11, Berlin, Germany; In the fourth of four reports, Phillip Hill covers presentations from NovaCentrix, Celeprint, and Primo1D

CHI, May 6-11, 2017, Denver, Colorado; In the second of two reports, Phillip Hill covers papers from University of Applied Sciences Upper Austria/Google Inc., Saarland University/Google Inc., University of Tsukuba, NTT Communication Science Laboratories, and Technische Universitat Dresden

LOPEC, March 28-30, 2017, Munich, Germany; In the fifth of five reports, Phillip Hill covers presentations from Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP, Holst Centre, CDT, and Fraunhofer Institute for Applied Polymer Research IAP/Bergische Universität Wuppertal/EXAKT Advanced Technologies GmbH

Liquid crystal semi-conductors for printable OLEDs by Matthew Aldred

Does C3Nano have the technology that will kill ITO? by Ken Werner

ITO and its alternatives: the next major growth phase will come? by Khasha Ghaffarzadeh

Last Word: New technology – the second time round by Chris Williams

Display Industry Calendar

Issue 109

Letter from the publisher:  Stretch…by Mark Fihn

News from around the world:  OT-Morpho, Aalto University, CPI/FLEXTRANS, City University of Hong Kong, University of California San Diego, Okinawa Institute of Science and Technology, KAIST, Purdue University, LG/Samsung/CYNORA, Diversified Nano Solutions, KAUST, University of Cambridge, Nanyang Technological University, Eastman Chemical, E Ink/Progress Technologies, E Ink/Ueberall/San Diego International Airport, E Ink/Plastic Logic, Daegu Gyeongbuk Institute of Science and Technology, Harvard, ETH Zurich, Printed Energy, MIT, Imperial College, University of Chicago, RIKEN/University of Tokyo, Merck, A*STAR, NEXGEN Biotechnologies/Thinfilm, Fudan University, RIKEN, University of Massachusetts Amherst, University of Wisconsin-Madison, Empa, KAUST/NTU, Ulsan National Institute of Science and Technology, Tohoku University, Columbia Engineering, Flisom, MIT/Harvard, Korea University, Covestro, CYNORA, Solvay/BASF, PI-SCALE, FLEX-G Project, Kent Displays, and DowDuPont

SID Display Week, May 23-26, 2017, Los Angeles, California; In the third of four reports, Phillip Hill covers papers from Merck KGaA, Sumitomo Chemical, BOE Technology Group, Sungkyunkwan University/University of California, DifTek Lasers Inc./University of Waterloo/Christie Digital Systems Canada Inc., Kochi University of Technology, BOE Technology Group, Semiconductor Energy Laboratory, 3M Company, and Seoul National University

CHI, May 6-11, 2017, Denver, Colorado; Phillip Hill covers papers from University of Hannover, Technische Universitat Darmstadt/Saarland University/Synaptics, Carleton University, and Fraunhofer IGD/University of Cologne

IDTechEx Printed Electronics Europe, May 10-11, Berlin, Germany; In the third of four reports, Phillip Hill covers presentations from GrapheneTech, Heraeus Electronics, iBeam Materials Inc., and Kateeva

LOPEC, March 28-30, 2017, Munich, Germany; In the fourth of five reports, Phillip Hill covers presentations from Coatema Coating Machinery GmbH, Merck Chemicals Ltd, Holst Centre, VTT Technical Research Centre of Finland Ltd, CDT, ETRI, Thin Film Electronics ASA, and the European Union

Flexible LCD: In the market at last by Sweta Dash

IMEC and CPT show patterned OLEDs by Matt Brennesholtz

The road to fully flexible consumer electronics by Harry Zervos

Conductive inks: never ceasing to adapt by Khasha Ghaffarzadeh

Last Word: How to beat climate change! by Chris Williams

Display Industry Calendar

Issue 108

Letter from the publisher:  Eclipse…by Mark Fihn

News from around the world:   Eindhoven University of Technology/Kent State University, IST Austria, University of Tokyo, Light Polymers, NIMS, Stanford/Dallas Solar/EMC, Thin Film Electronics, Tsinghua University, MIT, DuPont Advanced Materials, Eight19, National Graphene Institute, Hokkaido University, Isorg/FlexEnable, Wyss Institute at Harvard University, UNIST, Ludwig-Maximilians-Universitaet, Fudan University, University of Tokyo, Merck, Rice University/Los Alamos National Laboratory, Kyushu University, Fraunhofer IZM, USPS, FlexEnable/Truly, IISER-Kolkata, University of Hong Kong, DSCC, University of Texas at Austin, OPVIUS, Battery Innovation Center/BrightVolt, University of Chicago/Argonne National Laboratory, Binghamton University, Laird, PI-SCALE, University of Manchester, Oxford Instruments, DuPont/Dow, and Air Force Research Laboratory

Designing Interactive Systems, June 10-14, 2017, Edinburgh, Scotland; Phillip Hill covers papers from MIT/Royal College of Art/Stanford University, and Zhejiang University/Stockholm University

SID Display Week, May 23-26, 2017, Los Angeles, California; In the second of four reports, Phillip Hill covers papers from AU Optronics Corporation, Semiconductor Energy Laboratory, Columbia University, Kyushu University, Industrial Technology Research Institute (ITRI), CPT Technology Group/Chunghwa Picture Tubes, LINTEC Corporation, Kunshan Govisionox Optoelectronics Co Ltd, South China Normal University/Shenzhen Guohua Optoelectronics, Kent Displays Inc., Bodle Technologies Ltd/University College London/University of Oxford, Liquid Crystal Institute/MIT Lincoln Laboratory, Hong Kong University of Science and Technology/City University of Hong Kong, AU Optronics Corporation, Tohoku University/V-Technology Co Ltd/Kyushu University, Polatechno Co Ltd, Kent State University/Universal Display Corporation, Merck Chemical, and FlexEnable

IDTechEx Printed Electronics Europe, May 10-11, Berlin, Germany; In the second of four reports, Phillip Hill covers presentations from Copprint, Enfucell Oy, Cambridge Nanosystems, FlexEnable, and Fraunhofer EMFT

LOPEC, March 28-30, 2017, Munich, Germany; In the third of four reports, Phillip Hill covers presentations from The Hebrew University of Jerusalem, VTT Technical Research Centre of Finland Ltd, TU Eindhoven/FlexEnable Ltd/Altran Concept Tech GmbH/Joanneum Research, VTT Technical Research Centre of Finland Ltd, Konkuk University/VTT Technical Research Centre of Finland, Pukyong National University, Ares Materials, and adphos Digital Printing GmbH

International Conference on Wear of Materials, March 26-30, 2017, Long Beach, California; Phillip Hill covers a presentation from BrightVolt

New (and old) applications for silver inks by Lawrence Gasman

RFID market to reach $11.2 billion in 2017 by Raghu Das

Flexible OLED capacity to sustain 91% CAGR between 2016 and 2020 by Ken Werner

Stretchable electronics: commercial success stories by Khasha Ghaffarzadeh

Last Word: There’s no fuel like an old fuel! by Chris Williams

Display Industry Calendar

Issue 107

Letter from the publisher:  Stretchable?…by Mark Fihn

News from around the world:   Nanocomp, NextFlex, Thin Film Electronics, Duke University, RMIT University, University of Basel, Thin Film Electronics/Oskar Blues Brewery, LG Display, North Carolina State University, University of California San Diego, University of Glasgow, University of Minnesota, National Research Council in Canada, University of Massachusetts Amherst, University of Cambridge, E Ink, Peach, University of Surrey, US Air Force Academy, University of Washington/MIT, CYNORA, Carnegie-Mellon University, Michigan State University, Ludwig-Maximilians-Universitaet, Fraunhofer IWM, Optomec, Leibniz Institute for New Materials, UNSW/University of Queensland, Georgia Institute of Technology, North Carolina State University, National Center for Nanoscience and Technology, Technical University of Denmark/Århus University/IBM/Brookhaven National Laboratory, and US Department of Energy

SID Display Week, May 23-26, 2017, Los Angeles, California; In the first of four reports, Phillip Hill covers papers from Technische Universität Dresden/University of St Andrews, AU Optronics Corporation, Kyung Hee University, Samsung Display, LG Display, Universal Display Corporation (x2), Vitriflex, University of California/Nankai University, Osaka University, Kent State University/Kent State University-Trumbull/Jiangsu Industry Technology Research Institute, Evonik Resource Efficiency GmbH/Holst Centre/Eindhoven University of Technology, Japan Advanced Printed Electronics Technology Research Association (JAPERA), and Industrial Technology Research Institute (ITRI)

SID/DSCC Automotive Display Conference, May 23, 2017, Los Angeles, California; Phillip Hill covers a presentation from FlexEnable

SID/DSCC Investors Conference, May 23, 2017, Los Angeles, California; Phillip Hill covers presentations from X-Celeprint Ltd., and Universal Display Corporation

SID/DSCC Business Conference, May 22, 2017, Los Angeles, California; Phillip Hill covers presentations from Kateeva, and Corning Incorporated

IDTechEx Printed Electronics Europe, May 10-11, Berlin, Germany; In the first of four reports, Phillip Hill covers presentations from Agfa-Gevaert NV, Alpha Assembly Solutions, Argaman Technologies, and AzTrong Inc.

LOPEC, March 28-30, 2017, Munich, Germany; In the second of four reports, Phillip Hill covers presentations from Adenso GmbH, TSE Troller AG, OE A, ISORG, AUO, National Research Council Canada, and Hahn-Schickard

Tangible, Embedded and Embodied Interactions, March 20-23, 2017, Yokohama, Japan; In the second of two reports, Phillip Hill covers papers from Wellesley College, University of Tsukuba, Carleton University, and Rachel Freire Studio/DataPaulette/University of Copenhagen

Electronic Displays Conference, March 15-16, 2017, Nuremberg, Germany; In the second of two reports, Phillip Hill covers presentations from Dexerials Europe BV, and Lumineq

FLEX Europe, October 25-26, 2016, Grenoble, France; In the fourth of four reports, Phillip Hill covers presentations from Applied Materials WEB Coating GmbH, Hahn-Schickard, Coatema Coating Machinery GmbH, and Air Force Research Lab

Perovskite processing goes roll-to-roll by Matt Brennesholtz

The foldable smartphone – coming soon? by Norbert Hildebrand

Fully flexible consumer electronics and the role of flexible encapsulation by Harry Zervos

Conductive inks: major innovation themes and trends by Khasha Ghaffarzadeh

Display terminology: ‘AMOLED’ by Jin Kim

Last Word: And one for the pot…by Chris Williams

Display Industry Calendar

Issue 106

Letter from the publisher:  “Degrading”...by Mark Fihn

News from around the world:  University of Exeter, UNIST, Georgia Tech, KAUST, NASA Jet Propulsion Laboratory, Purdue University, OE-A, Display Supply Chain Consultants, University of California, INM, LG, University of Illinois, Munich University of Applied Sciences, National University of Singapore, NextFlex, INM Leibniz Institute for New Materials, IDTechEx, AMBER, Argonne National Laboratory, KAIST, Vienna University of Technology, Duke University, RMIT University, University of Manchester/University of Pisa, RIKEN, PragmatIC, Georgia Institute of Technology/Peking University, Columbia University, Ulsan National Institute of Science and Technology, E Ink/Terrada Music Score, Optomec, Merck, Fujitsu, Jenax, Voltera, Intrinsiq/NovaCentrix, Thin Film Electronics, XTPL, VTT Technical Research Centre, Canadian Printable Electronics Industry Association, Yale, and University of Glasgow

LOPEC, March 28-30, 2017, Munich, Germany; In the first of four reports, Phillip Hill covers presentations from VTT Technical Research Center of Finland/Picosun Oy/Polyteknik AS/Uninova, Fraunhofer Institut für Silicatforschung/Korea University, Erich Schmid Institute of Materials Science, SCHOTT AG, Multek, Kateeva, and NovaCentrix

Tangible, Embedded and Embodied Interactions, March 20-23, 2017, Yokohama, Japan; In the first of four reports, Phillip Hill covers papers from Newcastle University/Georgia Institute of Technology/Northumbria University, Singapore University of Technology and Design/Keio University/Massachusetts Institute of Technology, Saarland University, and Eindhoven University of Technology/Carleton University

Augmented Human Conference, March 17-18, 2017, Mountain View, California; Phillip Hill covers papers from University of Tsukuba/AISIN Seiki Co. Ltd., and Keio University/NTT Communication Science Laboratories

Electronic Displays Conference, March 15-16, 2017, Nuremberg, Germany; In the first of four reports, Phillip Hill covers presentations from Osram, VIA optronics GmbH, DATA MODUL AG, and RAMPF Productions Systems GmbH & Co. KG

Computer-Supported Cooperative Work, February 25 - March 1, 2017, Portland, Oregon; Phillip Hill covers a paper from Simon Fraser University

FLEX Europe, October 25-26, 2016, Grenoble, France; In the third of three reports, Phillip Hill covers presentations from Fraunhofer EMFT, Imprint Energy, and Holst Centre

New trends in self-healing materials by Lawrence Gasman

Display origami by Norbert Hildebrand

Stretchable electronics: everything you need to know by Khasha Ghaffarzadeh

Last Word: Is organic technology on the rebound? by Chris Williams

Display Industry Calendar

Issue 105

Letter from the publisher:  Tats...by Mark Fihn

News from around the world:  University of Warwick, KAIST, University of Bayreuth, Arcus/Thinfilm, OE-A, MIT, Solliance, Missouri University of Science and Technology, University of British Columbia, Stanford, Panasonic Corporation, Technavio, University of Cambridge, Colas, Rice University, Kwangwoon University, RMIT University, Aalto University, University of California Riverside, Japan Display, DuPont/Holst Centre, Cambridge Graphene Centre at the University of Cambridge, Empa, UCSD, Technical University of Munich, Ames Laboratory, German OLED Technology Alliance, Fraunhofer FEP/Von Ardenne, VTT Technical Research Centre of Finland, Hallam, and Henkel

Printed Electronics USA, November 16-17, 2016, Santa Clara, California; In the third of three reports, Phillip Hill covers presentations from NovaCentrix, Panasonic Research, Meyer Burger Netherlands, Korea Institute of Materials Science, and Semblant

FLEX Europe, October 25-26, 2016, Grenoble, France; In the second of four reports, Phillip Hill covers presentations from University of Cambridge, Fraunhofer FEP, Merck KGaA, and E Ink Corporation

User Interface Software and Technology Symposium, October 16-19, 2016, Tokyo, Japan; In the third of three reports, Phillip Hill covers presentations from University of Applied Sciences Upper Austria/Google Inc., TU Berlin/Aarhus University, and Université Paris-Saclay

Printed electronics makes its way into ever more products, prepared by LOPE-C staff

How can printed electronics improve our daily lives? prepared by LOPE-C staff

Graphene and 2D Materials Europe, prepared by IDTechEX staff

Three hot trends in printed and flexible electronics, prepared by IDTechEX staff

New trends in self-healing materials by Lawrence Gasman

Imec Develops Flexible OLEDs by Matt Brennesholtz

OLED smartphone panel outlook by supplier and brand by Ross Young and Bob O’Brien

Can e-textiles take the next step towards the mass market? by James Hayward

Stretchable electronics: No longer a solution looking for a problem by Khasha Ghaffarzadeh

RFID Sensors: filling a real need or hoping for the best? by Raghu Das

Last Word: Bend, roll, stretch – you know it’s good for you! by Chris Williams

Display Industry Calendar

Issue 104

Letter from the publisher:  An LCD fab in the US?...by Mark Fihn

News from around the world:  E Ink, Suzhou Institute, University of Manchester, Rice University, Thin Film Electronics/Northern Lights Spirits, University of Toronto, National Chemical Laboratory Pune, Florida State University, Stanford, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma, Rotex, UNIST, LUMENTILE, Samsung Electronics Institute of Technology, Gwangju, E Ink/TEXEN, DGIST, SolarWindow Technologies, Argonne National Laboratory/Northwestern University, Apple, Displaydata, MSU Carnegie Mellon University, UCSD, CSIRO, Linköping/Borås Universities, KAUST, North Carolina State University, University of Strasbourg, Purdue University, EPFL, NNFC, and Duke University

Printed Electronics USA, November 16-17, 2016, Santa Clara, California; In the second of four reports, Phillip Hill covers presentations from Parker Hannifin, Heraeus, BeBop Sensors, and Agfa-Gevaert NV

Interactive Surfaces and Spaces, November 6-9, 2016, Niagara Falls, Ontario; Phillip Hill covers a paper from Technische Universitat Dresden

FLEX Europe, October 25-26, 2016, Grenoble, France; In the first of four reports, Phillip Hill covers presentations from Zinergy UK Ltd, Genes’Ink, Osram, and Air Force Research Laboratory

User Interface Software and Technology Symposium, October 16-19, 2016, Tokyo, Japan; In the second of four reports, Phillip Hill covers presentations from Pohang University of Science and Technology (POSTECH)/Konkuk University, Stanford University, National Taiwan University/Institute for Information Industry, and Queen’s University

SID Display Week, May 22-27, 2016, San Francisco, California; In the fifth of five reports, Phillip Hill covers presentations from PPG Industries Inc., Kyung Hee University, University of Waterloo/Christie Digital Systems Canada Inc./DifTek Lasers Inc., Kent State University/Stanford University, Tohoku University, AU Optronics, Semiconductor Energy Laboratory Co. Ltd., Nippon Electric Glass Co. Ltd., Electronics and Telecommunications Research Institute/Korea Advanced Institute of Science and Technology, AU Optronics Corp., Columbia University/Vienna University of Technology/Laboratoire de Physique des Interfaces et des Couches Minces (LPICM)/Korea Advanced Institute of Science and Technology

Printed Electronics Europe, April 27-28, 2016, Berlin, Germany; In the fourth of four reports, Phillip Hill covers presentations from PragmatIC Printing Ltd, Holst Centre, and Philips Lighting

Large-area, Organic & Printed Electronics Convention, April 5-7, 2016, Munich, Germany; In the third of three reports, Phillip Hill covers presentations from Holst Centre, ICMAB, Oxford Lasers Ltd, Leibniz Institute for New Materials, TU Chemnitz, Fraunhofer Institute for Applied Optics and Precision Engineering (IOF), VTT, OLEDWorks, CDT, and E Ink Corporation

Imec develops flexible OLEDs by Matt Brennesholtz

Stretchable electronics: Out of the lab and into the market by James Hayward

Conductive inks in 2017: The next big thing by Khasha Ghaffarzadeh

Last Word: Welcome to 2017 – A Brave New World unfolds…by Chris Williams

Display Industry Calendar

Issue 103

Letter from the publisher:  Car bling...by Mark Fihn

News from around the world: Graphene Flagship, Tohoku University, FlexEnable, IHS Markit, Universidad Politécnica de Madrid, University of Warwick, NanoLumens, Inamo, Xfano, Michigan State University, MIT, North Carolina State University, University of Leiden, Nextflex/UMass Lowell, Cambridge University, Oregon State University, Binghamton University, ICFO, Fujitsu Labs, PI-SCALE Project, Harvard, Imperial College London, Stanford, Biolin Scientific, AkKo Lab, Directa Plus, PARC, Avery Dennison/Hanita Coatings, SolarWindow, and Northwestern University

SIGGRAPH Asia, December 5-8, 2016, Macao, China; Phillip Hill covers papers from Keio University Graduate School of Media Design/Nagoya Institute of Technology, University of Tsukuba/Aisin Seiki, and Chiba University/National Astronomical Observatory of Japan

Printed Electronics USA, November 16-17, 2016, Santa Clara, California; In the first of four reports, Phillip Hill covers presentations from Kateeva, Birla Carbon, CDT, and Copprint

International Conference on Multimodal Interaction, November 12-16, 2016, Tokyo, Japan; Phillip Hill covers a paper from Osaka University

User Interface Software and Technology Symposium, October 16-19, 2016, Tokyo, Japan; In the first of four reports, Phillip Hill covers presentations from Kanazawa College of Art, Microsoft Research/University of Washington, Meiji University, and Queen’s University

SID Display Week, May 22-27, 2016, San Francisco, California; In the fourth of five reports, Phillip Hill covers presentations from Chonbuk National University, Korea Advanced Institute of Science and Technology (KAIST), BOE Technology Group, Yonsei University, FlexEnable Ltd, The Hong Kong University of Science and Technology, Shanghai Jiao Tong University/Shenzhen China Star Optoelectronics Technology Co. Ltd., BOE Technology Group, Chonbuk National University, Toshiba Corporation, AU Optronic Corporation, and Kyung Hee University/Takoma Technology and Company Ltd.

Printed Electronics Europe, April 27-28, 2016, Berlin, Germany; In the third of four reports, Phillip Hill covers presentations from the European Commission, GNext, Grafentek GmbH, DuPont, Fraunhofer IKTS, NovaCentrix, and FlexEnable

Large-area, Organic & Printed Electronics Convention, April 5-7, 2016, Munich, Germany; In the second of three reports, Phillip Hill covers presentations from Adenso GmbH, Japan Advanced Printed Electronics Technology Research Association (JAPERA), BASF New Business GmbH, Sumitomo Chemical, and Technische Hochschule Nürnberg

LOPEC 2017: Printed electronics for our health: Interview with Ton van Mol

Fully printed sensors will reach $7.6 billion by 2027 by Guillaume Chansin

Lenovo’s flexible phone and tablet shown by Arthur Berman

Shape Memory Polymer markets by Lawrence Gasman

Flexible OLED capacity ready for takeoff by Ross Young

Last Word: Even the chickens are coming home to roost! by Chris Williams

Display Industry Calendar

Issue 102

Letter from the publisher:  Simple circuits...by Mark Fihn

News from around the world: Queen’s University, Molex, IBS, Yole Développement, University of Southampton/Plasma App, Thinfilm/Bedford, E Ink/Japan Display, OE-A, University of Illinois, Armor, Arovia, Virginia Tech, Apple, University of California San Diego, UC Santa Barbara, TU Delft, Harvard, UC Berkeley, University of Surrey, University of Central Florida, n-tech Research, Thin Film Electronics, Océ, UIC/Korea University, VTT Technical Research Centre of Finland, Foxconn, Toppan/E Ink, DuPont Teijin Films, Merck/Idemitsu, NextFlex/California Manufacturing Technology Consulting, IDTechEx, NIST, Sun Chemical/DIC Corporation/Gwent Electronic Materials, AOC, FlexEnable, NextFlex, Northfield Automation Systems, Sensor Films/NextFlex, Emerson Cargo Solutions, European Patent Office/SmartKem, Center for Integrated Nanostructure Physics, Inha University/University of Pittsburgh/Air Force Research Laboratory, HaRFest Project, and Fraunhofer FEP 

New product announcements from the IDTechEx Show, November 16 - 17, Santa Clara, California

SGIA Printed Electronics Symposium, September 13-14, 2016, Las Vegas, Nevada; Phillip Hill covers presentations from Natgraph, MacDermid Autotype, and Intrinsiq Materials

Conference on Pervasive and Ubiquitous Computing, September 12-16, 2016, Heidelberg, Germany; In the second of two reports, Phillip Hill covers papers from Microsoft Research UK, University of Hannover, and The University of Tokyo

SID Display Week, May 22-27, 2016, San Francisco, California; In the third of four reports, Phillip Hill covers presentations from The University of Tokyo, Chiba University, NHK Science & Technology Research Laboratories/Nippon Shokubai Co. Ltd., Konica Minolta Inc., AU Optronics Corporation, LG Display Co. Ltd., Merck Chemicals Ltd., BASF SE/BASF Schweiz AG,/BASF Company Ltd/BASF New Business GmbH, Kyung Hee University, National Taiwan University/Industrial Technology Research Institute (ITRI)/Corning Incorporated, LG Display, Seoul National University, Industrial Technology Research Institute (ITRI), Tohoku University, Tianma Corporation, Chunghwa Picture Tube, and AU Optronics Corporation

Printed Electronics Europe, April 27-28, 2016, Berlin, Germany; In this second of four reports, Phillip Hill covers presentations from University of Trieste, DuPont, Electrolux Italia, and Enfucell

Large-area, Organic & Printed Electronics Convention, April 5-7, 2016, Munich, Germany; In the first of three reports, Phillip Hill covers presentations from French Alternative Energies and Atomic Energy Commission (CEA), National Research Council of Canada, Schott AG, PragmatIC Printing Ltd., NovaCentrix, and Bosch Rexroth

Etulipa developing electrowetting for public display by Bob Raikes

Flexible OLED still disrupting the display world by Guillaume Chansin

Samsung wants you to play with quantum dots by Khasha Ghaffarzadeh

Last Word: The truth is only the truth if you believe it by Chris Williams

Display Industry Calendar

Issue 101

Letter from the publisher:  Big displays from small packages...by Mark Fihn

News from around the world: V Technical Textiles, Nanyang Technological University, Pragmatic, Panasonic, Rice University, Merck, Inkron/Nagase, Harvard University, KAIST, Georgia Institute of Technology, Ames Laboratory, NTU/JTC, University of Central Florida, BOE Technology Group, Nano Dimension, E Ink/HTC/Palladio, Oak Ridge National Laboratory, University of Texas at Austin, Fujitsu Frontech/The Black Tux, University of Strasbourg, imec/Karlsruhe Institute of Technology/Zentrum für Sonnenenergie- und Wasserstoff-Forschung Baden-Württemberg, North Carolina State University, University of Pittsburgh, CYNORA/Juhua, Imec/Hasselt University, National Institute for Materials Science, SSC Pacific, AIST, CYNORA, Thin Film Electronics, Office of Naval Research, Chalmers University of Technology, UC Santa Barbara, Shenzhen Institutes of Advanced Technology, Nottingham Trent University's Advanced Textile Research Group, PragmatIC/Avery Dennison, Air Force Research Laboratory’s Materials and Manufacturing Directorate, Holst Centre/ and ENrG, and Penn State University

Pervasive and Ubiquitous Computing, September 12-16, 2016, Heidelberg, Germany; In the first of two reports, Phillip Hill covers papers from DFKI GmbH/TU Kaiserslautern/Braunschweig University of Technology, University of Minnesota, and Falmouth University

Symposium on Wearable Computers, September 12-16, 2016, Heidelberg, Germany; Phillip Hill covers papers from Technische Universität München/Universität der Künste, University of Passau/German Research Center for Artificial Intelligence/University of Boras/Sefar AG, Kobe University, and Know-Center/National University of Cuyo/Graz University of Technology

Symposium on Pervasive Displays, June 20-22, 2016, Oulu, Finland; Phillip Hill covers a paper from University of Stuttgart/LMU Munich

SID Display Week, May 22-27, 2016, San Francisco, California; In the second of four reports, Phillip Hill covers presentations from Beijing BOE Display Technology, Merck KGaA, DuPont Displays Inc., Nitto Denko Corporation, Toyobo Co. Ltd./Toyobo Taiwan Co. Ltd., Huawei Inc., AU Optronics Corporation, E Ink Corporation, LG Display, Semiconductor Energy Laboratory/Advanced Film Device Inc., University of Tokyo/JST/ERATO, National Institute of Advanced Industrial Science and Technology/Dresden University of Technology/Osaka University, NHK Science & Technology Research Laboratories, IMEC and Ghent University/Holst Centre/TNO/Panasonic Corporation, Suzhou Institute of Nanotech and Nano-bionics, Seoul National University, Semiconductor Energy Laboratory, Semiconductor Energy Laboratory, University of Stuttgart, Polyera Taiwan Corp./E.T.C. s.r.l./CNR-ISMN/Polyera Corp., X-Celeprint Inc./X-Celeprint Limited, and E Ink Corporation

Printed Electronics Europe, April 27-28, 2016, Berlin, Germany; In this first of four reports, Phillip Hill covers presentations from Identiv, TactoTek Oy, CMST, imec, and Ghent University, and CondAlign

Electronic Displays Conference, February 24-25, 2016, Nuremberg, Germany; Phillip Hill covers presentations from Schott AG, Aixtron SE/Aixtron Inc., Plastic Logic Germany, and Holst Centre

Printed Electronics USA, November 18-19, 2015, Santa Clara, California; In this final report, Phillip Hill covers presentations from Thinfilm, ULVAC Inc., Universal Display Corporation, University of Oklahoma, and XENON Corporation

Smart windows, from electrochromism to maturity by Lawrence Gasman

OLEDs can fold. So what? by Ken Werner

Can polyurethane adhesive replace conductive epoxies? by Rachel Gordon

Conductive ink-based transparent conductive films by Khasha Ghaffarzadeh

What’s hot and what’s not in printed electronics by Raghu Das

Last Word: Issue 101 -- The black hole for unwanted technology and other stuff…by Chris Williams

Display Industry Calendar

Issue 100

Letter from the publisher:  100…by Mark Fihn

News from around the world: LG Innotek, Samsung, LG Display, Smithers Apex, Gwangju Institute of Science and Technology, Universal Display/Tianma Micro-electronics, University of Wisconsin-Madison, Bilkent University, KAIST, Technavio, CPEIA/IEEE, INM – Leibniz Institute for New Materials, Thin Film Electronics/Xerox, Nano Dimension, ORNL, University of Illinois, RMIT University, Asahi Glass, Pacific Northwest National Laboratory, Kateeva, Fraunhofer ISC, Centre for Process Innovation, University of Exeter, Eindhoven University of Technology, Washington State University, University of Tokyo, Universal Display/BASF, Tel Aviv University, PeroBOOST, First Sola, EPFL, Nikolas Bentel, nVerpix, Lawrence Livermore National Laboratory, Sensor Films, National University of Singapore, Berkeley Lab, NIMS, Harvard University, Kent Displays, University of Arizona, University of Wollongong, MIT Media Lab/Microsoft Research, MIT, University of Strasbourg, AkKoLab, University of Manchester, Helmholtz-Zentrum Berlin, NEXT Biometrics/Innolux, Tufts University, SmartKem, UNIST, National Renewable Energy Laboratory, Rice University, Gemio, EXTMOS, Hokkaido University, ETRI, Sony, and Fujitsu

SID Wearable-Flexible Conference, May 25, 2016, San Francisco, California; Phillip Hill covers presentations from Olio Devices Inc, Tianma Micro-Electronics Group, and Corning Glass Technologies

SID Investors Conference, May 24, 2016, San Francisco, California; Phillip Hill covers a presentation from Kateeva

SID Touch Conference, May 24, 2016, San Francisco, California; Phillip Hill covers a presentation from Canatu

SID Business Conference, May 23, 2016, San Francisco, California; Phillip Hill covers presentations from Kateeva, and Atom Nanoelectronics

SID Display Week, May 22-27, 2016, San Francisco, California; In the first of four reports, Phillip Hill covers presentations from Princeton University, Nanoco Technologies Ltd., National Taiwan University, AU Optronics Corporation, Sun Yat-Sen University, CBRITE Inc., Chunghwa Picture Tubes/Evonik Resource Efficiency GmbH, Electronics and Telecommunications Research Institute (ETRI)/Korea Advanced Institute of Science and Technology (KAIST)/Chonbuk National University, AU Optronics Corp., Polatechno Co Ltd/Tohoku University, and Kunshan Govisionox Optoelectronics Co.

Printed Electronics USA, November 18-19, 2015, Santa Clara, California; In the fifth of five reports, Phillip Hill covers presentations from Parker Hannifin, Poly-Ink, Ricoh Company, and Sung An Machinery Co. Ltd.

SGIA Printed Electronics Symposium, November 3-4, 2015, Atlanta, Georgia; Phillip Hill covers presentations from Raytheon-UMass Lowell Research Institute (RURI), DuPont, Asada Mesh Co. Ltd., and Molex

Why displays won’t be really flexible and why it doesn't matter by Norbert Hildebrand

Graphene for the display market by Ron Mertens

Conductive inks: big players forced to go niche by Khasha Ghaffarzadeh

Last Word: 100 editions and going strong! by Chris Williams

Display Industry Calendar

Issue 99

Letter from the publisher:  Curves…by Mark Fihn

News from around the world: IBS, Ohio State University, Tokyo University, University of Wisconsin-Madison, Northwestern University, Schott, MIT, INM, Microsoft, Hong Kong Polytechnic University, Pohang University of Science and Technology/Gyungsang National University, MC10/PCH, Linköping University/CAS, Kyushu University, University of Illinois at Urbana-Champaign, Arovia, University of Twente, Fujitsu Frontech, Haydale, Visionect/E Ink, NextFlex, Juelich, IHS, Sheffield University, FlexTech/ENrG/nScrypt/PARC, EPFL, KAUST, University of Maryland, Heraeus, OE-A, PragmatIC, Flex-o-Fab, Forbes, Fraunhofer ISC, PI-SCALE, Thinfilm/Hopsy, University of Connecticut, UCSD, Asahi Glass, Sensor Films, E Ink, Harvard, Penn State, ANU, Disney Research/ETH Zurich, University of Maryland, BeBop, University of Wisconsin-Madison, University of Surrey, Solliance, Cartamundi/imec/Holst Centre, and Lenovo

CSCW, February 27–March 2, 2016, San Francisco, California; Phillip Hill covers papers from ASUS Design Center, and University of Minnesota

Augmented Human International Conference, February 25-27, 2016, Geneva, Switzerland; Phillip Hill covers papers from University of Freiburg, University of Lapland/University of Oulu, Kobe University, and MIT Media Lab

Tangible Embedded and Embodied Interaction, February 14-17, 2016, Eindhoven, Netherlands; In the second of two reports, Phillip Hill covers papers from Eindhoven University of Technology, Bauhaus-Universität Weimar/Westfälische Wilhelms-Universität Muenster, Wellesley College, and University of Southern Denmark/BTK University of Art and Design/LEAP Technology ApS

Printed Electronics USA, November 18-19, 2015, Santa Clara, California; In the fourth of five reports, Phillip Hill covers presentations from ISORG, Kateeva, Nano Carbon, and NovaCentrix

OLEDs World Summit, October 27-29, 2015, Berkeley, California; In the fourth of four reports, Phillip Hill covers presentations from OLEDWorks, Corning, SAES, and Sinovia Technologies

New and future markets for thin-film batteries by Lawrence Gasman

Polar OLED has solved printing problem by Tom Allen

Will conductive inks help wearables go truly wearable? by Khasha Ghaffarzadeh

Plastic and flexible OLED displays market to reach $18bn by 2020 by Guillaume Chansin

Checking the flavor of the Kool-Aid by Bob Raikes

Last Word: Are we in or are we out? Will anyone notice? by Chris Williams

Display Industry Calendar

Issue 98

Letter from the publisher:  Of cameras and guns…by Mark Fihn

News from around the world: EPFL, Iowa State University, Ocean University of China/Yunnan Normal University, Center for Nanoparticle Research, Australian National University, NASA, Panasonic/Solliance, University of Kentucky, Transparent Electrodes for Large Area Large Scale Production of Organic Optoelectronic Devices, Kansas State University, KTH Royal Institute of Technology, Constantia Flexibles/Thinfilm. FlexEnable/ISORG, Toray Plastics, Barcelona Institute of Science and Technology, Umeå University, East China University of Science and Technology/Shanghai Jiao Tong University, Technical University of Munich, Moscow State University, NANO-JETS, Kyushu University, University of Surrey, University of Alberta, Brown University, Cornell University, TU Wien, MIT, KAUST, UC Berkeley, n-tech Research, University of Tokyo, Solar-Tectic, TUE, University of Sheffield/Novalia, Oxford University/Cambridge University, Dartmouth College, and Ohio State University

LOPEC 2016: Printed electronics summary; April 5-7, 2016, Munich Germany

Tangible Embedded and Embodied Interaction; February 14-17, 2016, Eindhoven, Netherlands; In the first of two reports, Phillip Hill covers papers from Sheffield Hallam University, Technology University of Eindhoven/ALISSA+NIENKE Design Studio, Queen’s University/University of Copenhagen/Immersion Canada Corporation, and Bauhaus-Universität Weimar

Printed Electronics USA; November 18-19, 2015, Santa Clara, California; In the third of four reports, Phillip Hill covers presentations from Mississippi State University, NanoXplore, Heraeus Electronics, and Imec

Touch Gesture Motion and Emerging Displays; November 12-13, 2015, San Jose, California; In the second of two reports, Phillip Hill covers presentations from Light Polymers, Universal Display Corporation, and FlexEnable

User Interface Software and Technology; November 8-11, 2015, Charlotte, North Carolina; In the third of three reports, Phillip Hill covers papers from University of Toronto, MIT Media Lab (x2), and National Taiwan University/Keio University

OLEDs World Summit; October 27-29, 2015, Berkeley, California; In the third of four reports, Phillip Hill covers presentations from Aixtron SE, Konica Minolta Inc., and OTI Lumionics

Plastic Electronics Conference; October 6-8, 2015, Dresden, Germany; In the third of three reports, Phillip Hill covers presentations from Oxford Lasers Ltd., Cambridge Display Technology Ltd., and Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP

Drivers for multifunctional coatings and surfaces by Lawrence Gasman

Worldwide market for conductive inks, pastes to grow 22% by 2026 by Khasha Ghaffarzadeh

Flexible, printed and thin film batteries: A new era for energy storage by Xiaoxi He

Boogie Board Sync: More than meets the eye by Ken Werner

A few bits from Smithers…by Dan Rogers

Last Word: Virtual Reality: Will this be the end of the FPDs as we know it? by Chris Williams

Display Industry Calendar

Issue 97

Letter from the publisher:  Car wraps…by Mark Fihn

News from around the world: Toyohashi University, Pohang University of Science and Technology, Visionox, University College London, University of Alberta, WestRock/T+ink, Universal Display, ITMO University, Heliatek, Orbotech/Nippon Mektron, Displaydata, Brookhaven National Laboratory, Aalto University, Queens University, Moscow Institute of Physics and Technology, Technical University of Munich, University of Hong Kong, University of Utah, ICN2 NanoBioelectronics and Biosensors Group, Withings, Maingear, Ecole Polytechnique Fédérale de Lausanne, PI-SCALE, BOE Display, Nagase/Inkron, IHS, FlexEnable, Woodford Investment Management/Thinfilm, and IDTechEx

Printed Electronics USA, November 18-19, 2015, Santa Clara, California; In the second of four reports, Phillip Hill covers presentations from Eight19, EMD Performance Materials, and London College of Fashion

Interactive Tabletops and Surfaces, November 15-18, 2015, Funchal, Portugal; Phillip Hill covers papers from University of Bristol, Lancaster University, and University of Central Lancashire/Thomas Buchanan Ltd.

Touch Gesture Motion/Emerging Display Technologies, November 12-13, 2015, San Jose, California; In the first of two reports, Phillip Hill covers presentations from Canatu, Kateeva, Applied Materials, and Polyera

User Interface Software and Technology, November 8-11, 2015, Charlotte, North Carolina; In the second of three reports, Phillip Hill covers papers from Keio University/MIT Media Lab/JST PRESTO, Carnegie Mellon University, Max Planck Institute for Informatics, and MIT Media Lab

SIGGRAPH Asia, November 2-5, 2015, Kobe, Japan; Phillip Hill covers papers from University of Canterbury, and Keio University

OLEDs World Summit, October 27-29, 2015, Berkeley, California; In the second of four reports, Phillip Hill covers presentations from TCL Corporate Research, Merck KGaA, and Kateeva

Plastic Electronics Conference, October 6-8, 2015, Dresden, Germany; In the second of three reports, Phillip Hill covers presentations from CRM Group, Fraunhofer Institute for Organic Electronics, Electron Beam, Plasma Technology (FEP), Encapsulix SAS, and Aixtron SE

SIGGRAPH, August 9-13, 2015, Los Angeles, California; Phillip Hill covers a paper from Hasselt University

SID International Symposium, June 2-5, 2015, San Jose, California; In this final report, Phillip Hill covers papers from imec/Katholieke Universiteit Leuven/Holst Centre/Panasonic Corporation, BOE Ordos Yuansheng Optoelectronics, Fraunhofer Institute for Organic Electronics, Electron Beam, and Plasma Technology FEP/DTF Technology GmbH, University of Central Florida, Chunghwa Picture Tubes, and National Tsing-Hua University/WiseChip Semiconductor Inc.

Future opportunities for metamaterials in aerospace and defense markets by Lawrence Gasman

NextFlex: America’s flexible hybrid electronics institute by Paul Semenza

Printed and flexible electronics in vehicles: A $5.5 billion opportunity in 2026 by Harry Zervos

Are e-textiles on the cusp of rapid growth? by James Hayward

Last Word: Innovation for innovation’s sake can be dumber than dumb! by Chris Williams

Display Industry Calendar

Issue 96

Letter from the publisher:  Phagraphene…by Mark Fihn

News from around the world: Allied Market Research, Linköping University, Transport for London, Oregon State University, Monash University, MIT, University of Warwick, Thinfilm, ShiftWear, University of Pennsylvania, Oak Ridge National Laboratory, infinityPV, University of Manitoba, University of Twente, State University of New York at Binghamton, University of Manchester, Case Western Reserve University, Penn State, TU Munich, University of Illinois, Fundamental Research on Matter, Panasonic, University of Cambridge, Graphene-Flagship, RIKEN Center for Emergent Matter Science/Kyoto University, Kent State University/Kyoto Institute of Technology, Pixelligent, Moscow Institute of Physics and Technology/Landau Institute for Theoretical Physics, Dow/DuPont, Nectro, University of Cyprus/Cyprus University of Technology/University of Crete, and Indiana University

Printed Electronics USA, November 18-19, 2015, Santa Clara, California; In the first of four reports, Phillip Hill covers presentations from Acuity Brands Lighting Inc., Agfa Gevaert, Blue Spark Technologies, and BTU International

Product pictures from Printed Electronics USA

International Conference on Multimodal Interaction, November 9-13, 2015, Seattle, Washington; Phillip Hill covers a paper from University of British Columbia

User Interface Software and Technology, November 8-11, 2015, Charlotte, North Carolina; In the first of two reports, Phillip Hill covers papers from Disney Research/University of British Columbia, McGill University, and MIT Media Lab

OLEDs World Summit, October 27-29, 2015, Berkeley, California; In the first of four reports, Phillip Hill covers presentations from Fraunhofer Institute for Organic Electronics, Electron Beam, Plasma Technology (FEP), Pixelligent, Sungkyunkwan University, and Osram

Plastic Electronics Conference, October 6-8, 2015, Dresden, Germany; In the first of two reports, Phillip Hill covers presentations from FlexEnable, PragmatIC Printing, PrintoCent VTT Technical Research Centre of Finland, and X-Celeprint

SID International Symposium, June 2-5, 2015, San Jose, California; In the fourth of four reports, Phillip Hill covers papers from Peking University, Zeon Corporation, Korea Advanced Institute of Science and Technology (KAIST)/ Kolon Glotech Inc., Sun Yat-Sen University/SYSU-CMU Shunde International Joint Research Institute/Shanghai Jiao Tong University/National Chiao Tung University, ATOM NanoElectronics, Samsung Display, Kanazawa Institute of Technology, Korea University, and BOE Technology

Image Quality and System Performance, February 8-12, 2015, San Francisco, California; Phillip Hill covers presentations from Purdue University/Hewlett-Packard Company, and Lexmark International Inc.

Key players advancing smart textiles by Lawrence Gasman

Carbon Nanotubes: Markets, Technologies and Opportunities 2015-2025 by Khasha Ghaffarzadeh

Displays at the Printed Electronics USA Conference by Phillip Wright

Printing and vacuum deposition: Market share in the flexible electronics sector by Harry Zervos

How to make batteries flexible by Xiaoxi He

Last Word: One step at a time! by Chris Williams

Display Industry Calendar

Issue 95

Letter from the publisher:  Novel ideas…by Mark Fihn

News from around the world: University of Wisconsin-Madison, Fraunhofer ISC, HZB, Haydale, OLEDWorks, US Naval Research Laboratory, Nanjing University, Institute of the Lagoon, Harvard, Thinfilm Electronics, KAUST, 3M/Lotus Applied Technology, University of Texas, Binghamton University, University of California, San Diego, Palladio, Nano Dimension, FlexTech Alliance, DuPont Displays, LG Display, Everdisplay, Applied Materials, BOE/EDO/Truly, Flexbright, Russian Nanotechnologie/Nanomaterials Centre of the Republic of Moldova, FlexEnable, Samsung, Transparency Market Research, HZB/University of Rostock, Purdue University, imec/Kaneka, Canadian Printable Electronics Industry Association/National Research Council of Canada, Organic and Printed Electronics Industry, Pixelligent, National Renewable Energy Laboratory, University of Glasgow, Pohang University of Science and Technology, Xaar/Lawter, Stanford Technology, Cambridge Graphene, IDTechEx, University of Cambridge/Novalia, Nano Dimension, University of Twente, Empa, and LG Electronics

SID International Symposium, June 2-5, 2015, San Jose, California; In the third of four reports, Phillip Hill covers papers from Advanced Film Device Inc/Semiconductor Energy Laboratory Co Ltd, LG Display, BOE Technology Group, AU Optronics Corporation, LG Display, NHK Science & Technology Research Laboratories, E Ink Holdings Inc, AUO Corporation, BOE Technology Group, AU Optronics Corp., Panasonic Corporation/Holst Centre/TNO/imec/Ghent University, Shenzhen China Star Optoelectronics Technology, Dong-A University/LG Display/Han-Yang University, Sichuan University, University of Waterloo/V-Technology, and JX Nippon Oil & Energy Corporation

FlexTech Alliance Conference, February 23-26, 2015, Monterey, California; In this final report, Phillip Hill covers presentations from E Ink Corporation, EMD Performance Materials, Henkel, and Kent Displays

LOPE Conference for the Printed Electronics Industry, March 3-5, 2015, Munich, Germany; In the fourth of four reports, Phillip Hill covers presentations from Merck Chemicals Ltd, CDT, Fraunhofer Institute for Process Engineering and Packaging (Fraunhofer IVV)/Fraunhofer Institute for Silicate Research (Fraunhofer ISC)/Amcor Flexibles Kreuzlingen AG/SAES Getters S.p.A./DuPont Teijin Films/BELECTRIC OPV GmbH, Swansea University, Niederrhein University of Applied Sciences, Empa Swiss Federal Laboratories for Material Science and Technology/Sefar AG/ROWO Coating Gesellschaft für Beschichtung GmbH/Fraunhofer Institute for Solar Energy Systems ISE/Ecole Polytechnique Fédéral de Lausanne, and Heraeus Noblelight Ltd./ DZP Technologies Ltd.

The rise of multi-functional materials by Lawrence Gasman

Top trends at the IDTechEx Printed Electronics show by Raghu Das

Perovskite photovoltaics excitement by Peter Harrop

Exploring the potential for printed LEDs by Phillip Wright

Printing Money by David Barnes

Printing and vacuum deposition: Market share in the flexible electronics sector by Harry Zervos

A few bits from Smithers…by John Nelson and Dan Rogers

Last Word: Never mind Power to the people! by Chris Williams

Display Industry Calendar

Issue 94

Letter from the publisher:  Foldable…by Mark Fihn

News from around the world: Northwestern University, Washington State University, St. Mary’s College, Holst Center, FlexTech Alliance, Pohang University, National Chiao Tung University, University of Texas, Ralph Lauren, Georgia Tech, PolyPhotonix, Lawrence Berkeley National Laboratory, University of California Berkeley, MIT, University of Michigan, University of Houston, Department of Energy's SLAC National Accelerator Laboratory/Stanford University, Molex/Soligie, DuPont Displays, IDTechEx, University of Cambridge, IHS, Toyohashi University, Polyera, University of Twente, 3M/Lotus Applied Technology, and NCSU

Conference on Ubiquitous Computing, September 7-11, 2015, Osaka, Japan; Phillip Hill covers papers from The University of Tokyo/Microsoft Research/Mitsubishi Paper Mills, and The University of Tokyo/Microsoft Research

Human-Computer Interaction with Mobile Devices, August 24-27, 2015, Copenhagen, Denmark; Phillip Hill covers papers from Chalmers University of Technology/University of Maryland, and Technische Universitat Dresden

SID International Symposium, June 2-5, 2015, San Jose, California; In the second of four reports, Phillip Hill covers papers from Advanced Film Device Inc./Semiconductor Energy Laboratory Co., AU Optronics Corporation, Tohoku University, Shanghai Jiao Tong University/South China University of Technology/National Chiao Tung University, Kyung Hee University, University of California/Wuhan University, Toshiba Corporation, Kymeta Corporation, Samsung Electronics/Samsung Display/Yonsei University, Sharp Corporation, and Kyung Hee University

SID Investors Conference, June 2, 2015, San Jose, California; Phillip Hill covers presentations from Kateeva, CBRIGHT, and Innova Dynamics

SID Business Conference, June 1, 2015, San Jose, California; Phillip Hill covers a presentation from EDO

Printed Electronics Europe, April 28-29, 2015, Berlin, Germany; In the fourth of four reports, Phillip Hill covers presentations from PragmatIC Printing, Dow Chemical Company, and Thin Film Electronics

LOPE Conference for the Printed Electronics Industry, March 3-5, 2015, Munich, Germany; In the third of four reports, Phillip Hill covers presentations from Konkuk University, SPGPrints BV/Holst Centre/TNO, University of Manchester, Hochschule der Medien, crystalsol GmbH, Scrona, and Sensor Films Inc.

FlexTech Alliance Conference, February 23-26, 2015, Monterey, California; In the fourth of four reports, Phillip Hill covers presentations from DuPont Teijin Films, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP/Corning Incorporated/DTF Technology GmbH, National Research Council Canada, Applied Materials WEB Coating GmbH, and SAES Group Corporate Business Development – Functional Polymer Composites

The evolving building integrated photovoltaics market by Lawrence Gasman

Flexible batteries market to reach $400 million in 2025 by Raghu Das

DuPont Displays’ target: a $1000 OLED-TV by 2020 by Ken Werner

Flexible sensors come to market thanks to tens of millions of investment by Guillaume Chansin

Flexible encapsulation to enable flexible electronics by Harry Zervos

A few bits from Smithers…by John Nelson and Dan Rogers

Last Word: Never mind “Grand Theft Auto” – we’ve got “Carmageddon!” by Chris Williams

Display Industry Calendar

Issue 93

Letter from the publisher:  Stretch goals…by Mark Fihn

News from around the world: University of Tokyo, EPFL, Technische Universität München, Australian National University, Pixelligent, Riken, LG Display, University of Illinois, Sharc25, UNIST, KAIST, Merck/Nano-C, New Era, Exeter University, University of Wisconsin-Madison, KAUST, University of Central Florida, University of Texas Dallas, Visionox, Plessey, Samsung Advanced Institute of Technology/Seoul National University, Karlsruhe Institute of Technology, Light Polymers, Oregon State University, AGC, Penn State, University of California San Diego, Imec, Kyoto University, University of Maryland, NRL, and University of Wollongong

SID Wearable-Flexible Market Focus Conference, June 4, 2015, San Jose, California; Phillip Hill covers a presentation from IHS

SID Touch Market Focus Conference, June 3, 2015, San Jose, California; Phillip Hill covers presentations from Nuovo Film Inc., Canatu, and Suzhou Institute of Nanotech/O-Film Technology

SID International Symposium, June 2-5, 2015, San Jose, California; In the first of four reports, Phillip Hill covers papers from Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology/Fraunhofer Institute for Process Engineering and Packaging/Fraunhofer Institute for Silicate Research/Fraunhofer Institute for Applied Polymer Research, Nokia Technologies/VTT Technical Research Centre of Finland/VTT Technical Research Centre of Finland, IMEC/FUJIFILM Electronic Materials (Europe) N.V./FUJIFILM Corporation/Holst Centre, CEREBA, Kent Displays, Semiconductor Energy Laboratory/Advanced Film Device Inc., CBRITE Inc, LG Display R&D Center/Korea University, Panasonic Corporation/Chiba University, Merck KGaA, Delft University of Technology/Japan Advanced Institute of Science and Technology, Thin Film Electronics Inc., IMEC/KU Leuven/TNO/Holst Centre/Panasonic Corporation, and E Ink Holdings Inc.

Printed Electronics Europe, April 28-29, 2015, Berlin, Germany; In the third of four reports, Phillip Hill covers presentations from IIT Bombay, ISORG, and Kimoto Tech Inc.

World Congress of Smart Materials, March 23-25, 2015, Busan, South Korea; In the third of three reports, Phillip Hill covers presentations from Sungkyunkwan University, University of Twente, Institute of Physics, Kyungpook National University, Skolkovo Institute of Science and Technology, LIG Sciences Inc., Japan Aerospace Exploration Agency, Japan Atomic Energy Agency, Yamagata University, University of Cambridge, King Abdulaziz City for Science and Technology, Jilin University, RWTH Aachen University, Sungkyunkwan University, Yonsei University, Lawrence Livermore National Laboratory

LOPE Conference for the Printed Electronics Industry, March 3-5, 2015, Munich, Germany; In the second of four reports, Phillip Hill covers presentations from Brno University of Technology, IOLITEC GmbH, The Hebrew University of Jerusalem, Arjowiggins Creative Lab, and University of Oxford/University of Manchester/Bangor University

FlexTech Alliance Conference, February 23-26, 2015, Monterey, California; In the third of four reports, Phillip Hill covers presentations from Thin Film Electronics, National Research Council Canada, Linde Nanomaterials, and Corning Inc.

Machine Vision Applications, February 8-12, 2015, San Francisco, California; Phillip Hill covers presentations from Rochester Institute of Technology/Applied Materials, and Gjøvik University College

Measuring, Modeling, and Reproducing Materials, February 8-12, 2015, San Francisco, California; In the second of two reports, Phillip Hill covers presentations from Université Jean Monnet de Saint-Etienne/Institut d’Optique/Lembart S.A.S., Mines ParisTech/Centrale Supélec, Université Jean Monnet de Saint Etienne/Institut d’Optique/Université Paris-Sud/Nankai University, and Technische Universität Darmstadt/OCE Print Logic Technologies/Télécom ParisTech/Fraunhofer Institute for Computer Graphics Research IGD

Plastic Electronics, October 7-9, 2014, Grenoble, France; In the fourth of four reports, Phillip Hill covers presentations from Piezotech, Fraunhofer IZM, and CEA LITEN

New battlegrounds for conductive inks and pastes by Khasha Ghaffarzadeh

A few bits from Smithers…by John Nelson and Dan Rogers

Last Word: 3D printing? Beaten to it by a few hundred thousand years! by Chris Williams

Display Industry Calendar

Issue 92

Letter from the publisher:  Government handouts…by Mark Fihn

News from around the world: Delft University of Technology, Pi Supply, Karlsruhe Institute of Technology, LG Display, Ricoh, University of Wisconsin-Madison/US Department of Agriculture Forest Products Laboratory, KTH Royal Institute of Technology, Google/Levi, Thin Film Electronics, Samsung Display, Photek/Arradiance, HZB, University of Washington, Optomec/Semitronics, Linköping University, Thin Film Electronics/World Customs Organization, Nanotech, Fujifilm/imec, Centre for Process Innovation/Beneq, Arizona State University, DuPont Displays/Kateeva, North Carolina State University, Tufts University, Thinfilm Electronics/FlexTech Alliance, Technische Universität München, AT&T, Laser Zentrum Hannover, Genes’Ink/CEA, OE-A, Northwestern University, Tel Aviv University, IDTechEX, Brown University, University of Wollongong, University of Bristol, KAIST, Seoul National University, Columbia University, MIT, Binghamton University, and Imec

Printed Electronics Europe, April 28-29, 2015, Berlin, Germany; In the second of four reports, Phillip Hill covers presentations from DuPont (UK) Limited, Dyesol, and Electrolux Italia SpA

World Congress of Smart Materials, March 23-25, 2015, Busan, South Korea; In the second of three reports, Phillip Hill covers presentations from The University of Nottingham Malaysia Campus, Lodz University of Technology, Uppsala University, Tohoku University, University of California Berkeley/Lawrence Berkeley National Laboratory, Jiangnan Institute of Graphene, Max Planck Institute for Polymer Research, Incheon National University, Jiangnan Graphene Research Institute, Reactive Metals Ltd., York University, San Francisco State University, Korea Advanced Institute of Science and Technology, RWTH Aachen University, Yonsei University, Delft University of Technology, and Università di Pisa

LOPE Conference for the Printed Electronics Industry, March 3-5, 2015, Munich, Germany; In the first of four reports, Phillip Hill covers presentations from Universal Display Corporation, PragmaticIC Printing Ltd, SmartKem Ltd, FlexEnable, Novacentrix, nTact, and TSE Troller AG

FlexTech Alliance Conference, February 23-26, 2015, Monterey, California; In the second of four reports, Phillip Hill covers presentations from University of California Berkeley, Holst Centre, Lucintech Inc/University of Toledo/Corning Incorporated, and Polyera

Measuring, Modeling, Reproducing Materials, February 8-12, 2015, San Francisco, California; In the first of two reports, Phillip Hill covers presentations from Universitat Bonn, Gjøvik University College/Chiba University, University of Minnesota/General Motors Company/Ford Motor Company/3DEXCITE, and Italian National Research Institute for Metrology

Displaying, Processing, Hardcopy, and Applications, February 8-12, 2015, San Francisco, California; Phillip Hill covers presentations from University of the West of England, Gjøvik University College, University of Shanghai for Science and Technology/Shanghai Maritime University, Ecole Polytechnique Fédérale de Lausanne (EPFL), Gjøvik University College, and Purdue University/Hewlett-Packard Indigo Division/Hewlett-Packard Laboratories USA

Tangible, Embedded and Embodied Interaction, January 15-19, 2015, Stanford, California; In the second of two reports, Phillip Hill covers papers from University of Technology Sydney, OCAD University, Purdue University, and Sungkyunkwan University

Plastic Electronics, October 7-9, 2014, Grenoble, France; In the third of four reports, Phillip Hill covers presentations from Universal Laser Systems Inc., Applied Materials Web Coating GmbH, Ghent University, and Corning

Consumer Electronics markets: An early market opportunity for self-healing materials by Lawrence Gasman

The printed electronics industry gets going by Raghu Das

A few bits from Smithers…by John Nelson and Dan Rogers

Last Word: So what about Blue Sky computing? by Chris Williams

Display Industry Calendar

Issue 91

Letter from the publisher:  The future of design…by Mark Fihn

News from around the world: Universities of Wisconsin-Madison and Chicago, VTT Technical Research Centre, Northwestern University, iShuu Tech/E Ink, FlexTech Alliance, Berkeley Lab, Rayton, Aixtron/PlasmaSi, Fraunhofer ISC, Kansas State University, Stanford University, ElectricFilm, University of Houston, Rice University, Purdue University, McMaster University, Tel Aviv University, Hanyang University, Haydale, Fudan University, European Grapheme Flagship, ReportsnReports, and University of Exeter

Printed Electronics Europe, April 28-29, 2015, Berlin, Germany; In the first of four reports, Phillip Hill covers presentations from Agfa Materials, Aixtron SE/Aixtron Inc, BotFactory, and DuPont Teijin Films

Europe's largest event on Printed Electronics, Additional highlights, by Raghu Das

Intelligent User Interfaces, March 29 - April 1, 2015, Atlanta, Georgia; Phillip Hill covers a paper from Pontifical Catholic University of Rio de Janeiro

World Congress of Smart Materials, March 23-25, 2015, Busan, South Korea; In the first of two reports, Phillip Hill covers presentations from Society of Vacuum Coaters (SVC), National University of Science and Technology, Nanjing University of Science and Technology, and Sungkyunkwan University

Image Sensors, March 17-19, 2015, London, England; Phillip Hill covers a presentation from Schott AG

CSCW, March 14-18, 2015, Vancouver, British Columbia; Phillip Hill covers a presentation from Microsoft Research/University of Wisconsin

Augmented Human International Conference, March 9-11, 2015, Singapore; Phillip Hill covers presentations from Keio University, Chulalongkorn University, University of Electro-Communications/Joshibi University of Art and Design, and Chalmers University of Technology/University of Gothenburg

Electronic Displays Conference, February 25-26, 2015, Nuremberg, Germany; Phillip Hill covers presentations from Optical Filters, and VIA Optronics Group

FlexTech Alliance Conference, February 23-26, 2015, Monterey, California; In the first of four reports, Phillip Hill covers presentations from GE Global Research, University of California Berkeley, Sungkyunkwan University (SKKU), FlexEnable, Soligie, Universal Display Systems, and SMIT Ovens BV

Tangible, Embedded and Embodied Interaction, January 15-19, 2015, Stanford, California; In the first of two reports, Phillip Hill covers papers from University of California Berkeley, Queen’s University (x2), and Purdue University

User Interface and Technology Symposium, October 5-8, 2014, Honolulu, Hawaii; In the second of two reports, Phillip Hill covers presentations from NTT DOCOMO, KAIST, and University of California Berkeley/Berkeley Unified School District

Human-Computer Interaction, September 23-26, 2014, Toronto, Ontario; Phillip Hill covers a paper from Carleton University

SSL Ecosystem Conference, September 22-24, 2014, Cambridge, Massachusetts; Phillip Hill covers a presentation from Acuity Brands

SID Display Week, June 1-6, 2014, San Diego, California; In the fourth of four reports, Phillip Hill covers papers from 3M Company, BOE Technology Group, University of Michigan/Guardian Industries Corporation Science and Technology Center, Lehigh University/Alcoa Technical Center, Hoseo University/NDIS Corporation/Samsung Electronics, AU Optronics Corporation, BOE Technology Group Corporation, Academia Sinica/National Taiwan University, and AU Optronics Corporation

LOPE Conference for the Printed Electronics Industry, May 26-28, 2014, Munich, Germany; In the third of three reports, Phillip Hill covers presentations from Novaled GmbH/Plastic Logic, Centre for Process Innovation, American Semiconductor Inc., VTT Technical Research Centre of Finland, DuPont Teijin Films, Bar-Ilan University, DuPont (UK) Limited, InovisCoat GmbH, Promethean Particles Ltd/Fraunhofer Institute for Integrated Systems and Device Technology IISB, and Cetemmsa

Wearable power limits pose display challenges by Bob O'Donnell

Consumer Electronics: The next frontier for thin batteries? by Lawrence Gasman

Last men standing in OLED by Khasha Ghaffarzadeh

A few bits from Smithers…by John Nelson and Dan Rogers

Last Word: Stop the wrld – I thnk I wnt to get off! by Chris Williams

Display Industry Calendar

Issue 90

Letter from the publisher:  Glow-in-the-dark…by Mark Fihn

News from around the world: E Ink, University of Texas, Australian National University/University of Wisconsin, VTT Technical Centre of Finland, Thin Film Electronics, Universal Display/Sumitomo Chemical, University of California Berkeley, NanoMarkets, Leibniz Institute for New Materials, Northwestern University, Rice University, BEAM, University of Melbourne/Holst Centre/Flex-o-Fab, Royole Corp, Universal Display/LG Display, PragmatIC Printing, University of Berkeley/Centre for Materials Physics,Spanish National Research Council/UPV/EHU (University of the Basque Country, Plastic Logic/FlexEnable, Stanford, Hyperflex, Swyp, Nanotech Security, University of Valencia, Hanyang University, Voltera, Trinity College Dublin, UC San Diego, Graphenea, Kateeva, Tsinghua University, US Department of Energy Lawrence Berkeley National Lab, GE Global Research, University of Manchester/University of Sheffield, Cambrios, XENON, Canadian Printable Electronics Industry Association/Continental Automated Buildings Association, Merck/FlexEnable, Apple, Rayton, Hanyang University, Sensor Films/Xerox, Visionect, Kyungpook National University, University of Toronto, Philips, Transparent Electrodes for Large Area Large Scale Production of Organic Optoelectronic Devices, Blu, Touch Display Research, UC Berkeley, University of Pennsylvania, Institute of Optoelectronics Systems and Microtechnology from the Universidad Politécnica de Madrid, CiQUS, Purdue University, Fraunhofer Institute for Silicate Research, Caltech, Brown University, Diageo/Thinfilm/Cartamundi, Van Genechten Packaging/PragmatIC/SMARTRAC/TNO/imec, OLEDWorks/Universal Display Corporation, Sungkyunkwan University/University of Wollongong, Natcore, Kyushu University, Future Market Insights, University of Tokyo, and Georgia Tech

Conference on Interactive Tabletops and Surfaces, November 16-19, 2014, Dresden, Germany; Phillip Hill covers papers from Technische Universität Dresden (x2), Rakuten Institute of Technology, and Madeira-ITI/WowSystems LLC

Plastic Electronics, October 7-9, 2014, Grenoble, France; In the second of four reports, Phillip Hill covers presentations from Ynvisible, Roth & Rau BV, Joanneum Research Forschungsgesellschaft mbH, and EPSRC Centre for Innovative Manufacturing in Large-Area Electronics

SID Symposium on Vehicle Displays and Interfaces, October 23-24, 2014, Dearborn, Michigan; Phillip Hill covers presentations from GrafTech International, and Opalux Inc.

User Interface Software and Technology, October 5-8, 2014, Honolulu, Hawaii; Phillip Hill covers presentations from University of Applied Sciences Upper Austria/Microsoft Research/Joanneum Research, Keio University/Nagoya Institute of Technology/The University of Tokyo, Saarland University, and University of California

LOPE Conference for the Printed Electronics Industry, May 26-28, 2014, Munich, Germany; In the second of three reports, Phillip Hill covers presentations from Istituto ENI Donegani/Technical Research Centre of Finland VTT, Ecole Polytechnique Fédérale de Lausanne (EPFL)/Zurich University of Applied Sciences (ZHAW)/Sensirion AG, Industrial Technology Research Institute (ITRI), HSG-IMAT/University Medical Center Magdeburg/ifak system GmbH/Orthofit Schuhtechnik GmbH, Tomas Bata University, VTT, Holst Centre, IBS Precision Engineering, Fraunhofer Research Institution for Organics, Materials and Electronic Devices COMEDD, Nokia Research Centre, UC Berkeley, and nTact

The 2015 market for solar PV in four questions by Harry Zervos

A few bits from Smithers…by Dan Rogers and John Nelson

Last Word: An Apple a day: That’s what the doctor ordered! by Chris Williams

Display Industry Calendar

Issue 89

Letter from the publisher:  The coming boom market for flexible electronics…by Mark Fihn

News from around the world: Eight19, Seoul National University, VDMA, Lux Research, IDTechEx, University of Pennsylvania, North Carolina State University, Drexel University, Georgia Institute of Technology, University of Cincinnati, Rice University, King Abdullah University of Science and Technology, Holst Centre, Corning, Hana Micron, North Carolina State University, Purdue, Holst Centre/Imec, Azerbaijan Investment Company/Sumgait Chemical, Murata, EPFL, Armor/Cambrios, DuPont Microcircuit Materials, Kateeva, University of Toronto, KAIST, SmartKem, UC Berkeley, Tohoku University, Université Laval, Razer, and R&D Core

Touch Gesture Motion Conference, October 28-30, 2014, Austin, Texas; Phillip Hill covers a presentation from Cambrios

Plastic Electronics, October 7-9, 2014, Grenoble, France; In the first of four reports, Phillip Hill covers presentations from Plastic Logic, STMicroelectronics, Philips Research, and Soligie

OLEDs World Summit, September 16-18, 2014, Berkeley, California; In the third of three reports, Phillip Hill covers presentations from Solvay OLED, Sumitomo Chemical, Universal Display Corporation, and University of Southern California

Ubicomp, September 13-17, 2014, Seattle, Washington; Phillip Hill covers papers from Purdue University, University of Colorado, German Research Center for Artificial Intelligence (DFKI), National Taiwan University, École Polytechnique Fédérale de Lausanne (EPFL)/University of Lausanne, and Purdue University

International Symposium on Wearable Computers, September 13-17, 2014, Seattle, Washington; In the third of three reports, Phillip Hill covers papers from Nagoya University, University of Minnesota, University of Applied Sciences and Arts Western Switzerland/University of Fribourg, and The Open University

Image Sensors Automotive Conference, June 17-18, 2014, Brussels, Belgium; Phillip Hill covers a presentation from Invenios

Advanced Visual Interfaces, May 27-30, 2014, Como, Italy; Phillip Hill covers a presentation from KAIST/IBM Research/Singapore Management University

LOPE Conference for the Printed Electronics Industry, May 26-28, 2014, Munich, Germany; In the first of three reports, Phillip Hill covers presentations from PARC, Merck Performance Materials, Thin Film Electronics ASA, Holst Centre, Heraeus, VTT Technical Research Centre of Finland, Bar-Ilan University, KIT (Karlsruher Institut fur Technologie), Singapore Institute of Manufacturing Technology, and KTH

Image Sensors, March 18-20, 2014, London, England; Phillip Hill covers a presentation from ISORG

Augmented Human International Conference, March 7-9, 2014, Kobe, Japan; Phillip Hill covers presentations from The University of Tokyo/University of Electro-Communications, National Taiwan University/Academia Sinica, and Kobe University

Measuring, Modeling, and Reproducing Materials, February 2, 2014, San Francisco, California; Phillip Hill covers presentations at this SPIE conference from Mid Sweden University, University of the West of England, and Cornell University

Image Processing: Algorithms and Systems, February 2, 2014, San Francisco, California; Phillip Hill covers a presentation from University of Rome

Machine Vision Applications, February 2, 2014, San Francisco, California; Phillip Hill covers a presentation at this SPIE conference from Ricoh Production Print Solutions

LOPEC 2015: Interview with Wolfgang Mildner, LOPEC General Chair

Wear it, drive it, watch it – WOW, it’s coming by Andy Marken

A few bits from Smithers…by Dan Rogers and John Nelson

Last Word: Well, oil be blowed! by Chris Williams

Display Industry Calendar

Issue 88

Letter from the publisher:  OE-A – a success story…by Mark Fihn

News from around the world: FabriGen, Flexibilis, Apple, Takano, University of Tokyo, CPT, AUO, Nippon Electric Glass, German Federal Ministry of Education and Research, Heliatek, Massachusetts Institute of Technology, Lux Research, BASF, Samsung, Saarland University, Northfield Automation Systems, Nanyang Technology University, DuPont Microcircuit Materials, University of Hyogo/Affordsens, BeBop Sensors, Technische Universitat Munchen, Japan Display, Hong Kong Polytechnic University's Institute of Textiles and Clothing, Innovnano, University of California San Diego, North Carolina State University, King Abdullah University of Science and Technology, Rice University, NovaCentrix/nScrypt/FlexTech Alliance, Henkel/Bergquist Company, Arkema/CEA/Arjowiggins Creative Papers, Ascent Solar Technologies, Evonik/Holst Centre, and Richard Nicoll

OLEDs World Summit, September 16-18, 2014, Berkeley, California; In the second of three reports, Phillip Hill covers presentations from nTact, Eco Solutions Company/Panasonic Corporation, Philips Lumiblade, and SKKU

International Symposium on Wearable Computers, September 13-17, 2014, Seattle, Washington; In the second of three reports, Phillip Hill covers papers from University of Colorado, University of South Australia, University of Minnesota, and Open College of the Arts/University of Dundee

SID Display Week, June 1-6, 2014, San Diego, California; In the third of four reports, Phillip Hill covers papers from Nagoya University/Chubu Gakuin University, University of Cincinnati/Merck Chemicals/Hewlett Packard, The National Institute of Advanced Industrial Science and Technology (AIST)/Konica Minolta, AU Optronics Corp., Southeast University/Nanjing University of Science and Technology, Coherent Inc./Coherent LaserSystems GmbH, Sharp Corporation, Shanghai Jiao Tong University/National Chiao Tung University, Japan Advanced Institute of Science and Technology/Toppan Printing Co. Ltd./JSR Corporation, Shanghai University/Tianma Micro-Electronics Group, Hong Kong University of Science and Technology, Kyungpook National University/LG Display, Chonbuk National University/Nagaoka University of Technology, Lintec Corporation, National Sun Yat-Sen University, National Taiwan University/Yuan Ze University/National Taiwan University Science and Technology/Chang Gung University/Asia University, Chunghwa Picture Tubes, Guardian Industries Corp., Sichuan CCO Display Technology Co Ltd, Peking University, JST-ERATO/Japan Advanced Institute of Science and Technology/Toppan Printing, Shanghai Jiao Tong University/Hoseo University, Shanghai Jiao Tong University/Orthogonal Inc., Korea University, Japan Broadcasting Corporation (NHK)/Nippon Shokubai Co Ltd, and Asahi Sunac Corporation/Kyushu University

Breakthrough in wearable tech may be found in fashion by J.K. Lee and J.H. Jeong

PWC releases study on wearable devices in the US by Norbert Hildebrand

Printed electronics equipment market: profitable but subsidized by Raghu Das

The evolution of smart clothing: better fabrics and sensors by Lawrence Gasman

Wearable electronic watches by John Fenn

Flexible displays are getting real, even for Apple by Guillaume Chansin

Last Word: Christmas looks the season of ho ho ho! and not go go go! by Chris Williams

Display Industry Calendar

Issue 87

Letter from the publisher:  Bendable phones…by Mark Fihn

News from around the world: Okayama University, Northwestern University, University of Chicago/Argonne National Lab, Evonik/Holst Centre, Canadian Light Source, Quantum Materials, Portal, IK4-Ikerlan, Tohoku University, University of Texas/Northwestern University, University of Akron, North Carolina State University, National Science Foundation, Purdue University, Leibniz Institute for New Materials, Fudan University, Imprint Energy, LG, University of Massachusetts Amherst, Northwestern University/University of Illinois at Urbana-Champaign, Technical University of Denmark, Picosun, University of Illinois at Urbana-Champaign, University of Southampton’s Optoelectronics Research Centre, Harvard University, Fraunhofer Institute for Applied Polymer Research, Ascent Solar Technologies, Nanolane/Innopsys, Universal Display Corporation/Philips, UCLA, Olympus, Seoul National University, IDTechEx, BeBop Sensors, OE-A, Duke University, Centre for Solar Energy and Hydrogen Research Baden-Württemberg, and imec

OLEDs World Summit, September 16-18, 2014, Berkeley, California; In the first of two reports, Phillip Hill covers presentations from Blackbody, Cambrios, DuPont Electronics & Communication, and Konica Minolta Inc.

International Symposium on Wearable Computers, September 13-17, 2014, Seattle, Washington; In the first of two reports, Phillip Hill covers papers from Cornell University, Georgia Institute of Technology, German Research Center for Artificial Intelligence (DFKI)/ University of Passau, and RWTH Aachen University/Smart Wearables Ltd.

DIS, June 21-25, 2014, Vancouver, British Columbia; Phillip Hill covers papers from Queen’s University, University of Dundee/University of New South Wales, and University of Sydney

SID Display Week, June 1-6, 2014, San Diego, California; In the second of four reports, Phillip Hill covers papers from Delft University of Technology/JST ERATO/Japan Advanced Institute of Science and Technology (JAIST), Seoul National University, Universal Display Corporation, University of Florida, DifTek Lasers Inc./University of Waterloo/Christie Digital Systems Canada Inc., Kyung Hee University, Universal Display Corporation/Acuity Brands Lighting, Kyung Hee University/Carestream Health Inc., and SiPix Imaging Inc./E Ink Corporation

Printed Electronics Europe, April 1-2, 2014, Berlin, Germany; In the fourth of four reports, Phillip Hill covers presentations from Multek, Fraunhofer IKTS, PiXDRO, PragmatIC Printing, Schott AG, Stora Enso Renewable Packaging, University of Trieste, and Vitriflex Inc.

Graphene Live, April 1-2, 2014, Berlin, Germany; Phillip Hill covers presentations from CrayoNano AS, Haydale Limited, Nano Carbon LLC, Thomas Swan, and Xolve

Tangible, Embedded and Embodied Interaction, February 16-19, 2014, Munich, Germany; In the third of three reports, Phillip Hill covers presentations from University of Technology Graz/University of Sydney, Eindhoven University of Technology, Aalborg University/Malmö University, and KU Leuven/UGent

Displaying, Processing, Hardcopy, and Applications, February 3-5, 2014, San Francisco, California; Phillip Hill covers presentations at this SPIE conference from University of the West of England/The National Gallery, and Purdue University/Hewlett-Packard Indigo Ltd./Hewlett-Packard Laboratories Israel/Hewlett-Packard Laboratories USA/Hewlett-Packard Laboratories UK

Image Quality and System Performance, February 3-5, 2014, San Francisco, California; Phillip Hill covers presentations at this SPIE conference from Purdue University/Hewlett-Packard Co., and Université Jean Monnet de Saint Etienne/Gemalto SA

Wearable Technologies and Glucose Monitoring by Raghu Das

Kyocera Proteus: a “Wearable and Collapsible Smartphone” by Arthur Berman

What the OLED explosion means for transparent conductor makers by Lawrence Gasman

Barrier-layer materials market for electronics to exceed $200 million by Harry Zervos

Last Word: Will 3D printing help the world of flexible substrates? by Chris Williams

Display Industry Calendar

Issue 86

Letter from the publisher:  The art of origami and the physics of electronic design…by Mark Fihn

News from around the world: STMicroelectronics, Empa, IDTechEx, University of Manchester, University of Maryland, Technical University of Denmark, Plastic Logic/Cambridge University, Berkeley Lab, Google, Argonne National Laboratory, Twelve24/E Ink, University of Houston, University of Toronto, Canalys, Nantero, University of Notre Dame, University of Sheffield, PARC, IKEA, FlexTech Alliance, LG Electronics, and Samsung

Flexible Displays Market Focus Conference, June 5, 2014, San Diego, California; Phillip Hill covers presentations from Kent Displays, Industrial Technology Research Institute, Holst Center, FlexTech Alliance, Argus Insights, Corning Glass Technologies, E Ink, Bardsley Consulting, Plastic Logic, Canatu Oy, and IHS

SID Display Week, June 1-6, 2014, San Diego, California; In the first of four reports, Phillip Hill covers papers from Konica Minolta Inc, AU Optronics Corporation, The University of Tokyo, Ignis Innovation Inc/Cambridge University, LG Display, Holst Centre/TNO/Imec/KU Leuven/Evonik Industries AG, Yamagata University, Shenzhen China Star Optoelectronics Technology, Southeast University, IMEC/KU Leuven/TNO/Holst Centre/Panasonic Corporation, AU Optronics Corporation, Plastic Logic Ltd, Semiconductor Energy Laboratory Co Ltd/Advanced Film Device Inc/Nokia Research Center/Nokia Smart Devices/Nokia Advanced Engineering, BOE Technology Group, Semiconductor Energy Laboratory Co Ltd, Kateeva Inc, AU Optronics Corporation, and Holst Centre/IMEC

Printed Electronics Europe, April 1-2, 2014, Berlin, Germany; In the third of four reports, Phillip Hill covers presentations from IDTechEx, IMEC, Lotus Applied Technology, and Opalux Inc.

Tangible, Embedded and Embodied Interaction, February 16-19, 2014, Munich, Germany; In the second of three reports, Phillip Hill covers presentations from MIT Media Lab/Royal College of Art/Max Planck Institute for Informatics, MIT Media Lab, Northwestern University, and Aarhus School of Architecture & The Alexandra Institute Ltd/IT University of Copenhagen/Aarhus University

Flexible & Printed Electronics Conference & Exhibition, February 4-6, 2014, Phoenix, Arizona; In the fourth of four reports, Phillip Hill covers presentations from Cal Poly State University, PragmatIC Printing Ltd, Argonne National Laboratory, VTT Technical Research Centre of Finland, Kimoto Tech Inc., Frostburg State University, Frontier Industrial Technology, and IPG Photonics

International Workshop on Smart Material Interfaces, December 13, 2013, Sydney, Australia; Phillip Hill covers papers from Keio University, Royal College of Art, and University of Electro-Communications

IDW, December 4-6, 2013, Sapporo, Japan; In the fourth of four reports, Phillip Hill covers papers from AU Optronics Corporation, CEA-LITEN-Minatec/Eindhoven University of Technology/STMicroelectronics/University of Catania, Polyera Corporation and Northwestern University, Delft University of Technology/Japan Science and Technology Agency/Japan Advanced Institute of Science and Technology, Phicot Inc./Hewlett Packard Co./Apple Co./E Ink/Applied Materials GmbH, Panasonic Corporation, Tohoku Gakuin University, Toshiba Corporation, and AU Optronics Corporation

Printed Electronics USA, November 20-21, 2013, Santa Clara, California; In the fourth of four reports, Phillip Hill covers presentations from Optomec, PiXDRO, PragmaticIC Printing, Dyesol Inc., EMD Chemicals, and Agfa Materials

Progress with Printed Electronics: Markets, case studies and technology developments by Raghu Das

How OLED lighting could “save” the OLED industry by Lawrence Gasman

The rise of plastic and flexible OLED displays by Guillaume Chansin

Last Word: So, is glass or paper going to be the new plastic? by Chris Williams

Display Industry Calendar

Issue 85

Letter from the publisher:  Hemp – the ideal supercapacitor…by Mark Fihn

News from around the world: MIT, Texas Southern University, Shinshu University, University of Liverpool, Nordson MARCH, Princeton, Philips/Desso, University of Stuttgart, Semiconductor Energy Laboratory, Thin Film Electronics, VivaLnk, LG Display, Fraunhofer Institute for Applied Polymer Research, Fudan University, FlexTech Alliance/Clemson University/PARC, University of Central Florida, and Imprint Energy/FlexTech Alliance

Printed Electronics Europe, April 1-2, 2014, Berlin, Germany; In the second of four reports, Phillip Hill covers presentations from DuPont, Dyesol Group, Holst Centre, and IDTechEx

Electronic Displays Conference, February 26-27, 2014, Nuremberg, Germany; Phillip Hill covers presentations from E Ink, and Sharp

Flexible & Printed Electronics Conference & Exhibition, February 4-6, 2014, Phoenix, Arizona; In the third of four reports, Phillip Hill covers presentations from SmartKem Ltd, Brewer Science, Clemson University, EMD Millipore, Seashell Technology, American Semiconductor, Soligie, DuPont Teijin Films, and Plastic Logic

2014FLEX conference shows printed electronics, “At the Tipping Point” by John Fenn

IDW, December 4-6, 2013, Sapporo, Japan; In the third of four reports, Phillip Hill covers papers from Tokai University, Sharp Corporation, Industrial Technology Research Institute, Chiba University, RICOH Company Ltd., Chiba University, Philips Research, Tokai University, Sendai National College of Technology/Tokyo Polytechnic University/The University of Electro-Communications, Toppan Printing Co Ltd./Japan Advanced Institute of Science and Technology/JSR Corporation, Konica Minolta, National Institute of Advanced Industrial Technology (AIST), LG Display, Tianma Micro-Electronics Group/Shanghai University, Japan Advanced Institute of Science and Technology/Industrial Research Institute of Ishikawa/Tokyo Process Service Co Ltd./JST-ERATO, Hanyang University/Image Lab Corp., and Sungkyunkwan University

Printed Electronics USA, November 20-21, 2013, Santa Clara, California; In the third of four reports, Phillip Hill covers presentations from Acreo Swedish ICT, CondAlign, Flextronics, and NovaCentrix

AIMCAL Web Coating & Handling Conference, October 27-30, 2013, Charleston, South Carolina; In the fourth of four reports, Phillip Hill covers presentations from Avery Dennison, Sputtering Components Inc, Davis-Standard, Frontier Industrial Technology, ShapedWire, MFN Technology Limited, Centre for Process Innovation, Evans Analytical Group, Specialty Papers & Films Inc, Leybold Optics GmbH, Bobst, Henkel Corporation, MOCON Inc, Kobe Steel Ltd, Dark Field Technologies Inc, and Applied Materials Web Coating GmbH

Plastic Electronics Conference, October 8-10, 2013, Dresden, Germany; In the fourth of four reports, Phillip Hill covers presentations from University of Cambridge, Holst Centre, Novaled AG, and FHR Anlagenbau GmbH

EuroDisplay, September 16-19, 2013, London, England; In the fourth of four reports, Phillip Hill covers papers from VTT Technical Research Centre of Finland, Belarusian State University/Institute of Chemistry of New Materials, Cambridge Display Technology Limited, Imperial College London/Centro de Inovacoes CSEM Brasil/Molecular Vision Ltd/Friedrich-Alexander Universitat Erlangen-Nurnberg/Cambridge Display Technology Ltd, and Katholieke Universiteit Leuven/IMEC/Holst Centre

Interview with Lou Panico, CEO and President, XENON Corporation

Why the interest in e-textiles? by Peter Harrop

Graphene markets, technologies and opportunities by Khasha Ghaffarzadeh

Translating CIGS efficiency improvements into market opportunity by Lawrence Gasman

Last Word: Where there’s muck, there’s money! by Chris Williams

Display Industry Calendar

Issue 84

Letter from the publisher:  Crystal balls…by Mark Fihn

News from around the world: UC Berkeley/Argonne, NREL, University of California San Diego, Vidameter, Merck KGaA/BASF, University of Illinois, Rice University, Case Western, Monash University, Solar Frontier, University of California Santa Barbara/Rice University, Hebrew University of Jerusalem, Lux Research, University of Illinois at Urbana-Champaign, Oak Ridge National Laboratory, Global Lighting Technologies, Queen’s University, Intel, IHS, Nanyang Technological University, KAIST, UT Dallas, University of Strathclyde, Samsung Electronics America, Pixelligent Technologies/ORNL, and Fraunhofer

Printed Electronics Europe, April 1-2, 2014, Berlin, Germany; In the first of four reports, Phillip Hill covers presentations from Agfa Materials, Bosch Rexroth AG, ClearJet, and De La Rue International

Tangible, Embedded and Embodied Interaction, February 16-19, 2014, Munich, Germany; In the first of four reports, Phillip Hill covers presentations from University of Applied Sciences Upper Austria/Keio University, Rhode Island School of Design/Microsoft Research Asia, MIT Media Lab, and PUC-Rio

Flexible & Printed Electronics Conference, February 4-6, 2014, Phoenix, Arizona; In the second of four reports, Phillip Hill covers presentations from Henkel China, Lockheed Martin, American Semiconductor Inc., and MicroChem Corp.

IDW, December 4-6, 2013, Sapporo, Japan; In the second of four reports, Phillip Hill covers papers from Sungkyunkwan University, Merck Chemicals Ltd., Centre for Process Innovation (CPI), AU Optronics Technology Center, FUJIFILM Corporation, National Institute of Advanced Industrial Science and Technology (AIST), Japan Advanced Institute of Science Technology/Toppan Printing/Japan Advanced Institute of Science and Technology, Kobe Steel, Nippon Soda Co. Ltd., and LG Display

Printed Electronics USA, November 20-21, 2013, Santa Clara, California; In the second of four reports, Phillip Hill covers presentations from EMD, IBM T. J. Watson Research Center, Konica Minolta, LunaLEC, and Schott AG

AIMCAL Web Coating & Handling Conference, October 27-30, 2013, Charleston, South Carolina; In the third of four reports, Phillip Hill covers presentations from Coating Tech Service, MMC Ryotec, Von Ardenne, New Era Converting Machinery Inc., Clean Room Coating Solutions, Finishing Technologies Inc., Nordmeccanica, CPFilms Inc., Sun Chemical, Electrostatic Answers, Global Safety Management, Radiant Energy Systems Inc., Gencoa Ltd, and Clemson University

Plastic Electronics Conference, October 8-10, 2013, Dresden, Germany; In the third of four reports, Phillip Hill covers presentations from University of Stuttgart, Tor Vergata University, University of Southampton, Novacentrix, and Tampere University of Technology

EuroDisplay, September 16-19, 2013, London, England; In the third of four reports, Phillip Hill covers papers from Plastic Logic Ltd., Institute for Surface Technologies and Photonics/Institute for Nanoscale Research, Hong Kong University of Science and Technology/Sinodisplay Technology Co., Ltd, and NHK Science & Technology Research Laboratories

Printed Electronics Asia, July 9-10, 2013, Tokyo, Japan; In the fourth of four reports, Phillip Hill covers presentations from IDTechEx, Okayama University, PragmatIC Printing, and SCHOTT AG

Large-area Organic Printed Electronics Convention, June 11-13, 2013, Munich, Germany

Wearable Electronics, Success Factors for 12,000 Developers by Peter Harrop

Organic Photovoltaics 2013-2023 by Khasha Ghaffarzadeh

Silver Inks and Pastes Resurgence? by Lawrence Gasman

Last Word: Droning on and on about danger – plus a European melt down by Chris Williams

Display Industry Calendar

Issue 83

Letter from the publisher: The rise of exotic materials…by Mark Fihn

News from around the world: NanoMarkets, Solvay/Plextronics, Stanford, Research and Markets, Organic Electronics Energy, SmartKem/Bangor University, University of California Berkeley, University of Illinois/Northwestern University, Iowa State University, University of Surrey, MIT, IDTechEx, National Research Council, IMEC/Ghent University, Thinfilm/Temptime, Xymox Technologies, SnapWatch, Universities of California/Manchester, Seoul National University, Karlsruhe Institute of Technology, Texas A&M University, VTT, Suzhou Institute of Nanotech, ISORG/Plastic Logic, University of Chicago, University of Tsukuba, KAIST, UC Irvine, University of Illinois at Urbana-Champaign, National Energy Research Scientific Computing Center, Samsung, SCHOTT/DELO, AUO, Livermore Lab, Plastic Logic, Fudan University, DELO, and Arjowiggins Creative Papers

Flexible & Printed Electronics Conference & Exhibition, February 4-6, 2014, Phoenix, Arizona; In the first of four reports, Phillip Hill covers presentations from Corning Incorporated, E Ink, Universal Display Corporation, LG Display, Applied Materials Web Coating GmbH, Advantech US Inc/Alcoa Technical Center, Linde Nanomaterials, Cambridge Graphene Platform Ltd, University of Stuttgart/BASF SE/InnovationLab GmbH, Lehigh University/Alcoa Technical Center, and University of Houston/South Dakota School of Mines and Technology

C-Touch, November 25-27, 2013, Shenzhen, China; Phillip Hill covers presentations from Henkel, and Von Ardenne

Printed Electronics USA, November 20-21, 2013, Santa Clara, California; In the first of four reports, Phillip Hill covers presentations from AZ Electronic Materials, PPG Industries, 3M Optical Systems Division, and Cambridge Display Technology

AIMCAL Web Coating & Handling Conference, October 28-30, 2013, Charleston, South Carolina; In the second of four reports, Phillip Hill covers presentations from RJLynch & Associates, Umicore Thin Film Products, Imperial Rubber Products, Fraunhofer Institute for Electron Beam and Plasma Technology (FEP), Mica Corporation, Siemens Industry Inc, Chase Machine & Engineering Inc, Celplast Metallized Products, Ashland Performance Materials, 3M, Gogolin & Associates, DuPont Teijin Films, Bobst, Teknek Limited, CPFilms Inc, Fennagain, and Kimoto Tech Inc.

Symposium on User Interface Software and Technology, October 8-11, 2013, St Andrews, Scotland; In the fourth of four reports, Phillip Hill covers presentations from University of California, Disney Research Pittsburgh/Carnegie Mellon University, Leuven Engineering College/KU Leuven/iMinds/KU Leuven, and Keio University

Emerging Materials for Transparent Conductors, July 10, 2013, San Francisco, California; Phillip Hill covers presentations from Dimatix, NovaCentrix, and Brewer Science

Printed Electronics Asia, July 9-10, 2013, Tokyo, Japan; In the third of four reports, Phillip Hill covers presentations from IDTechEx, Intrinsiq Materials Ltd, DIC Corporation, and Konica Minolta

Large-area Organic Printed Electronics Convention, June 11-13, 2013, Munich, Germany; In the third of four reports, Phillip Hill covers presentations from Ecole Polytechnique Fédérale de Lausanne (EPFL), National Taiwan University/LCY Chemical Corp/Industrial Technology Research Institute, VTT Technical Research Centre of Finland, Industrial Technology Research Institute (ITRI)/Corning Incorporated, Suzhou Institute of NanoTech, Chemnitz University of Technology/Universitat Autonoma de Barcelona/Italian National Agency for New Technologies/Universidade do Algarve/Fraunhofer Institute for Electronic Nano Systems (ENAS), and Liquid-X Printed Metals

IMI Inkjet Technology Showcase, June 5-6, 2013, Barcelona, Spain; Phillip Hill covers presentations from Adphos, and AtomJet

The multi-billion dollar future of e-textiles by Peter Harrop

The next generation of flexible sensors by Guillaume Chansin

Wearables expanding market for thin film batteries by Lawrence Gasman

Last Word:  And the acronym this month is VOMIT! by Chris Williams

Display Industry Calendar

Issue 82

Letter from the publisher: Borophene and molybdenum disulfide…by Mark Fihn

News from around the world: Vienna University of Technology, University of Surrey, Photosens, Natural Science Foundation of China, Kaneka/UDC, Gent University/IMEC, KAIST, Kyocera, Washington University, Creoir, University of Michigan, Federal Ministry of Education and Research in Germany/French Agence Nationale de la Recherche, McGill University, Purdue University, Brewer Science, Kansas State University, AIST, IHS, CPI, Philips, BASF/National University of Singapore, Oxford Photovoltaics, KAUST, Ghent University, Semiconductor Energy Laboratories, NanoMarkets, tesa, University of Utah, Prelonic, T+ink/TouchBase Technologies, Oxford University, Plastic Logic,Novaled, and OE-A

IDW, December 4-6, 2013, Sapporo, Japan; In the first of four reports, Phillip Hill covers papers from AU Optronics Corporation, Tokyo Polytechnic University, Saitama University/Calsonic Kansei, Kyungpook National University, Shinoda Plasma Co Ltd, Brunel University/Intrinsiq Materials Ltd/Johnson-Matthey Technology Centre/Printed Electronics Ltd, Brunel University, Dong-A University/LG Display, Hanyang University, Industrial Technology Research Institute, Southeast University/Kyung Hee University/Trinity College Dublin, and Kyung Hee University

Plastic Electronics Conference, October 8-10, 2013, Dresden, Germany; In the second of four reports, Phillip Hill covers presentations from VTT Technical Research Centre of Finland, Polar OLED, Uppsala University, VTT Center for Printed Intelligence, and Plastic Logic

Symposium on User Interface Software and Technology, October 8-11, 2013, St Andrews, Scotland; In the third of four reports, Phillip Hill covers presentations from The University of Electro-Communications, MIT Media Lab (x2), and Max Planck Institute for Informatics/MIT Media Lab

EuroDisplay, September 16-19, 2013, London, England; In the second of four reports, Phillip Hill covers papers from IMEC/Ghent University, Belarusian State University of Informatics and Radioelectronics/JSC INTEGRAL, Tomas Bata University, Imperial College London/Centro de Inovaçōes CSEM Brasil/Molecular Vision Ltd/Friedrich-Alexander Universität Erlangen-Nürnberg/Cambridge Display Technology Ltd, and Seoul National University/Sungkyunkwan University/Yonsei University

Printed Electronics Asia, July 9-10, 2013, Tokyo, Japan; In the second of four reports, Phillip Hill covers presentations from Hitachi Chemical, and IDTechEx

Large-area Organic Printed Electronics Convention, June 11-13, 2013, Munich, Germany; In the second of four reports, Phillip Hill covers presentations from LIM Liquids in Motion GmbH, Ynvisible, Fraunhofer COMEDD, CEA-Liten, Merck Chemicals Limited, American Semiconductor Inc, Fraunhofer Institut für Silicatforschung ISC, Fraunhofer Institute for Electron Beam and Plasma Technology FEP, University of Leoben, and Friedrich-Schiller-University Jena

SID Display Week, May 19-24, 2013, Vancouver, British Columbia; In this final report, Phillip Hill covers the pick of the best from the poster sessions with papers from National Chung Hsing University, AU Optronics Corporation (x2), LINTEC Corporation, Korea University/KAIST, National Chung Hsing University/Giera Technologies, Unipel Display Technologies, and Kent Displays

Printed Electronics Europe, April 17-18, 2013, Berlin, Germany; In the third of three reports, Phillip Hill covers presentations from IDTechEx, Kroenert, Ohmatex, PARC, Philips OLED Lighting, Pronet Energy GmbH, Solvay, SUSS Microtec, Tactonic Technologies, Hitachi Chemical, and The University of Akron

2014FLEX conference shows printed electronics at “the tipping point” by John Fenn

Has the printed, flexible electronics field reached “the tipping point?” by Harry Zervos

Last Word – If you can keep your feet dry when all about you are getting theirs wet… With apologies to Rudyard Kipling by Chris Williams

Display Industry Calendar 

Issue 81

Letter from the publisher: 3DTDS…by Mark Fihn

News from around the world: Thinfilm/Kovio Technology, Plextronics/Solvay America, X-Celeprint, University of Houston, Brady/Thin Film Electronics, LYON Superchargers, Centre for Process Innovation, Picosun, Displaybank, FlexTech Alliance, Bemis/Thinfilm, KTH Royal Institute of Technology, LG Electronics, North Carolina State University, Displaydata, AIXTRON/Manz, ETH Zurich, Universities of Illinois and Central Florida, Solliance, Razer, Sony/Panasonic, Stanford/UNL, University of Florida, Lawrence Berkeley National Lab, Yissum, Pixelligent, and University of Valencia

International Conference on Multimodal Interaction, December 9-12, 2013, Sydney, Australia; Phillip Hill covers a presentation from Swiss Federal Institute of Technology/University of Twente

SIGGRAPH Asia, November 19-22, 2013, Hong Kong, China; The vast majority of presentations from this conference are being covered in our sister newsletters 3rd Dimension, High Resolution, and Touch Panel, but here Phillip Hill covers a presentation from Joshibi University of Art and Design/teamLab Inc.

AIMCAL Web Coating & Handling Conference, October 28-30, 2013, Charleston, South Carolina; In the first of four reports, Phillip Hill covers presentations from C.A. Bishop Consulting Ltd., Leeds University, Finishing Technologies, David Rumson, Pontifica Universidade Catolica do Rio de Janeiro, Process Sensors Corporation, TSE Troller AG, Edward D. Cohen Consulting, Leybold Optics GmbH, TCNF, NDC Infrared Engineering, Valco Melton, SAGE Environmental Consulting, Leeds University, Tetra Pak, Madico Inc., Beneq, and Innovia Films

Plastic Electronics Conference, October 8-10, 2013, Dresden, Germany; In the first of four reports, Phillip Hill covers presentations from MC10 Inc., University of Wisconsin‐Madison, KWJ Engineering/SPEC Sensors, and Plastic Logic

Symposium on User Interface Software and Technology, October 8-11, 2013, St Andrews, Scotland; In the second of four reports, Phillip Hill covers presentations from Shinshu University/National Institute of Informatics, Nokia/Samsung Corporation/University of Colorado at Boulder, University of Electro-Communications, and Australian National University/CSIRO/DSTO

Interactive Tabletops and Surfaces, October 6-9, 2013, St. Andrews, Scotland; In the second of two reports, Phillip Hill covers presentations from Microsoft Research/The University of Tokyo/University of Washington/Lenovo Research & Technology, Pontifical Catholic University of Rio de Janeiro, University of Munich (LMU), and Australian National University

EuroDisplay, September 16-19, 2013, London, England; In the first of four reports, Phillip Hill covers papers from Imperial College London, IMEC and Ghent University, National Printable Electronics Centre, and Saarland University

International Symposium on Wearable Computers, September 9-12, 2013, Zurich, Switzerland; Phillip Hill covers presentations from University of Colorado/Georgia Institute of Technology, Institut für Textiltechnik an der RWTH Aachen, Aalto ARTS, and Georgia Institute of Technology

Printed Electronics Asia, July 9-10, 2013, Tokyo, Japan; In the first of four reports, Phillip Hill covers presentations from CondAlign, DP Patterning AB, Asahi Glass Co. Ltd., and Cambridge Graphene Platform Ltd

Large-area Organic Printed Electronics Convention, June 11-13, 2013, Munich, Germany; In the first of four reports, Phillip Hill covers presentations from Amcor Flexibles Kreuzlingen AG, Enfucell, E Ink, Philips Lighting, OM&T/MoserBaer Technologies, Konica Minolta, Bosch Rexroth, Fraunhofer Institute for Applied Optics and Precision Engineering (IOF), and University of California Berkeley

SID Display Week, May 19-24, 2013, Vancouver, British Columbia; In the fourth of four reports, Phillip Hill covers the fourth day of the symposium with presentations from Universal Display Corporation, IBM T. J. Watson Research Center, Cambrios Technologies Corporation, Hitachi Ltd, Pixtronix Inc, Semiconductor Energy Laboratory Co. Ltd./Sharp Corporation, The Hong Kong University of Science and Technology, and Advanced Film Device Inc./Semiconductor Energy Laboratory Co., Ltd.

Printed Electronics Europe, April 17-18, 2013, Berlin, Germany; In the second of four reports, Phillip Hill covers presentations from Fraunhofer Research Institution for Organics, Materials and Electronic Devices COMEDD (x2), Grupo Antolin, Graphene Technologies, and Hanbat National University

TC film market growing 6% a year to 2024 by Khasha Ghaffarzadeh

An update on DSC technology by Lawrence Gasman

Glow garments in a new light by Louis M. Brill

Last Word: You wouldn’t believe this if you read it in a book…by Chris Williams

Display Industry Calendar

Issue 80

Letter from the publisher: Another super-material: Stanene…by Mark Fihn

News from around the world: Solliance, University of Central Florida, Organic and Printed Electronics Association, Soligie/FlexTech Alliance, FlexTech Alliance, IDTechEx, Harvard, DuPont Teijin Films, NikkoIA, prelonic, XENON, ISORG, University of Pittsburgh, Optomec, Smarty Ring, Novalia, Gartner, Linköping University, PPG Industries/Universal Display Corporation, European Patent Office, LG, KAIST, Universal Display/Philips Technologie, Philips, Kateeva, University of Texas, Swiss Federal Laboratories for Materials Science and Technology, Midsummer, Rice University, University of Pittsburgh, Optomec, Cheil Industries, Georgia Tech/University of Tokyo/Microsoft Research, Institute of Photonic Sciences, New Jersey Institute of Technology, Andrews & Wykeham, Linz Institute for Organic Solar Cells, University of Bielefeld/University of Ulm, IHS, UC Santa Barbara, University of Houston, Purdue University, Imperial College London, MIT/University of Alabama/Universidade Federal de Minas Gerais, University of Perugia, RIKEN Metamaterials Laboratory/Tohoku University, Incheon National University, Pro-Teq Surfacing, Thin Film Electronics, Pragmatic Printing, Aneeve Nanotechnologies, Sunfriend, Optoelectronics Research Centre, Sandia National Laboratories, Kornit Digital, Eindhoven University of Technology, T-ink, National University of Singapore, Plastic Logic/Printless Plans, ZBD/Zebra Technologies

Printed Electronics & Membrane Switch Symposium, October 22-23, 2013, Orlando, Florida; Phillip Hill covers presentations from CPR Inc., Kissel & Wolf GmbH, Sefar Inc./Heraeus Precious Metals, Sefar Inc., Lumitex, Cubbison, and MacDermid Autotype Ltd.

Symposium on User Interface Software and Technology, October 8-11, 2013, St Andrews, Scotland; In the first of four reports, Phillip Hill covers presentations from MIT Media Lab, MIT Media Lab/MIT EECS, Queen’s University/Intel Corporation, Disney Research/Carnegie Mellon University, and Microsoft Research Asia/Rhode Island School of Design/Tsinghua University

Interactive Tabletops and Surfaces, October 6-9, 2013, St. Andrews, Scotland; In the first of four reports, Phillip Hill covers presentations from National University of Singapore, University of Oulu, Australian National University/Defense Science and Technology Organization, and Tohoku University

Symposium on Virtual Reality Software and Technology, October 6-8, 2013, Singapore; Phillip Hill covers a paper from University of Munich (LMU)/Leibniz Supercomputing Centre (LRZ)

CHItaly, September 16-19, 2013, Trento, Italy; Phillip Hill covers this Italian SIGCHI Chapter conference with a presentation from Samsung Research Institute

SID Display Week, May 19-24, 2013, Vancouver, British Columbia; In the third of four reports, Phillip Hill covers the third day of the symposium with presentations from Kyushu University, Idemitsu Kosan Co Ltd., Plextronics Incorporated, Saint-Gobain Recherche, TU Dresden, University of Augsburg, BOE Technology Group, DuPont Displays Inc., Toshiba Corporation, Tohoku University, University of Michigan, AU Optronics Corporation, Sunic System Ltd., Sharp Corporation/Semiconductor Energy Laboratory Co. Ltd./Advanced Film Device Inc., and Industrial Technology Research Institute

Printed Electronics Europe, April 17-18, 2013, Berlin, Germany; In the first of four reports, Phillip Hill covers presentations from advanced display technology AG, Applied Materials Web Coating GmbH, Asahi Glass Co Ltd., Beneq, Brewer Science, DuPont Microcircuit Materials, and ESMA (European Specialist Printing Manufacturer’s Association)

Graphene LIVE! USA by Khasha Ghaffarzadeh

Thin-film and printed batteries update by Lawrence Gasman

Last Word: Who? Where? When?…by Chris Williams

Display Industry Calendar

Issue 79

Letter from the publisher: Carbyne, defective nanotubes, and metallic carbon… by Mark Fihn

News from around the world: Technische Universität München, Contipro, NJIT, Industrial Institute of Printed Electronics, UC Santa Barbara, StoreDot, Cambridge University, LG, ITRI/Komori, PixelFLEX, IHS, UCLA, European Patent Office, ETAP, Ason Technology, Toray, Semiconductor Energy Laboratory, ENAB-SPOLED, UC Berkeley, Fraunhofer ICT, International Institute for Nanocomposites Manufacturing, Powerbooster, Clemson University, Manchester University/National University of Singapore, Nagoya University/Aalto University, AIXTRON, and Haydale

UbiComp, September 8-12, 2013, Zurich, Switzerland; Phillip Hill covers presentations from RMIT University, The University of Tokyo/Microsoft Research/Georgia Institute of Technology, and University of Washington/University of Massachusetts/Intel Laboratories

SIGGRAPH, July 21-25, 2013, Anaheim, California; Phillip Hill covers presentations from The University of Tokyo, Keio University, Kansai University, The University of Tokyo/Nagoya Institute of Technology/Sony CSL, and Uppsala University

Interaction Design and Children, June 24-27, 2013, New York, New York; Phillip Hill covers presentations from MIT Media Lab, Stanford University, and University of Maryland

SID Business Conference, May 20, 2013, Vancouver, British Columbia; Phillip Hill covers presentations from GT Advanced Technologies, and Cambrios

SID Display Week, May 19-24, 2013, Vancouver, British Columbia; In the second of four reports, Phillip Hill covers the second day of the symposium with presentations from LG Display, AU Optronics Corporation, nVerPix LLC/University of Florida/University of Waterloo, Palo Alto Research Center, Chung-Ang University/Sungkyunkwan University, Hewlett Packard/Applied Materials GmbH, Semiconductor Energy Laboratory/Advanced Film Device Inc./Sharp Corporation, Fraunhofer Institute for Electron Beam and Plasma Technology FEP/Fraunhofer Institute for Silicate Research ISC/Fraunhofer Institute for Process Engineering and Packaging IVV/Fraunhofer Institute for Applied Polymer Research, Georgia Institute of Technology/RWTH Aachen/Ruhr-Universitat Bochum, Universidade Nova de Lisboa, Toshiba Corporation, and Arizona State University/Army Research Lab

CHI, April 27 – May 2, 2013, Paris, France; Phillip Hill covers presentations from Brunel University/University College London/Heriot Watt University, Telecom ParisTech, MIT Media Lab/Christian-Albrechts-Universität, Queen’s University, University of Bristol/German Research Institute for Artificial Intelligence (DFKI), JST ERATO IGARASHI Design Interface Project/The University of Tokyo/Keio University, and Carleton University

Smart Fabrics, April 17-19, 2013, San Francisco, California; In the second of two reports, Phillip Hill covers presentations from T-Ink Technologies Inc., Holst Centre, Infoscitex Corporation, and Infoscitex Corporation

Flexible Electronics for BioSensor Applications, April 16-17, 2013, San Jose, California; In the second of two reports, Phillip Hill covers a presentation from University of California

Interview with Lou Panico and Saad Ahmed from Xenon Corporation

Second chance for OLED lighting? by Norman Bardsley and Khasha Ghaffarzadeh

Dye Sensitized Solar Cells: Conservative growth forecasts by Harry Zervos

Printed and flexible sensors: There will be many winners…by Guillaume Chansin

Financiers focus on flexible displays by Ken Werner

Curved and Flexible Smartphone Display Technology Shoot-Out by Raymond Soneira

Smart watch industry will adopt 30 million flexible and curved displays by Jennifer Colegrove

Last Word: This is what happens when paranoia mixes with technology…by Chris Williams

Display Industry Calendar

Issue 78

Letter from the publisher: Curved, then flex…by Mark Fihn

News from around the world: North Carolina State University, Polyera, Meystyle, NPL, FOM Foundation/Delft University of Technology/Toyota, Displaybank, Centre for Process Innovation, MIT, Wyss Institute, University of Illinois at Urbana-Champaign/University of Chicago/Hanyang University, cynora/Karlsruhe Institute of Technology, Stanford, Tel Aviv University, MakerBot, Samsung Cheil Industries/Novaled, Kyocera/Kyushu University/Nissan, Harvard, Exopack Advanced Coatings/IntelliCoat Technologies, Cornell, University of Pennsylvania, IHS, NREL/Corning, Technische Universitaet Muenchen, DELO, R2Flex, ENAB-SPOLED, Vienna University of Technology, University of Utah, Fujifilm/imec, University of Minnesota, UCLA, Max Planck Institute, LiCRA, Corning/Coresix, HZB CIDETEC, Lüme, FlexTech Alliance, University of Manchester, FlexTech Alliance, University of Massachusetts/Aixtron, Applied Materials/Tokyo Electron, Brewer Science, Carestream Tollcoating, Interlink Electronics/MacDermid, Colnatec/Novaled, E Ink, OLED 3D consortium, National Research Council of Canada, Xenon, Thin Film Electronics, Picodeon, and Seoul National University

Intelligent User Interfaces, March 19-22, 2013, Santa Monica, California; Phillip Hill covers presentations from Hokkaido University, and University of Amsterdam

Electronic Displays Conference, February 27-28, 2013, Nuremberg, Germany; Phillip Hill covers presentations from Atmel Corporation, Plastic Logic, and LIM Liquids In Motion

Display & Touch Technologies of the Future, January 16, 2013, Sunnyvale, California; Phillip Hill covers presentations at this SID Bay Area Chapter meeting from DuPont Displays, and Universal Display Corporation

Touch Gesture Motion America Conference, December 12-13, 2012, Austin, Texas; Phillip Hill covers presentations from Corning, and Touch International

Printed Electronics USA, December 5-6, 2012, Santa Clara, California; In the fourth of four reports, Phillip Hill covers presentations from Soligie Inc., Stevens Institute of Technology, Cambridge University, and XG Sciences Inc.

Printed Electronics & Membrane Switch Symposium, October 18-20, 2012, Las Vegas, Nevada; In the third of three reports, Phillip Hill covers presentations from Blue Spark Technologies, and Phoseon Technology

Plastic Electronics, October 9-11, 2012, Dresden, Germany; In the third of three reports, Phillip Hill covers presentations from Aixtron SE, DuPont Displays, SKKU Advanced Institute of Nanotechnology (SAINT), Konica Minolta Advanced Layers Inc., University of Southern California, Organic Spintronics, Max Planck Institute for Solid State Research, and Fraunhofer Institution for Modular Solid State Technologies (EMFT)

Printed Electronics Asia, October 2-3, 2012, Tokyo, Japan; In the third of three reports from this IDTechEx event, Phillip Hill covers presentations from IDTechEx, Samsung Advanced Institute of Technology, and Solvay

Wearables won’t do much without your help by Andy Marken

LG OLED TV Display Technology Shoot-Out by Ray Soneira

Flexible and curved display revenue to hit $27 billion by 2023 by Jennifer Colegrove

Last Word: The end of a beautiful relationship? by Chris Williams

Display Industry Calendar

Issue 77

Letter from the publisher: Flexible displays – do not touch…by Mark Fihn

News from around the world: Universal Display, Brewer Science, Novaled, Aristotle University/AIXTRON, American Semiconductor, Interlink Electronics, Nanotech Biomachines, Mühlbauer/NovaCentrix, PARC, Plastic Logic, Plextronics, Yokohama National University/Tokyo Institute of Technology/C-MET, IXYS, University of Michigan, Fraunhofer/Friedrich-Schiller University, UC Berkeley, Ascent Solar, Corning, Technion-Israel Institute of Technology, UNIST, Rice/Pennsylvania State, Harvard University/University of Illinois at Urbana-Champaign, MIT, Imec/Holst Centre, UC Santa Barbara, British Airways, Plastic Logic/ISORG, Samsung, Azad University, i.materialise, Emopulse, Cambridge University, Max Planck Institute, Purdue University, Northwestern University, and Stanford

Korea Display Conference, June 12-13, 2013, Seoul, South Korea; Phillip Hill covers presentations from Electronics and Telecommunications Research Institute, LG Electronics, and Novaled

SID Display Week, May 19-24, 2013, Vancouver, British Columbia; In the first of four reports, Phillip Hill covers the first day of the symposium with presentations from LG Display R&D Center, AU Optronics Corp., Shinoda Plasma Co. Ltd., University of Cincinnati/Gamma Dynamics, Chiba University, Universität Stuttgart/IRX Innovations B.V., Industrial Technology Research Institute, VTT Technical Research Centre of Finland, Semiconductor Energy Laboratory Co., Ltd./Advanced Film Device Inc./Sharp Corporation, and Holst Centre/TNO/Philips Research Laboratories, Panasonic Corporation/Holst Centre/TNO/IMEC

Printed and Flexible Electronics Technology for Health, April 16-17, 2013, San Jose, California; In the first of two reports, Phillip Hill covers presentations from Adidas Wearable Sports Electronics, Infinite Corridor Technology, MC10, and GE Global Research

Flexible & Printed Electronics Conference, January 29 – February 1, 2013, Phoenix, Arizona; In the third of three reports, Phillip Hill covers presentations from PARC, Brewer Science, Tactonic Technologies, University Duisburg Essen, University Duisburg Essen, Binghamton University, Sharp Labs of America, Korea Electronics Technology Institute, Applied Materials, Cambrios Technologies, Clemson University, Heraeus Precious Metals, Kongju National University, Linde Nanomaterials, IDTechEx, Korea Advanced Institute of Science and Technology (KAIST), University of California, Hewlett Packard Laboratories, SWeNT and University of California, Columbia University, Corning Incorporated, Sandia National Laboratories, University of Cincinnati, Binghamton University, University of Massachusetts, PARC, Enercon Industries Corporation, Northfield Automation Systems Inc., Coherent Inc., NovaCentrix, and Aixtron

Printed Electronics & Membrane Switch Symposium, October 18-20, 2012, Las Vegas, Nevada; In the second of three reports, Phillip Hill covers presentations from Sefar Inc., Eastman Kodak Company, NovaCentrix, and DuPont Microcircuit Materials

Plastic Electronics, October 9-11, 2012, Dresden, Germany; In the second of four reports, Phillip Hill covers presentations from KROENERT GmbH & Co KG, Novaled AG, Idemitsu Kosan Co. Ltd., Plastic Logic, and Panasonic Corporation

Printed Electronics Asia, October 2-3, 2012, Tokyo, Japan; In the second of three reports from this IDTechEx event, Phillip Hill covers presentations from Intrinsiq Materials, Konica Minolta Advanced Layers Inc., Merck Ltd., and IDTechEx

Rethinking OLED lighting’s future by Lawrence Gasman

AMOLED TV market will reach $15.5 Billion by 2020 by Jennifer Colegrove

Last Word: Missed opportunities by Chris Williams

Display Industry Calendar

Issue 76

Letter from the publisher: The glass is half full…by Mark Fihn

News from around the world: Optomec, SGIA Expo, Ohio State University, Harvard, Fraunhofer, Queen’s University, ETH Zurich, Apple, Peratech, University of Buffalo, Noxgear, University of Bristol, Cambrios/Novaled, G24 Innovations, University of Illinois, cynora, Yole Développement, TU Darmstadt, NIMS Electronic Functional Materials Group, Nanyang Technological University, LG Electronics, and Chinese Chemical Society/German Chemical Society/Chemical Society of Japan/Royal Society of Chemistry/American Chemical Society

Smart Fabrics, April 17-19, 2013, San Francisco, California; In the first of two reports, Phillip Hill covers presentations from Eeonyx Corporation, XS Labs, and Infinite Corridor Technology

Tangible, Embedded and Embodied Interaction, February 10-13, 2012, Barcelona, Spain; Phillip Hill covers presentations from MIT Media Lab, Queen’s University/Northwestern University, and Technische Universiteit Eindhoven/Radboud University

Flexible & Printed Electronics Conference, January 29 – February 1, 2013, Phoenix, Arizona; In the second of three reports, Phillip Hill covers presentations from Clemson University, Brewer Science Inc., VTT Technical Research Centre, Lux Research, Western Michigan University, Novaled AG, Georgia Institute of Technology, Solarmer Energy Inc., Coatema Coating Machinery GmbH, Cambrios Technologies, University of California at Los Angeles, Plastic Logic, E Ink, Toppan Printing, LIM Liquids in Motion GmbH, Opalux Inc., IHS, Kimoto Tech Inc., MicroLink Devices Inc., Thin Film Electronics ASA, PARC, CEA-Liten, American Semiconductor Inc., Body Media, University of California at Berkeley, General Electric Global Research, Physical Optics Corporation, WEEL Technologies, Swansea University, DuPont Electronics and Communications, FUJIFILM Dimatix Inc., Electrox, Holst Centre, Beneq Oy, SAES Getters S.p.A., Vitriflex, Polyera Corporation, NIST, Cornell University, Darly Custom Technology, Shocking Technologies, and Intrinsiq Materials

Printed Electronics USA, December 5-6, 2012, Santa Clara, California; In the third of four reports, Phillip Hill covers presentations from IDTechEx, Konica Minolta Advanced Layers, KWJ Engineering Inc., Liquid X Printed Metals, Meggitt Sensing Systems, and Nanoco Technologies

Printed Electronics & Membrane Switch Symposium, October 18-20, 2012, Las Vegas, Nevada; In the first of three reports, Phillip Hill covers presentations from Conductive Compounds Inc., Engineered Materials Inc., Soligie, and Integrity Integration

Plastic Electronics, October 9-11, 2012, Dresden, Germany; In the first of four reports, Phillip Hill covers presentations from Technische Universität Dresden, Canatu, Isovoltaic, VTT Technical Research Centre of Finland, and Heliatek

AMOLED TVs will reach 16.8 million units by 2020 by Jennifer Colegrove

OLED market: A piece of cake… by Ken Werner

The Last Word: What’s in a name? by Chris Williams

Display Industry Calendar

Issue 75

Letter from the publisher: Nanotechnology…by Mark Fihn

News from around the world: Touch Display Research, Flisom, Thimble Bioelectronics, University of Toronto, NanoPhoSolar, University of Wisconsin-Madison/ Florida State University/University of Michigan, KAUST, VG Scienta, PolyPower, University of Illinois, Ecole Nationale Superieure des Mines, VDMA, Magnolia Solar, Brown University, Technische Universität München, Lighthouse, E Ink, GRAnPH Nanotech, University of Sheffield, Evonik/Holst Centre, Clark School Department of Materials Science and Engineering, ToyLabs, Heliatek, Lux Research, Holst Centre, American Graphite Technologies, New Venture Research Corporation, Ulsan National Institute of Science and Technology, IDTechEx, GT Advanced Technologies, State University of New York/Lehigh University/Northwestern University, IHS, Displaybank, Corning, and Cornell

Flexible & Printed Electronics Conference, January 29 – February 1, 2013, Phoenix, Arizona; In the first of four reports, Phillip Hill covers presentations from Avery Dennison, EMD Chemicals, DuPont Teijin Films, Teruo (Ted) Tohma, Panasonic Corporation, Universal Display Corporation, Philips Lighting, PARC, Thin Film Electronics ASA, MC10, BizWitz LLC, Jet Propulsion Laboratory/California Institute of Technology, Lockheed Martin/Air Force Research Laboratory, University of Texas at Austin, Plextronics and OE-A, and Plastic Logic

Printed Electronics USA, December 5-6, 2012, Santa Clara, California; In the second of four reports, Phillip Hill covers presentations from Eeonyx Corporation/Marktek, Graphene Technologies, Holst Centre, and IDTechEx

Conference on Interactive Tabletops and Surfaces, November 11-14, 2012, Cambridge, Massachusetts; Phillip Hill covers papers from UC Berkeley, The University of Electro-Communications, and The University of Tokyo

AIMCAL Web Coating & Handling Conference, October 21-24, 2012, Myrtle Beach, South Carolina; In the third of three reports, Phillip Hill covers presentations from Umicore, Heraeus Precious Metals North America, Saint-Gobain Specialty Films, Binghamton University, and FHR Anlangenbau GmbH

User Interface Software and Technology, October 7-10, 2012, Cambridge, Massachusetts; In the second of two reports, Phillip Hill covers presentations from Cornell University, University of Applied Sciences Upper Austria/Joanneum Research Forschungsgesellschaft m.b.H, MIT Media Lab/MIT Mechanical Engineering, Carnegie Mellon University, and University of California at Berkeley

Printed Electronics Asia, October 2-3, 2012, Tokyo, Japan; In the first of three reports from this IDTechEx event, Phillip Hill covers presentations from adphos Digital Printing GmbH, Beneq, Decathlon/Oxylane, and GSI Technologies

LOPE-C, June 19-21, 2012, Munich, Germany; In the fourth of four reports, Phillip Hill covers presentations from Stora Enso, Holst Centre, MC10 Inc., Terepac Corporation, Thin Film Electronics, Plextronics, Novaled AG, and Aixtron SE

The coming strategic crisis in the silver inks and pastes by Lawrence Gasman

Flexible barrier films for electronics experience by Harry Zervos

Plastic Logic and TOPPAN showcase flexible display tiled for large size by Jennifer Colegrove

Flexible display: On its way to your next phone or tablet. Or maybe not…by Teresa Meek

The Last Word: Print me one for the road will you? by Chris Williams

Display Industry Calendar

Issue 74

Letter from the publisher: I-Zone…by Mark Fihn

News from around the world: Royal Holloway, LG, MIT, Intel/Plastic Logic/Queen’s University, University of Southampton, Samsung, Versatilis, Displaybank, Berkeley Labs, Central Standard Timing, Sherwood and Pallison, Beckman Institute, FlexTech Alliance, EPFL, Mattel, So-Light, Fujifilm, Chevrolet, Empa, Lund University, Penn State University, HZB, Technische Universität München, North Carolina State University, Fraunhofer IAP, Vienna University of Technology, European Commission, Kyushu University, Duke University, Harvard University/University of Exeter, Énergie Matériaux Télécommunications Research Centre, ASB GlassFloor, VG Scientia, PragmatIC Printing, Radboud University Nijmegen, CSIRO/RMIT University, Pioneer, Epigem, Johannes Kepler University, Rutgers University, Brewer Science, Oxford Photovoltaics, Carestream Tollcoating and Advanced Materials, American Semiconductor, Thin Film Electronics, Rudolph/Azores, Dowa, NorTech, Imprint Energy, Heraeus/Fusion, SERELEC/Plastic Logic, XENON, Air Force/FlexTech Alliance, Clemson University/PARC/FlexTech Alliance, FlexTech Alliance/4D Technology, Cal Poly/FlexTech Alliance, NREL, Ultra-tech, California NanoSystems Institute, and IDTechEx 

Symposium on Virtual Reality Software and Technology, December 10-12, 2012, Toronto, Ontario; Phillip Hill covers a paper from University of Bradford/University of Teesside/Shanghai University

Printed Electronics USA, December 5-6, 2012, Santa Clara, California; In the first of four reports, Phillip Hill covers presentations from Acuity Brands Lighting, Adphos Digital Printing GmbH, Arjowiggins Creative Papers, and DuPont Displays

UIST, October 7-10, 2012, Cambridge, Massachusetts; In the first of two reports, Phillip Hill covers presentations from Keio University (x2), Nokia Research Center, and Autodesk Research/University of Alberta/University of Toronto

LOPE-C, June 19-21, 2012, Munich, Germany; In the third of four reports, Phillip Hill covers presentations from Fraunhofer Institute for Laser Technology ILT, VTT Technical Research Centre of Finland, Ecole Nationale Supérieure des Mines de St-Etienne (EMSE)/Centre de Microélectronique de Provence (CMP), adphos Digital Printing GmbH, Holst Centre, Toba Co. Ltd., Tampere University of Technology, and Beneq

SID International Symposium, June 5-8, 2012, Boston, Massachusetts; In this final report, Phillip Hill covers the pick of the best of the poster presentations from National Chiao Tung University/National Nano Device Laboratories, Korea University, National Chiao Tung University, Pusan National University, Korea Electronics Technology Institute/Dongguk University-Seoul/Chung-Ang University, AU Optronics Corp., Asahi Glass Co., Ltd./AGC America Inc., Ghent University/IMEC, Hong Kong University of Science and Technology, Academia Sinica/National Taiwan University/National Chiao Tung University, National Taiwan University/Yuan Ze University, and Kyushu University/Nissan Chemical Industries

The prospects for flexible glass have never been better by Lawrence Gasman

Flexible PV: Three-fold growth in the next 5 years by Harry Zervos

The Last Word: Out of sight, out of mind…by Chris Williams

Display Industry Calendar

Issue 73

Letter from the publisher: January 2005…by Mark Fihn

News from around the world: Stanford University, NanoMarkets, Displaybank, Cornell, High Energy Synchrotron Source, Freescale Semiconductor, McCormick School of Engineering, NanoLumens, Oak Ridge National Laboratory, MasterCard Worldwide, Swiss National Science Foundation, Microtips, Picosun, Rice University, National Taiwan University, Epson/Plastic Logic, University of Texas, CuteCircuit, Asada Mesh, Georgia Institute of Technology, Showa Denko, Esquire, Seashell Technology, Nedap Retail, cynora, Hong Kong Polytechnic University, University of Illinois, IDTechEx, Printed Electronics USA 2012, University of Delaware, Princeton, SouthWest NanoTechnologies, Penn State, Absurdee, Lawrence Berkeley National Laboratory, Haydale, Lux Research, PragmatIC Printing, Ames Laboratory, Purdue University, Rice University, E Ink, Rolith, University of Pennsylvania, Global OLED Technology/Kodak. Lund University, Canatu, Planar/Beneq, DNP, NASA, Ames Laboratory, Ultratech/Cambridge Nanotech, FlexTech Alliance, Imperial College London, OSRAM, intelliPaper, Arjowiggins, and Massachusetts Institute of Technology

AIMCAL, October 21-24, 2012, Myrtle Beach, South Carolina; In the second of three reports, Phillip Hill covers presentations from Corning, INER, Kobe Steel, and DuPont Teijin Films

Touch Gesture Motion EMEA Conference, September 12-13, 2012, London, England; Phillip Hill covers presentations at this IMS conference from Nottingham Trent University, and Plasma Quest Limited. The rest of this conference will be covered in our sister newsletter Touch Panel.

LOPE-C, June 19-21, 2012, Munich, Germany; In the second of four reports, Phillip Hill covers presentations from Industrial Technology Research Institute, Liquid X Printed Metals, Inc., DuPont Microcircuit Materials, Fraunhofer Institute for Photonic Microsystems, Selcuk University, Nano and Advanced Materials Institute Limited, Nano-C Inc., National Chung Cheng University, Ynvisible, KAIST, and Loughborough University

SID International Symposium, June 5-8, 2012, Boston, Massachusetts; In the fourth of four reports, Phillip Hill covers presentations from the fourth day of the symposium from Sony Corporation (x2), National Chung Hsing University/ITRI, Asahi Glass Co. Ltd./AGC Glass Europe, Applied Materials GmbH/Merck KGaA/Technische Universität Braunschweig/FhG-IPMS, Sony Corporation, Corning Incorporated (x2), Toshiba Corporation/Toshiba Mobile Display Co. Ltd., and Plastic Logic Ltd

E-mote wear fashions: Putting a new light on fashion design by Louis M. Brill

Notable developments in flexible glass by Lawrence Gasman

Stretchable electronics and electrics for electric vehicles by Peter Harrop

Printed and flexible sensors will exceed $140m in 2013 by Cathleen Thiele

The Last Word of 2012…by Chris Williams

Display Industry Calendar

Issue 72

Letter from the publisher: The future of stand-alone e-readers…by Mark Fihn

News from around the world: CrayoNano, V3Solar, Flinders University, Frost & Sullivan/Luxexcel, Northwestern University/University of Illinois at Urbana-Champaign/Tufts University, University of Bristol, cynora, BMG MIS/Fraunhofer COMEDD, Universal Display/ Duksan Hi-Metal, Plastic Logic, IBM, Displaybank, Nanotech Security, MC10, Wayne State University, KAIST, LG, Oregon State University, National Science Foundation, Harvard, Purdue University, Cornell, Frederic Aspiras, BASF/Max Planck Institute for Polymer Research, Kunshan Hisense Electronics, SATA Airlines/Ynvisible, Imprint Energy/IQT Partnership, 3M, BASF, Rolic/Holst Centre Research, University of Pennsylvania, Merck/Epson Ink, Rice University, NovaCentrix, University of Texas at Dallas, Paul Scherrer Institute/ETH Zurich, IMRE, A*STAR, NanoMarkets, Oxford Photovoltaics, North Carolina State University, Cal Poly/Fujifilm Dimatix/Harper Corporation, NovaCentrix, Blue Spark Technologies, Ceradrop, ArjoWiggins, Adphos, Merck/Seiko Epson, BBC, Futaba, Markets and Markets, Case Western Reserve University, and FlexTech Alliance

The Advanced Engineering UK group of events, November 12-13, 2013, Birmingham, England

AIMCAL Web Coating & Handling Conference, October 21-24, 2012, Myrtle Beach, South Carolina; In the first of four reports, Phillip Hill covers presentations from Beneq, University of Oxford/Plasma Quest Limited, Vast Films, and Vampire Optical Coatings Inc.

SID 50th Anniversary Symposium, September 29, 2012, Los Angeles, California; Phillip Hill covers a presentation from Sungkyunkwan University

Mobile HCI, September 21-24, 2012, San Francisco, California; Phillip Hill covers presentations from KAIST, and Lancaster University/Nokia Research Center/University of Copenhagen/University of Bristol

SIGGRAPH, August 5-9, 2012, Los Angeles, California; Phillip Hill covers a paper from Johannes Kepler University

SIGGRAPH Emerging Technologies, August 5-9, 2012, Los Angeles, California; Phillip Hill covers papers from The University of Electro-Communications, and Keio University/Tokyo University/Massachusetts Institute of Technology

LOPE-C, June 19-21, 2012, Munich, Germany; In the first of four reports, Phillip Hill covers presentations from Thin Film Electronics ASA (Thinfilm), Philips Technologie GmbH, Plextronics, IDTechEx, Yole Développement, YD Ynvisible SA, ISORG, Kematek, Giesecke & Devrient, Heliatek GmbH, and OE-A/Heraeus Precious Metals GmbH

SID International Symposium, June 5-8, 2012, Boston, Massachusetts; In the third of four reports, Phillip Hill covers presentations from the third day of the symposium from ETRI, Yuan Ze University/National Taiwan University, AU Optronics Corporation, The Catholic University of Korea/Yamagata University, Merck KGaA, NthDegree Technologies Worldwide, Sony Chemical and Information Devices Corporation/Sony Corporation, Nagaoka University of Technology/Toray Engineering Co Ltd, National Tsing Hua University/Feng Chia University/Industrial Technology Research Institute, Konica Minolta Technology Center/Konica Minolta Holdings, Panasonic Corporation (x2), Kanazawa Institute of Technology, AU Optronics Corporation (x2), E Ink Corporation/Advantech US Inc., Hewlett-Packard/Hewlett-Packard Laboratories, and Universal Display Corporation

Korea Display Conference, May 22-23, 2012, Seoul, South Korea; Phillip Hill covers presentations from Sungkyungkyunkwan University (SKKU), TOSOH Corporation, and Panasonic

Printed Electronics V3.0: The new PE by Lawrence Gasman

Bringing the emerging graphene value chain together by Khasha Ghaffarzadeh

The market for gold inks by Harry Zervos

Last Word: Who put the plastic in “plastic electronics”?? by Chris Williams

Display Industry Calendar

Issue 71

Letter from the publisher: Visual excitement…by Mark Fihn

News from around the world: Semprius, Imprint Energy, Georgia Tech, Polyera, Phillips 66/SCUT/Solarmer Energy, Xenon, University of Cambridge, DISPLAX, NTNU, Aixtron, NanoMarkets, Imec, LG Display, Fraunhofer, Northwestern University, University of California, Ascent Solar, University of Toronto, Seoul National University, BMBF, Lumex, MIT, Purdue University, SUNY College of Nanoscale Science and Engineering/Ceres Technologies, Optomec, OE-A, University of California/Santa Cruz/Hewlett-Packard Laboratories/3M, LG, Ritmo Mundo, Infinite Power Solutions, Centre for Process Innovation, Displaybank, IDTechEx, Brown University, Rensselaer Polytechnic Institute, UNH/Conductive Compounds,Wayne State University, Beneq, KAIST, Rolic/Holst Centre, Applied Nanotech, University of Waterloo, University of Toronto, NIMS, Solexel, and Umeå University

Emerging Display Technologies Conference, August 13-14, 2012, Santa Clara, California; Phillip Hill covers presentations from FlexTech Alliance, DisplaySearch, Gamma Dynamics, and DuPont

SID LED Lighting Evolution Conference, June 6, 2012, Boston, Massachusetts; Phillip Hill covers presentations at this IMS organized event from Saint-Gobain, Veeco, and GT Advanced Technologies

Designing Interactive Systems, June 11-15, 2012, Newcastle, England; Phillip Hill covers a paper from Philips Research Europe/TU Eindhoven/University of Munich/Smart Future Initiative/Nokia Research Center. Most of this conference will be covered in upcoming issues of our sister newsletters Display Standard and Touch Panel

SID Business Conference, June 4, 2012, Boston, Massachusetts; In the second of two reports, Phillip Hill covers presentations from Corning, Universal Display Corporation, and Applied Materials

SID International Symposium, June 5-8, 2012, Boston, Massachusetts; In the second of four reports, Phillip Hill covers presentations from the second day of the symposium from Corning Incorporated, Industrial Technology Research Institute (ITRI), LG Display Co. Ltd., Cambridge Display Technology, Toppan Printing Co., Ltd., Merck Chemicals Ltd., University of Tokyo, NovaCentrix, Merck KGaA, Orthocone Innovation Technologies AB/Chalmers University of Technology, and Dai Nippon Printing

DisplaySearch Smart TV Conference, May 24-25, 2012, Shenzhen, China; Phillip Hill covers a presentation from DisplaySearch

Conference on Human Factors in Computing Systems, May 5-10, 2012, Austin, Texas; Phillip Hill covers papers from Queen’s University/Carleton University, Queen’s University, RWTH Aachen University, Autodesk Research/Hasso Plattner Institute/University of Toronto, and RMIT University

Wearable Electronics for Biometrics & Medicine, April 11, 2012, San Jose, California; In this report from this FlexTech Alliance organized event, Phillip Hill covers presentations from Lockheed Martin Advanced Technology Laboratories, Avery Dennison Medical Solutions, MC10 Inc, and Palo Alto Research Center

Printed Electronics Europe 2012, April 3-4, 2012, Berlin, Germany; In the fourth of four reports, Phillip Hill covers presentations from ISORG, Lang Consulting Engineering, MC10, Meggitt Sensing Systems, and Nano and Advanced Materials Institute

VRIC, March 28 – April 1, 2012, Laval, France; Phillip Hill covers a paper from Nokia Research Center/University of Cambridge/University of Leeds

Electronic Displays, February 29 – March 1, 2012, Nuremberg, Germany; Phillip Hill covers presentations from Advanced Display Technology, and Organic and Printed Electronics Association (OE-A)

Flexible Electronics & Displays Conference, February 6-9, 2012, Phoenix, Arizona; In the fourth of four reports, Phillip Hill covers presentations from University of Massachusetts, NanoMarkets, Duke University, Cambridge Nanotech Inc., PChem Associates Inc., and Western Michigan University

De-risking investment in materials for the new electronics and electrics by Peter Harrop

Last Word: Look to the heavens for a sign? by Chris Williams

Issue 70

Letter from the publisher: Flexible other stuff…by Mark Fihn

News from around the world: IDTechEx, Karlsruhe Institute of Technology, FlexTech Alliance/Polyera, Panasonic/Sony, Northwestern University, ZBD, Universal Display, Novaled, Humanscale, Henkel Corporation, Flexible Display Center, Sharp/Panasonic, Displaybank, Southwest Nanotechnologies, Duke University, Nanosys/Optical Systems Division of 3M, NanoMarkets, Fraunhofer, Thin Film Electronics, DKN Research, 3M, University of Tokyo, Merck, UCLA, University of Utah, Rice University, Technical University of Hamburg/University of Kiel, North Carolina State University, Altierre, MIT, Universal Display/Plextronics, Berkeley Lab, University of Groningen/Georgia Tech, Lux Research, University of South Carolina, Clemson University, University of Toronto/King Abdullah University of Science & Technology, cynora, UT Arlington, Vanderbilt University, and PragmatIC Printing/ITW

SID Business Conference, June 4, 2012, Boston, Massachusetts; In the first of two reports, Phillip Hill covers presentations from OLED Association, CBRITE, and Ukai Display Device Institute

SID International Symposium, June 5-8, 2012, Boston, Massachusetts; In the first of four reports, Phillip Hill covers presentations from the first day of the symposium from Cambridge University/University College London/Samsung Advanced Institute of Technology, Southeast University, University of Cincinnati/Gamma Dynamics, Fuji Xerox Co., Ltd./FUJIFILM Corporation/NLT Technologies, AU Optronics Corporation, Sony Corporation/Dainippon Screen Mfg. Co. Ltd., 3M Company, Kent Displays, Fujitsu Laboratories Ltd, IGNIS Innovation Inc./Cambridge University, Panasonic Corporation, Seoul National University, Kyung Hee University/KOLON Industries, and Japan Broadcasting Corporation (NHK)

Printed Electronics Europe 2012, April 3-4, 2012, Berlin, Germany; In the third of four reports, Phillip Hill covers presentations from Enfucell, Technische Universität Berlin, IMEC, and Indium Corporation

Flexible Electronics & Displays Conference, February 6-9, 2012, Phoenix, Arizona; In the third of four reports, Phillip Hill covers presentations from Solvay Specialty Polymers, PST Sensors, Acreo, nTact, Phoseon Technology, Cima Nanotech, Heraeus, and MicroChem

Flexible & Stretchable Electronics Workshop 2011, November 15-17, Berlin, Germany; In the fourth of four reports, Phillip Hill covers presentations from Robert Bosch GmbH, and Philips Research Europe

China Display SID Conference, November 6-9, 2011, Kunshan, China; In the fourth of four reports, Phillip Hill covers papers from HP Labs/Phicot Inc., Visionox Tech. Ltd./Tsinghua University (x2), Universal Display Corporation, and South China University of Technology

Plastic Electronics, October 11-13, 2011, Dresden, Germany; In the fourth of four reports, Phillip Hill covers presentations from Novaled AG, Bosch Rexroth, Dresden Microdisplay GmbH, eMagin Corporation, and Technische Universität Dresden

Flexible Displays: Attributes, technologies compatible with flexible substrates and applications by Kaluri Sarma

ITO alternatives to gain speed in $2 billion TCF market by Cathleen Thiele

Last Word: An Olympic-free zone but facing Herculean tasks by Chris Williams

Display Industry Calendar 

Issue 69

Letter from the publisher: Konarka liquidates by Mark Fihn

News from around the world: Bridgestone, Wexler, Infinite Power Solutions, Corning, Peking University/Chinese Academy of Sciences/Duke University, Sharp, Acuity Brands, AGC, Konarka/Dri-Design, 3M, Displaybank, Arkema, CERMAV, Pervasive Displays/Energy Micro, IMRE, Heliatek, NanoMarkets, Princeton University, City University of New York, NanoLumens, Yale University, University of Exeter, PEC4, Northwestern University, University of Florida, Dow Corning/FLEx Lighting, UDC/L-3 Display Systems, and University of Utah 

Smart Fabrics Conference, April 17-19, 2012, Miami, Florida; In the second of two reports, Phillip Hill covers presentations from Sensing Tex, Forster Rohner, Massachusetts Institute of Technology, and WEEL Technologies

Printed Electronics Europe 2012, April 3-4, 2012, Berlin, Germany; In the second of four reports, Phillip Hill covers presentations from Soltecture, De La Rue, Information Mediary Corporation, Textile Research Institute Thuringia-Vogtland, and Cambrios Technologies Corporation

US FPD Smart Displays, February 28-29, 2012, San Diego, California; Most of this conference will be covered in other of our titles, predominantly Display Standard. But here Phillip Hill covers a presentation from Corning.

TEI, February 19-22, 2012, Kingston, Ontario; Phillip Hill covers presentations from Technische Universität Darmstadt, University of Munich, University College Maastricht/Queen's University/Carleton University, Simon Fraser University/Texas A&M University, Royal College of Art, and Parsons The New School for Design

Flexible Electronics & Displays Conference, February 6-9, 2012, Phoenix, Arizona; In the second of four reports, Phillip Hill covers presentations from 3M, Hewlett-Packard Company, Edward Cohen Consulting Inc., NthDegree Technologies, PARC, DuPont Teijin Films, Henkel Corporation, PETEC, Sharp Laboratories of America, and Lehigh University

Flexible & Stretchable Electronics Workshop 2011, November 15-17, Berlin, Germany; In the third of four reports, Phillip Hill covers presentations from University of Ulster at Jordanstown, Centexbel, Daimler AG, and The Institute for Special Textiles and Flexible Materials (TITV)

China Display SID Conference, November 6-9, 2011, Kunshan, China; In the third of four reports, Phillip Hill covers papers from Industrial Technology Research Institute (ITRI), Polymer Vision, Zhejiang University, NHK Science and Technology Research Laboratories, and Hewlett Packard Labs/Hewlett Packard Company

AIMCAL Web Coating Conference, October 23-26, 2011, Reno, Nevada; In the second of two reports, Phillip Hill covers presentations from NovaCentrix, Tera-Barrier Films Pte Ltd, and Beneq

Plastic Electronics, October 11-13, 2011, Dresden, Germany

Inorganic and composite printed electronics is favored by Peter Harrop

Conductive coatings in electronics and energy markets by Lawrence Gasman

Around the world in 80 seconds by Jutta E. Rasp

Last Word: Water, water everywhere; nor any drop to drink! by Chris Williams

Display Industry Calendar

Issue 68

Letter from the publisher: When? by Mark Fihn

News from around the world: Wake Forest Center for Nanotechnology and Molecular Materials, MOEA, Xenon, E Ink/Casala, QD Vision, Eastman/Solutia, DELO, Thin Film Electronics, Furukawa, DisplaySearch, IDTechEx, Samsung, Audi, Optomec, Intrinsiq Materials, SENSOREE, University of Cambridge, Case Western Reserve University, LG Display, UCLA, PragmatIC Printing, IMEC/Holst Centre, Georgia Institute of Technology, University of Tokyo/Tokyo University of Science, DuPont, CEA/CNRS/Université de Lille/Northwestern University, Applied Ventures/Infinite Power Solutions, Georgia Institute of Technology, Alta Devices, Arradiance, USC, MIT, Microsoft, NineSigma, Novaled/Marcus Tremonto, Rusnano/Beneq, CNRS/Université de Strasbourg, COLAE, and NovaCentrix

Smart Fabrics Conference, April 17-19, 2012, Miami, Florida; In the first of two reports, Phillip Hill covers presentations from Adidas, IMEC, and Philips

Printed Electronics Europe, April 3-4, 2012, Berlin, Germany; In the first of four reports, Phillip Hill covers presentations from Bardsley Consulting, CDT, Konica Minolta Technology Center, Applied Materials Italia, IDTechEx, and Novaled AG

Flexible Electronics & Displays Conference, February 6-9, 2012, Phoenix, Arizona; In the first of four reports, Phillip Hill covers presentations from Universal Display Corporation, E Ink, IBM Research, Fraunhofer Institute for Photonic Microsystems IPMS, BizWitz, Lux Research, Hewlett-Packard, and New Jersey Institute of Technology

VRCAI, December 11-12, 2011, Hong Kong, China; Phillip Hill covers a presentation from National University of Singapore

Printed Electronics USA, November 30 – December 1, 2011, Santa Clara, California; In the fourth of four reports, Phillip Hill covers presentations from IDTechEx (x2), Integration Technology Limited, CSIRO, Northfield Automation Systems Inc., and NovaCentrix

Flexible & Stretchable Electronics Workshop, November 15-17, 2011, Berlin, Germany; In the second of four reports, Phillip Hill covers presentations from VDI/VDE Innovation + Technik GmbH, Fraunhofer EMFT, Fraunhofer IZM, and Ghent University

China Display SID Conference, November 6-9, 2011, Kunshan, China; In the second of four reports, Phillip Hill covers papers from Sun Yat-Sen University, Shanghai Jiao Tong University/Beijing National Laboratory for Molecular Science, BOE Technology Group Co Ltd, Chonbuk National University/LG Display, and Shinoda Plasma Co Ltd

SID Vehicle Displays and Interfaces Symposium, October 20-21, 2011, Dearborn, Michigan; Phillip Hill covers three presentations from University of Michigan, and one from Sharp Corporation/Sharp Microelectronics of the Americas

Plastic Electronics, October 11-13, 2011, Dresden, Germany; In the second of four reports, Phillip Hill covers presentations from Acreo AB, Fraunhofer Research Institution for Modular Solid State Technologies, OLED Association, and Swiss Federal Laboratories for Material Science and Technology

OLEDs World Summit, September 26-28, 2011, San Francisco, California; In the third of three reports from this Intertech/PIRA conference, Phillip Hill covers presentations from Universal Display Corporation, Fraunhofer IPMS, Moser Baer Technologies Inc, and Novaled AG

DisplaySearch China FPD Conference, September 8-9, 2011, Shanghai, China; Phillip Hill covers presentations from Corning Incorporated, Henkel China, and DisplaySearch

Metal Oxide Thin-Film Transistors as a key enabler for AMOLED displays by Lawrence Gasman

Stretchable electronics ready for market by Peter Harrop

Last Word: Youm kiddin me royt? Yow ain’t called that? by Chris Williams

Issue 67

Letter from the publisher: Kevlar underpants…by Mark Fihn

News from around the world: Utope Project, US Department of Energy, 3D-Micromac, Blue Spark Technologies, Konica Minolta, Stanford University, Purdue University, Flat Cat Productions, Swinburne University of Technology, Wake Forest University, Oxford Advanced Surfaces, Fujifilm, Tazmo, FlexTech Alliance/Thin Film Electronics/PARC/Western Michigan University/Georgia Tech, Toray, Displaybank, IMEC/Holst Centre, Mitsubishi Plastics, Stanford, Semprius, University of Central Florida, Lumiotec, Thinfilm/PST Sensors, LG Display, IDTechEx, Tanaka Kikinzoku Kogyo, North Carolina State University, Epson, NanoMarkets, National University of Singapore, Polyera, Corning, Samsung Mobile Display, Iowa State University, Thin Film Electronics, Heliatek, NIST, University of Illinois, Konarka Technologies, Solvay/Holst Centre, University of Tokyo, University at Buffalo, and Natcore Technology

Printed Electronics USA, November 30 – December 1, 2011, Santa Clara, California; In the third of four reports, Phillip Hill covers presentations from Paper Battery Company (PBC), Plextronics, Infinite Power Solutions Inc., Soligie Inc., Thin Film Electronics, and Georgia Institute of Technology

3rd Flexible & Stretchable Electronics Workshop 2011, November 15-17, Berlin, Germany; In the first of four reports, Phillip Hill covers presentations from Philips Research Europe, IMEC, MC10, University of Ghent, and Verdant Electronics

China Display SID Conference, November 6-9, 2011, Kunshan, China; In the first of four reports, Phillip Hill covers papers from Peking University (x2), Industrial Technology Research Institute, Shanghai Jiao Tong University, and Zhejiang University

Plastic Electronics, October 11-13, 2011, Dresden, Germany; In the first of four reports, Phillip Hill covers presentations from Philips Research Laboratory, LG Display, Roth & Rau MicroSystems GmbH, and EPFL

Organic Photovoltaics, September 20-21, 2011, Philadelphia, Pennsylvania; In the third of three reports from this Intertech/PIRA conference, Phillip Hill covers presentations from Holst Centre, Argonne National Laboratory, and IMEC

FlexTech Alliance Transparent Conductors Workshop, August 18, 2011, San Jose, California; In the second of two reports, Phillip Hill covers presentations from Chasm Technologies, Nth Degree Technologies, Solarmer Energy, Inc., and Synaptics, followed by some highlights from the panel session. Additional material from Geoff Walker.

IMI Europe Ink Jet Technology Showcase, June 8-9, 2011, Barcelona, Spain; In the fourth of four reports, Phillip Hill covers presentations from Ricoh Printing Systems America, Sepiax Ink Technology GmbH, and SunJet

SID International Symposium 2011, May 17-20, Los Angeles, California; In this final report, Phillip Hill covers the pick of the posters with presentations from South China University of Technology, Ryukoku University/Nara Institute of Science and Technology, Korea University/Cheil Industries Inc., Industrial Technology Research Institute, Samsung Electronics, University of Seoul/Chungwoon University/SK Telecom/Korea Institute of Industrial Technology/Soonsil University, Academia Sinica/National Taiwan University, Seoul National University/Gyeongsang National University, Samsung LCD Netherlands R&D Center/University of Twente, Philips Research/Philips Lighting, and Von Ardenne Anlagentechnik GmbH

Printed and potentially printed electronics to reach $9.4 billion in 2012 by Raghu Das

Paper electronics is successful: Where next? by Peter Harrop

Flexibility and technology by Jutta E. Rasp

Last Word: Don’t bother with the bells and whistles! by Chris Williams

Display Industry Calendar

Issue 66

Letter from the publisher: Biopixels…by Mark Fihn

News from around the world: University of Tokyo, University of Illinois, University of Notre Dame, Stanford, ZBD, Holst Centre and IMEC, Tanaka Precious Metals, National Institute for Materials Science, NDSU/NIST, FlexTech Alliance, Lux Research, FlexTech Alliance/Solarmer Energy, DisplaySearch, Konarka Technologies/Webasto, Metalonix, EPFL, IMEC/Polyera/Solvay, Plextronics/Cambrios, University of Cambridge, Nth Degree Technologies, Bam Labs, LG Display, Berkeley Lab, BASF/Philips, Toyo Ink, PragmatIC Printing, University of Ulster, NASA, and Thin Film Electronics

Printed Electronics USA, November 30 – December 1, 2011, Santa Clara, California; In the second of four reports, Phillip Hill covers presentations from Hitachi Chemical, Polyera, PragmatIC, Applied Nanotech Inc, Blue Nano Inc, and Cambrios Technologies

Conference on Creativity and Cognition, November 3-6, 2011, Atlanta, Georgia; Phillip Hill covers presentations from University of Pennsylvania, and Georgia Institute of Technology

OLEDs World Summit, September 26-28, 2011, San Francisco, California; In the second of three reports from this Intertech/PIRA conference, Phillip Hill covers presentations from DisplaySearch, iSuppli, GE Global Research, and LG Display

Organic Photovoltaics, September 20-21, 2011, Philadelphia, Pennsylvania; In the second of three reports from this Intertech/PIRA conference, Phillip Hill covers presentations from Lux Research, National Renewable Energy Laboratory, Dyesol Inc, Novaled AG, and Heraeus Materials Technology

Emerging Display Technologies Conference, August 16-17, 2011, San Jose, California; In the second of two reports, Phillip Hill covers presentations from DisplaySearch, IGNIS Innovation Inc., and DuPont Displays

Large-area, Organic and Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany; In the fourth of four reports, Phillip Hill covers presentations from Chemnitz University of Technology/Fraunhofer Institute ENAS/SolviCore, Fusion UV Systems GmbH, Institut d’Electronique du Sud, InnoPhysics, Fraunhofer Institute for Solid State Modular Technologies (EMFT), Technische Universität Darmstadt, Plextronics Inc., Fraunhofer Institute for Photonic Microsystems (IPMS), National Electronics and Computer Technology Center, Holst Centre, Bosch Rexroth, Fontys University of Applied Sciences, Fraunhofer Institute for Applied Polymer Research, Fraunhofer Institute for Manufacturing Technology and Advanced Materials, Media University/Linköping University, New Venture Partners, Sunchon National University/Paru Printed Electronics Research Institute, and Fraunhofer Institute for Electronic Nano Systems (ENAS)/Chemnitz University of Technology

IMI Europe Ink Jet Technology Showcase, June 8-9, 2011, Barcelona, Spain; In the third of four reports, Phillip Hill covers presentations from FUJIFILM Imaging Colorants, Global Inkjet Systems, Netzsch Espana, and Olivetti

SID International Symposium, May 17-20, 2011, Los Angeles, California; In this fourth report of four, Phillip Hill covers the fourth day of the conference with presentations from Sony Corporation, Toppan Printing Co., Ltd., Novaled AG/Cambridge Display Technology, LG Chem, Novaled AG, Philips Technologie GmbH, Universal Display Corporation, AU Optronics Corporation, and Institut für Angewandte Photophysik/Fraunhofer Institut für Photonische Mikrosysteme

Smart Fabrics Conference, April 4-6, 2011, London, England; In the fourth of four reports from this Intertech/PIRA event, Phillip Hill covers presentations from Nottingham Trent University, The Institute for Special Textiles and Flexible Materials (TITV), and Forster Rohner AG

Electronic Displays, March 2-3, 2011, Nuremberg, Germany; In the third of three reports, Phillip Hill covers presentations from Institut für Angewandte Photophysik, and Siemens Corporate Technology

CIGS photovoltaics markets by Lawrence Gasman

Last Word: Ask what you can do for technology… by Chris Williams

Issue 65

Letter from the publisher: Cars…by Mark Fihn

News from around the world: University of Cincinnati, University of Toronto, Solutia, Berkeley Lab, Nordson MARCH, IMEC, Displaybank, IDTechEx, DuPont, FlexTech Alliance, Samsung, Optical Society of America, Caltech, RD&IP, NanoLumens, Aculon, Swiss Federal Laboratories for Materials Science and Technology, Osram, Infinite Power Solutions, ITRI, ASU/University of Hong Kong, University of Surrey/Warsaw University, Innovia Films/PragmatIC, Cornell, Vorbeck Materials/MWV, AUO, Stanford, Nokia, NanoMarkets, iSuppli, Kodak, Fraunhofer, European Commission, HP Labs, NIST, Vapor Technologies, OLED100, UCLA, CRANN, University of Michigan, Thinfilm/Polyera, University of Cambridge, and IPC

Printed Electronics USA, November 30 – December 1, 2011, Santa Clara, California; In the first of four reports, Phillip Hill covers presentations from Plastic Electronic GmbH, University of California at Berkeley, HP Palo Alto/HP Corvallis/Phicot/Power Films, Peratech, and Polymer Vision

AIMCAL Web Coating Conference, October 23-26, 2011, Reno, Nevada; In the first of two reports, Phillip Hill covers presentations from Vast Films Ltd., Corning, Heraeus Materials Technology, and HP Labs

OLEDs World Summit, September 26-28, 2011, San Francisco, California; In the first of three reports from this Intertech/PIRA conference, Phillip Hill covers presentations from Bardsley Consulting, Aixtron, CDT, DuPont Displays, and QD Vision

Organic Photovoltaics, September 20-21, 2011, Philadelphia, Pennsylvania; In the first of three reports from this IntertechPira conference, Phillip Hill covers presentations from Georgia Institute of Technology, Agfa-Gevaert, Nano-C, Inc., and Konarka Technologies, Inc.

Large-area, Organic and Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany; In the third of four reports, Phillip Hill covers presentations from DuPont Teijin Films, University of Ljubljana/National Institute of Chemistry, Fraunhofer Institute for Electronic Nano Systems ENAS/Chemnitz University of Technology/Selçuk University, PChem Associates Inc., University of Cologne, Fraunhofer Institute for Photonic Microsystems (IPMS), Munich University of Applied Sciences, National Physical Laboratory/Imperial College London, Samsung LCD Netherlands R&D Center (UK), Dr. Schenk GmbH Industriemesstechnik, Friedrich Schiller University/Fraunhofer Institute for Applied Optics and Precision Engineering (IOF), Sunchon National University/Paru Printed Electronics Research Institute, EY Technologies, Karlsruhe Institute of Technology, Technische Universität Darmstadt (x2), Nano-C, Inc., Holst Centre/Stork Prints B.V., Ecole Nationale Supérieure des Mines de Saint-Etienne, and Fraunhofer ILT

IMI Europe Ink Jet Technology Showcase, June 8-9, 2011, Barcelona, Spain; In the second of four reports, Phillip Hill covers presentations from Adphos UK, Amica Systems, Collins Ink, D&K Engineering, and FUJIFILM Dimatix

Smart Fabrics Conference, April 4-6, 2011, London, England; In the third of four reports from this Intertech/PIRA event, Phillip Hill covers presentations from Northumbria University School of Design, Technische Universität Berlin/Fraunhofer IZM, ArchiTextile Lab, and University of Southampton

Illuminated Fashionestas light up the night by Louis M. Brill

An update on the SVPVS and a few words on Flexible PV by Jurgen Daniel

Last Word: Quis custodiet ipsos custodies: A reverse Score card for 2011 by Chris Williams

Display Industry Calendar

Issue 64

Letter from the publisher: The video coat…by Mark Fihn

News from around the world: IMEC, Pragmatic/De La Rue, University of Florida, Intertech/PIRA, IMOLA, Cintelliq, Black Eyed Peas, Princeton University, IIMAK, CSEM, Duke University, Chemnitz University of Technology, KAIST, NanoMarkets, Toronto University, Teijin, University of Illinois, UniPixel, OLAE+, Mitsubishi, ITRI, Thinfilm/PARC, NASA, Samsung, Konarka/Webasto, Tera-Barrier Films, NineSigma, Aculon, Philips, and Displaybank

FlexTech Alliance Transparent Conductors Workshop, August 18, 2011, San Jose, California; In the first of two reports, Phillip Hill covers presentations from FlexTech Alliance, Eastman Kodak Company, NanoMarkets, and Cambrios Technologies Inc. Additional material from Geoff Walker

Large-area, Organic and Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany; In the second of four reports, Phillip Hill covers presentations from Tampere University of Technology, University of Applied Sciences/Darmstadt University of Technology, Ilmenau University of Technology, Novaled AG, Industrial Technology Research Institute/National Cheng Kung University, Polymer Vision, Certego GmbH, University of California at Berkeley (x2), Fraunhofer Institute for Applied Polymer Research, University of Ljubljana, Konkuk University, Oxford Lasers Ltd, Sunchon National University/PARU Co. Ltd., Georgia Institute of Technology, DuPont Microcircuit Materials/DuPont Microcircuit Materials, Fraunhofer Institute for Silicon Technology (ISIT), Airbus, ECN Solar Energy/Holst Centre/Technical University of Denmark/Fraunhofer Institute for Solar Energy Systems, CEA-Liten, Leibniz Institute for New Materials, Paru Printed Electronics Research Institute/Sunchon National University/University of California at Berkeley, and National Chung Cheng University/Metal Industries Research and Development Centre

SGIA Printed Electronics & Membrane Switch Symposium, June 14-16, 2011, San Jose, California; In the second of two reports, Phillip Hill covers this conference organized by the Specialty Graphic Imaging Association (SGIA) with presentations from Xennia Technology, Methode Electronics, and Kammann USA

SID International Symposium, May 17-20, 2011, Los Angeles, California; In this third report of four, Phillip Hill covers the third day of the conference with presentations from Sony Corporation (x2), Samsung Mobile Display, LG Display R&D Center, Semiconductor Energy Laboratory/Advanced Film Device Inc. (x2), Universal Display Corporation, LG Display, Samsung Mobile Display, AU Optronics Corporation (x3), Corning Incorporated, Corning Display Technologies, Idemitsu Kosan Co., and KAIST

Flexible Electronics & Displays Conference, February 7-10, 2011, Phoenix, Arizona; In the fourth of four reports from this event organized by the FlexTech Alliance, Phillip Hill covers presentations from Imperial College London, North Carolina State University, Georgia Institute of Technology, Thin Film Electronics ASA, CEA-Liten, University of Texas at Dallas (x2), Assembly Automation Alternatives, PolyIC GmbH, Imperial College London, KAIST, Binghamton University (x2), North Carolina Agricultural and Technical State University (x2), Arizona State University, Orthogonal Inc, Integration Technology, Kyung Hee University, DEL Industrial Adhesives, and General Plasma

Flexible Displays: Future secured by a horse, cucumber-salad and The Isle of Wight, by Jutta E. Rasp

The Importance of Sensors for Flexible Electronics by Jurgen Daniel

Last Word: Does technology necessitate a rewrite of part of the King James Bible? by Chris Williams

Display Industry Calendar

Issue 63

Letter from the publisher: The optimist on a bar stool…by Mark Fihn

News from around the world: eMagin, Universal Display/PPG Industries, Infinite Power Solutions, Rice University, Ocean Thin Films, Plastic Logic, University of Florida, Samsung/Novaled, UIUV, Novaled, University of Leeds, nTact/Holst Centre, and Tokyo Electron/Epson

Emerging Display Technologies Conference, August 16-17, 2011, San Jose, California; In the first of two reports, Phillip Hill covers presentations from Applied Materials, Samsung LCD R&D Center, and Cambrios Technologies Inc.

Large-area, Organic and Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany; In the first of four reports, Phillip Hill covers presentations from Acreo/Lintec Corporation, Ardeje/CEA INES RDI/Hutchinson SA, Solvay SA, Felix Schoeller jr Foto und Spezialpapiere GmbH/Chemnitz University of Technology, Institute Eni Donegani, Merck, Optomec Inc/Sun Chemical, Technische Universität Darmstadt, PolyIC GmbH, PETEC/Oxford Lasers Ltd, Mediterranean University/Istituto di Acustica/National Technical University of Athens/University of Barcelona/University of Southampton/Biosensor srl/Paul Scherrer Institut/EMPA/National Institute for Lasers, Plasma and Radiation Physics, TU Darmstadt, Daetwyler R&D Corporation, NovaCentrix, nTact/FAS, Joanneum Research/Graz University of Technology/Fraunhofer-Einrichtung für Modulare Festkörper-Technologien EMFT/ASULAB, Swansea University, InovisCoat GmbH, and The Hebrew University of Jerusalem

SGIA Printed Electronics & Membrane Switch Symposium, June 14-16, 2011, San Jose, California; In the first of two reports, Phillip Hill covers this conference organized by the Specialty Graphic Imaging Association (SGIA) with presentations from Conductive Compounds, Inc., Ricoh, Henkel Electronic Materials, and Verdant Electronics

eBook & Tablet Market Evolution Conference, May 19, 2011, Los Angeles, California; In this report from this conference jointly organized by IMS and SID, Phillip Hill covers presentations from Bridgestone Corporation, SNRC BV, and SiPix Imaging

SID/DisplaySearch Business Conference, May 16, 2011, Los Angeles, California; Phillip Hill covers presentations from Corning and Coherent

CHI, May 7-12, 2011, Vancouver, British Columbia; Phillip Hill covers papers from Queen’s University, Queen’s University/Arizona State University, RWTH Aachen University, FX Palo Alto Laboratory, and Technische Universität Darmstadt

Membrane Switch and Functional Printing Symposium, March 10-11, 2011, Dusseldorf, Germany; The Membrane Switch and Functional Printing Symposium was organized by ESMA in Düsseldorf. The presentations are catalogued into four different themes: Improving the quality, cost and resolution of screen printing, specific inks and films, status of digital printing and new applications and the way to printed electronics. This summary was prepared by Louis Bollens.

Electronic Displays 2011, March 2-3, 2011, Nuremberg, Germany; In the second of three reports, Phillip Hill covers presentations from Advanced Display Technology GmbH (ADT)/Pforzheim University, Merck, and Texas Instruments Germany

Flexible Electronics & Displays Conference, February 7-10, 2011, Phoenix, Arizona;  In the third of four reports from this event organized by the FlexTech Alliance, Phillip Hill covers presentations from Tampere University, Korea Research Institute of Chemical Technology, Polyera Corporation, Northfield Automation, Coatema, ECD/United Solar Ovonic, GSI, Gamma Dynamics, Cambridge NanoTech, Flexible Display Center at ASU, IMEC, Etched In Time, 3M Company, HarvestMark, Imperial College London, Versatilis LLC, Applied Materials, University of Massachusetts, EPFL, American Semiconductor, Inc., MC10, Inc., and Exponent Electrical and Semiconductors Practice

E-papers and Flexible Displays, January 26, 2011, San Francisco, California; In the second of two reports, Phillip Hill covers papers from Pusan National University, Texas Instruments, and BMW AG

International Display Workshop 2010, December 1-5, 2010, Fukuoka, Japan; In the fourth of four reports, Phillip Hill covers this event sponsored by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the sessions on MEMS & emerging technologies for future displays & devices; flexible substrates; and lighting optics, devices & systems. Presentations from University of Tokyo/Max Planck Institute for Solid State Research, Industrial Technology Research Institute (ITRI) (x2), NHK Science & Technology Research Laboratories/Yamagata University, IMEC/Katholieke Universiteit Leuven/Polymer Vision/Holst Centre/TNO, Sony Corporation, Universitaet Stuttgart/Corning Incorporated, Osaka Prefecture University/Fuso Chemical Co., Ltd./Osaka Municipal Technical Research Institute, and Industrial Technology Research Institute/Epoch Chemtronics Corp.

Printed Electronics USA 2010, November 30 - December 2, 2010, Santa Clara, California; In the fourth of four reports, Phillip Hill covers presentations at this IDTechEx event from Soligie, Sun Chemical, and Thin Film Electronics

Widening government support for printed electronics by Peter Harrop

Last Word: In praise of the written word by Chris Williams

Issue 62

Letter from the publisher: Echoing Mr. Williams…by Mark Fihn

News from around the world: ZBD, ORNL, NanoMarkets, ITRI, Heraeus, ERA-NET Plus, North Carolina State University, University of California, Uppsala University, University of Connecticut, DuPont/NovaCentrix, UCLA, Novaled, UMass Amherst, Tera-Barrier Films, IMRE, Semprius, NIST, Solutia, DuPont/Innovalight, Stanford/Harvard,  Displaybank, University of Illinois at Urbana-Champaign/US Navy/Sandia National Laboratory, DisplaySearch, UDC/Panasonic Idemitsu, UDC, Samsung Mobile Display/UDC, E Ink/Chunghwa Picture Tubes, eMagin/University of Rochester, InStep NanoPower, IPC, Ohio State University, Konica Minolta, Stanford University, Konarka, IGNIS Innovation, University of Toronto, SWeNT/Panasonic, Oregon State University, PragmatIC Printing/Holst Centre, University of Melbourne, EMPA, Ossila, University of Hong Kong, Samsung Mobile Display/Ube Kosan, Sensichips, NikkoIA/Siemens, Thinfilm, PragmatIC, German Flat Panel Display Forum, Organic and Printed Electronics Association, Beneq, SmartKem, Konkuk University/VTT, Nanomatch, and Fujifilm Dimatix

IMI Europe Ink Jet Technology Showcase, June 8-9, 2011, Barcelona, Spain, In the first of four reports, Phillip Hill covers presentations from University of Manchester, Océ, IMPIKA, and Cambridge University

The Future of Touch & Interactivity Conference, May 18, 2011, Los Angeles, California, In this report from this conference jointly organized by IMS and SID, Phillip Hill covers a presentation from University of California at Berkeley

SID International Symposium, May 17-20, 2011, Los Angeles, California, In this second report of four, Phillip Hill covers the second day of the conference with presentations from University of Tokyo, Industrial Technology Research Institute (ITRI), Sony Corporation (x2), Semiconductor Energy Laboratory/Advanced Film Device Inc, Wintek Corporation/Industrial Technology Research Institute, Industrial Technology Research Institute/Corning Incorporated, and Samsung Mobile Display

Smart Fabrics Conference, April 4-6, 2011, London, England, In the second of four reports from this Intertech/PIRA event, Phillip Hill covers presentations from Ohmatex, Future-Shape GmbH, Sefar, and Textile Testing & Innovation LLC

Flexible Electronics & Displays Conference, February 7-10, 2011, Phoenix, Arizona, In the second of four reports from this event organized by the FlexTech Alliance, Phillip Hill covers presentations from UCLA, Eastman Kodak Company, PChem Associates Inc, NovaCentrix, Shanghai Normal University, Mid Sweden University, AIST, Corning, Akron Polymer Systems, 3M Company, DuPont Teijin Films, Holst Centre, Chasm Technologies, Brewer Science, Henkel Corp., Western Michigan University, Merck Chemicals, and Hewlett Packard Laboratories

Printed Electronics USA 2010, November 30 - December 2, Santa Clara, California, In the third of four reports, Phillip Hill covers presentations at this IDTechEx event from MC10, NanoGram Corporation, Navigant Consulting, Paper Battery Company, and SolarPrint

New opportunities in conductive coatings markets by Lawrence Gasman

A display technology that stretches the imagination by Arthur Berman

What have we learnt so far and what can we do better? by Raghu Das

Last Word: Godda goddle’a geer old chab? What do real people think? by Chris Williams

Display Industry Calendar

Issue 61

Letter from the publisher: Printing – to avoid printing…by Mark Fihn

News from around the world: QD Vision, University of Chicago, US Department of Energy, Avery Dennison/Proteus, CopyTele, Companies and Markets, Konarka, Ynvisible, Arizona State University/UDC, University of Florida, Siemens/Semprius, Toshiba, Sony, Delta Electronics, Dyesol/Tata Steel, EMPA, Nippon, Mektron, Fujifilm, NanoMarkets, Organic and Printed Electronics Association, 3D-Micromac, Infinite Power Solutions, Museum of Emerging Science and Innovation, and Thinfilm/PARC.

SID International Symposium, May 17-20, 2011, Los Angeles, California; In this first report of four, Phillip Hill covers the first day of the conference with presentations from Toshiba Corporation, Qualcomm MEMS Technologies Inc., Opalux Incorporated/University of Toronto, Ricoh Company, Bridgestone Corporation/Delta Electronics Inc./Kyushu University, Samsung Mobile Display, Industrial Technology Research Institute, Gamma Dynamics/University of Cincinnati, Samsung LCD Netherlands R&D Center, Samsung Mobile Display/EnSilTech Corporation, South Industrial Technology Research Institute, University of Tokyo, Industrial Technology Research Institute (ITRI), AU Optronics Corporation, Sony Corporation, and NHK Science and Technology Research Laboratories

Smart Fabrics Conference, April 4-6, 2011, London, England; In the first of four reports from this Intertech/PIRA event, Phillip Hill covers presentations from Intertech/PIRA, Innovalley, Clothing+, Anke Loh, CeNTI, and Smart Garment People

Flexible Electronics & Displays Conference, February 7-10, 2011, Phoenix, Arizona; In the first of four reports from this event organized by the FlexTech Alliance, Phillip Hill covers presentations from ARPA-E, DisplaySearch, GE, E Ink, Lux Research, RPO, IDTechEx, Holst Centre/TNO, Solarmer Energy Inc, Imperial College, Sumitomo Chemical Co., Ltd, National Tsing Hua University, Hewlett-Packard Company, PARC (x2), FUJIFILM Dimatix, Inc, US Army ARDEC, DuPont Photovoltaic Solutions, KAIST, LuxingTek, and UCLA

TEI’11, January 22-26, 2011, Funchal, Portugal; In the second of two reports, Phillip Hill covers papers from State University of Rio de Janeiro/Pontifical Catholic University of Rio de Janeiro/Federal University of Juiz de Fora, Queen’s University/Disney Research, School of Interactive Arts and Technology, MIT Media Lab/University of Art and Industrial Design, and Carnegie Mellon University

Chemicals and Materials for Printed Electronics, January 19, 2011, Manchester, England; This event was organized by the UK’s Electronics, Sensors, and Photonics Knowledge Transfer Network (ESP KTN). Phillip Hill covers presentations from Peakdale Molecular, Electronics, Sensors, Photonics KTN, and High Force Research Ltd

International Display Workshop 2010, December 1-5, 2010, Fukuoka, Japan; In the third of four reports, Phillip Hill covers this event sponsored by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the sessions on electronic paper; MEMS & emerging technologies for future displays & devices; and flexible substrates. Presentations from Industrial Technology Research Institute (x2), Samsung Advanced Institute of Technology, Pforzheim University/Bartels Mikrotechnik GmbH/Advanced Display Technology (ADT), University of Cincinnati/Gamma Dynamics Corp., QD Vision, Inc., Toppan Printing, and Bridgestone Corporation/Kyushu University

Printed Electronics USA 2010, November 30 - December 2, 2010, Santa Clara, California; In the second of four reports, Phillip Hill covers presentations at this IDTechEx event from EP Printing Solutions, GSI Technologies, Heliovolt, and IDTechEx

Prinse’10 Seminar, November 23-24, 2010, Oulu, Finland; In the third of three reports from this industry seminar on printed intelligence organized by PrintoCent, an initiative led by VTT Technical Research Centre of Finland, Phillip Hill covers presentations from Beneq, New Venture Partners, Mesens Oy/PrintoCent Manufacturing Affiliate Program, and BASF

6th Global Plastic Electronics Conference & Exhibition, October 19-21, 2010, Dresden, Germany; In the fourth of four reports, Phillip Hill covers presentations from Von Ardenne GmbH, University of Cincinnati, Fraunhofer Institute for Photonic Microsystems, VTT Technical Research Centre/Nordloop Ay, and Von Ardenne GmbH/Fraunhofer Institute Photonic Microsystems

Printed Electronics Asia 2010, October 13-14, Hong Kong, China; In this fourth of four reports, Phillip Hill covers presentations at this IDTechEx event from Printechnologics GmbH, Thin Film Electronics, UR RFID, and VTT Technical Research Centre of Finland

IMID/IDMC/Asia Display, October 11-15, 2010, Seoul, South Korea; In this fourth report of four, Phillip Hill covers papers from Korea Polytechnic University/KAIST, KAIST, Korea University/KAIST, Electronics and Telecommunications Research Institute/Cheongju University/Hanbat National University, Dong-A University (x4), Kyung Hee University, Seoul National University, Ecole Polytechnique Fédérale de Lausanne/Electronics and Telecommunications Research Institute (ETRI)/Micro Resist Technology GmbH, Sungkyunkwan University, Kwangwoon University (x2), LG Display, Korea University, and Kyoto University

Last Word: E-book or tree-book? What do real people think? by Chris Williams

Issue 60

Letter from the publisher: Beneath the skin…by Mark Fihn

News from around the world: SGIA, Philips, Aldrich Materials Science, Beneq/Glaston, Eight19/University of Cambridge, EMPA, EMPA/NPL, Eindhoven University of Technology, Colorado School of Mines, CDT/NUS, Samsung/Evident Technologies, Iowa State University, Solutia, Cambrios/Toray Advanced Film, Hebrew University of Jerusalem, Fraunhofer, Ohio State University, Brookhaven National Laboratory, Carestream Advanced Materials, ITRI, RTI International, NanoMarkets, Harvard University/CSM Instruments, AGC, Pixled, Sony, Cheil Industries, Jusung Engineering, Displaybank, KAIST, Lumex, FlexTech Alliance, GoSolarUSA/University of Missouri, Universal Display, University of Michigan, Plextronics, Lux Research, Stanford University, Mitsubishi Electric, PVI/Epson

Electronic Displays 2011, March 2-3, 2011, Nuremberg, Germany; In the first of three reports, Phillip Hill covers presentations from EuropTec, Novaled, Epson Europe Electronics GmbH, and University of Stuttgart/Corning Incorporated

SPIE: E-papers and Flexible Displays, January 26, 2011, San Francisco, California; In the first of two reports, Phillip Hill covers papers from University of Cincinnati, Bridgestone Corporation, University of Central Florida, IRX Innovations, and University of Applied Sciences Kaiserslautern/Pforzheim University

International Display Workshop, December 1-5, 2010, Fukuoka, Japan; In the second of four reports, Phillip Hill covers this event sponsored by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the session on electronic paper. Presentations from Chunghwa Picture Tubes, AIST, Bridgestone Corporation/Kyushu University, Industrial Technology Research Institute (ITRI), LG Display, Hewlett-Packard, and Tokai University

Printed Electronics USA, November 30 - December 2, 2010, Santa Clara, California; In the first of four reports, Phillip Hill covers presentations at this IDTechEx event from Add-Vision, Inc., Applied Materials, Applied Nanotech, Inc., and Brewer Science

Prinse’10 Seminar, November 23-24, 2010, Oulu, Finland; In the second of three reports from this industry seminar on printed intelligence organized by PrintoCent, an initiative led by VTT Technical Research Centre of Finland, Phillip Hill covers presentations from Nokia Research Center, Imago Group, Enfucell Oy, and Elcoflex

Printed Electronics Asia 2010, October 13-14, Hong Kong, China; In this third of four reports, Phillip Hill covers presentations at this IDTechEx event from CSIRO, Intrinsiq Materials, Kent Displays, and NanoMas Technologies, Inc.

IMID/IDMC/Asia Display, October 11-15, 2010, Seoul, South Korea; In this third report of four, Phillip Hill covers papers from NDIS Corporation/Hoseo University, LG Display, DGIST/Keimyung University, Korea Institute of Science and Technology, InfoVision Optoelectronics (Kunshan) Co., Ltd, Pusan National University/Kyung Hee University, Pusan National University/Samsung Electronics, Yeungnam University, Hoseo University/Pussan National University, ETRI/KITECH, National Sun Yat-Sen University/Industrial Technology Research Institute, NOROO Holdings R&D Center/Electronics and Telecommunications Research Institute, and Kyung Hee University

Silver Inks and Pastes: Opportunities despite the secession by Lawrence Gasman

Ready to Roll by Davor Sutija, Mark James. Vishal Shrotriya, and Chris Giacoponello

Issue 59

Letter from the publisher: Wearing light…by Mark Fihn

News from around the world: NanoPhotonica, KAIST/Georgia Institute of Technology, University of Minnesota, Displaybank, Stanford University, Ching Tang, AUO, Frost & Sullivan, Victrex, Oxford PV, NIST, NanoMarkets, Samsung, PARC, Solar&Energy, Applied Materials, OLEDS World Summit, EPFL, MIT, MC10, Princeton University Macroelectronics Group, Hussein Chalayan, Alina Ene, Anastasia Radevich, Jeremy Scott, Dorith Sjardijn, UC Berkeley, and OE-A

Prinse’10 Seminar, November 23-24, 2010, Oulu, Finland; In the first of three reports from this industry seminar on printed intelligence organized by PrintoCent, an initiative led by VTT Technical Research Centre of Finland, Phillip Hill covers presentations from VTT (x2), BASF, and Nordloop

6th Global Plastic Electronics Conference & Exhibition, October 19-21, 2010, Dresden, Germany; In the third of four reports, Phillip Hill covers presentations from Hochschule der Medien/Varta Microbattery GmbH, Organic Spintronics, MicroChem Corp/PETEC, CEA LITEN, and PolyIC GmbH

Printed Electronics Asia 2010, October 13-14, 2010, Hong Kong, China; In this second of four reports, Phillip Hill covers presentations at this IDTechEx event from Eco Engineering, E Ink Corporation, FUJIFILM Dimatix, Inc., Germany Trade & Invest, Hong Kong University of Science and Technology, and IDTechEx

IMID/IDMC/Asia Display, October 11-15, 2010, Seoul, South Korea; In this second report of four, Phillip Hill covers papers from Toppan Printing, Kent State University/Korea Institute of Machinery & Materials, Max Planck Institute for Solid State Research, Hewlett-Packard Company/Hewlett-Packard Laboratories, Applied Nanotech Inc., Advanced Institute of Convergence Technology/Hanyang University, Pohang University of Science and Technology (POSTECH), Samsung Mobile Display, LG Display, AU Optronics Corp., Konkuk University, DuPont Displays, Chung-Ang University/Pohang University of Science and Technology (POSTECH), Kyushu Institute of Technology, PETEC, The University of Tokyo/Max Planck Institute for Solid State Research, KAIST/ETRI, LG Display, and NDIS Corporation/Hoseo University

Organic and Large Area Electronics Concertation Meeting, June 14-15, 2010, Brussels, Belgium; In the fourth of four reports, Phillip Hill covers this EU Organic and Large Area Electronics (OLAE) cluster meeting with presentations from the following projects: Chip2Foil, e-LIFT, OPERA, PolyMAP, PRODI, and Fast2Light

SID Display Week 2010, May 25-28, 2010, Seattle, Washington; In this final report, Phillip Hill covers the pick of the best from the poster sessions: National Taiwan Normal University/National Chung Hsing University/Industrial Technology Research Institute, Samsung Advanced Institute of Technology, University of Colorado, ImageandMaterials Inc./ETRI/Korea Aerospace University, Industrial Technology Research Institute (x2), Gamma Dynamics/University of Cincinnati, AU Optronics Corporation, and National Chiao Tung University/ChiMei Optoelectronics Corp.

Printed Electronics Europe 2010, April 13-14, 2010, Dresden, Germany; In this fourth of four reports, Phillip Hill covers presentations at this IDTechEx event from IDTechEx (x2), Hewlett-Packard Labs Power Films, Inc., Xennia, and National Institute of Standards and Technology

Encapsulation and flexible substrates: Organic and dye-sensitized photovoltaics by Lawrence Gasman

Printed Electronics widens its scope by Peter Harrop

The enthusiasm is back – but where’s the beef? by Norman Bardsley

Printed electronics industry onto the next level: Leonardo da Vinci, a worm, zinc and working at atmospheric pressure…by Jutta E. Rasp

Last Word: Technology’s great – when it works! by Chris Williams

Display Industry Calendar

Issue 58

Letter from the publisher: The elusive flexible display…by Mark Fihn

News from around the world: FlexTech Alliance/E Ink/ Polyera/Imperial College of London, University of Texas at Austin, C3nano, Unidym/Wisepower, PragmaticIC Printing/Nano ePrint, AUO, University of Michigan, Research Frontiers, Novaled, Verbatim, Moser Baer/UDC, NanoMarkets, E2M Technology, BAE Systems, Fraunhofer Institute for Laser Technology, SouthWest Nanotechnologies, Versatilis, Riken Advanced Science Institute/University of Tokyo, Liquavista/Samsung, Purdue University, Oxford Photovoltaics, Aalto University, US Department of Energy/UDC, Rohm, North Carolina State University, Moonlight Cushion, Plastic Logic, Delta Electronics, Tera-Barrier Films, Samsung, Northwestern University/University of Illinois, St Andrews University, Vega Wang, Chitose Institute of Science and Technology, Brookhaven/Los Alamos National Laboratory, Berkeley Lab/Caltech, Thorn Lighting/PETEC, Lux Research, Displaybank, and IMEC

TEI’11, January 22-26, 2011 Funchal, Portugal; In the first of two reports, Phillip Hill covers papers from Simon Fraser University, Carnegie Mellon University, Carnegie Mellon University/Disney Research, University of Colorado, Keio University, MIT Media Lab/Harvard University, and Queen’s University

International Display Workshop 2010, December 1-5, 2010, Fukuoka, Japan; In the first of four reports, Phillip Hill covers this event sponsored by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the sessions on LC science and technology; active matrix displays; FPD manufacturing, materials & components; and OLEDs. Presentations from Kogakuin University, Advantech US Inc, Samsung Advanced Institute of Technology/Yonsei University, Sungkyunkwan University, Samsung Electronics (SAIT)/Cheil Industries Inc., Kyushu University, Sony Corporation, Samsung Mobile Display, Korea University/Cheil Industries Inc., KAIST, and Semprius, Inc.

IMI Europe Digital Printing Week, October 25-29, 2010, Lisbon, Portugal; In the second of three reports, Phillip Hill covers presentations from Eastman Kodak, Phoseon Technology, and Integration Technology Ltd

OLEDs World Summit 2010, September 27-29, 2010, San Francisco, California; In the third of three reports, Phillip Hill covers presentations from Veeco, VTT Technical Research Centre of Finland, Unidym, and Applied Materials

Organic and Large Area Electronics Concertation Meeting, June 14-15, 2010, Brussels, Belgium; In the third of four reports, Phillip Hill covers this EU Organic and Large Area Electronics (OLAE) cluster meeting with presentations from the following projects: ERANET+, ONE-P, INGENIOUS, BioEGOFET, PHOTO-FET, Interflex, and PLACE-IT

Large-area, Organic and Printed Electronics Convention, May 31-June 2, 2010, Frankfurt, Germany; In this final report, Phillip Hill covers day three of the event with presentations from Neotech Services MTP, LP3 Lasers Plasmas and Photonic Processes, Fraunhofer IZM, Selcuk University, Fraunhofer Institute for Applied Polymer Research, Oxford Lasers Ltd, Sungkyunkwan University, and Swansea University

Printed Electronics Europe 2010, April 13-14, 2010, Dresden, Germany; In this fourth of four reports, Phillip Hill covers presentations at this IDTechEx event from IDTechEx (x2), Hewlett-Packard Labs Power Films, Inc., Xennia, and National Institute of Standards and Technology

Smart skin for land, sea and air vehicles by Peter Harrop

Printed Electronics powers “Car of the Future” by Werner Schulz

Supple and Subtle by David Barnes

Last Word: Quis custodiet ipsos custodes? Who guards the guardians? by Chris Williams

Issue 57

Letter from the publisher: The 7th year…by Mark Fihn

News from around the world: Philips, UC Berkeley, L'istituto Italiano di Tecnologia, University of Delaware/NIST, IDTechEx Printed Electronics, NagraID Security/MasterCard, NanoMarkets, FlexTech Alliance, Polyera/Kent Displays/Simmat, E Ink/Sollink, MIT, Reebok/mc10, Nokia, Amy Winters, Rhyme&Reason, Georgia Tech, Blue Spark, Cambridge Display Technology, Plastic Logic/Liquavista, Shrink Nanotechnologies/University of Chicago, UCLA, PowerFilm Solar, Flexible Display Center/AUO, and FUJIFILM Dimatix

Printed Electronics Asia, October 13-14, 2010, Hong Kong, China; In this first of four reports, Phillip Hill covers presentations at this IDTechEx event from Adidas Wearable Sports Electronics, Hong Kong Applied Science and Technology Research Institute (ASTRI) (x2), and The Chinese University of Hong Kong

Large-area, Organic and Printed Electronics Convention, May 31-June 2, 2010, Frankfurt, Germany; In this fourth report, Phillip Hill covers day three of the event with presentations from Hebrew University of Jerusalem, Solvay, Ghent University, Freudenberg Forschungsdienste KG, Prelonic Technologies, QD Vision, and LEDON OLED Lighting GmbH

SID Display Week, May 25-28, 2010, Seattle, Washington; In this fourth report of four, Phillip Hill covers presentations from day four of the conference. Papers from Hewlett-Packard Company/Hewlett-Packard Laboratories, KaleidoFlex Technologies Inc., Uni-Pixel Display Inc., Fujifilm Dimatix, Kyung Hee University, and Seoul National University

Printed Electronics Summit, May 10-11, 2010, San Jose, California; In this third report of three, Phillip Hill covers presentations from DisplaySearch, Liquavista, and Solarmer Energy Inc.

FINETECH JAPAN, April 14-16, 2010, Tokyo, Japan; In the third of three reports, Phillip Hill covers presentations from Philips Research Laboratory, Novaled, Princeton University/Nanonex Corporation, and Samsung Advanced Institute of Technology

Smart Fabrics, April 14-16, 2010, Miami, Florida; In the fourth of four reports, Phillip Hill covers presentations from Infoscitex Corporation, University of London, Tibtech, Philips Research, and Daimler AG

Flexible Electronics & Displays Conference, February 1-4, 2010, Phoenix, Arizona; In this final report on this FlexTech Alliance event, Phillip Hill covers presentations from Electrox Corp., Western Michigan University, New Way Air Bearings, Sisom Thin Films/Planar Energy Inc, and Printed Electronics Applied Research Laboratory (PEARL)

New applications for conductive carbon nanotube inks: Now possible using standard commercial printing equipment by William Hurley, David Arthur, and Robert Praino

Organic Lighting: A glimpse into the future by Stephen Clemmet

Fashion wear in its best light by Louis M. Brill

Now You See It – Now You Don't by Louis M. Brill

Last Word: OLEDs and flexible products by Sung Kim and Barry Young

Display Industry Calendar

Issue 56

Letter from the publisher: Flexible sound…by Mark Fihn

News from around the world: Nanotek Instruments, Versatilis, RIKEN, St. Andrews University, PARC/Soligie, Hong Kong Polytechnic University, ADTI Media, GE Capital/Finetex EnE, Bruker, Flexpoint, Lenovo, Cambridge Nanotech/FlexTech Alliance, Carestream Advanced Materials, PASTA, Samsung, Kuraray, Tokyo University, Delta, University of Strathclyde, Lumiotec, Ortus Technology, NIST, Osram, Tokyo Electron/Epson, QD Vision/Solvay, MIT, Unidym/Samsung Electronics, Phosphor, University of Cincinnati/Gamma Dynamics, UIUC, AUO, Heraeus/H.C. Starck, and Casual Profanity

IMI Europe Digital Printing Week, October 27-29, 2010, Lisbon, Portugal; In the first of three reports, Phillip Hill covers presentations from Fujifilm Imaging Colorants Ltd., Xaar, Futures (Wales) Ltd., and IT Strategies

ACM Multimedia International Conference, October 25-29, 2010, Florence, Italy; Phillip Hill covers presentations from School of Interactive Arts and Technology, and MIT Media Lab

SID Vehicles and Photons, October 21-22, 2010, Dearborn, Michigan; Phillip Hill covers a presentation from North American Coating Laboratories

Plastic Electronics Conference & Exhibition, October 19-21, 2010, Dresden, Germany; In the second of four reports, Phillip Hill covers presentations from Novaled AG, Thuringian Institute for Textile and Plastics Research (TITK)/Justus-Liebig-University Giessen/Textile Research Institute Thuringia-Vogtland, DisplaySearch, Aristotle University of Thessaloniki, and Robert Bosch GmbH

IMID/IDMC/Asia Display, October 11-15, 2010, Seoul, South Korea; In this first report, Phillip Hill covers papers from Fuji Electric Holdings, NHK Science and Technology Research Laboratories, Max Planck Institute for Solid State Research/Hiroshima University/Nippon Kayaku Co./University of Tokyo, The University of Tokyo, Samsung Electro-Mechanics, LG Display (x2), The Hong Kong University of Science and Technology, Pforzheim University, Kyushu University/Bridgestone Corporation, Polyera Corporation/Northwestern University, Agfa-Gevaert NV, Phicot Inc./Hewlett Packard, and NHK Science & Technology Research Laboratories/Kyodo Printing Co.

OLEDs World Summit, September 27-29, 2010, San Francisco, California; In the second of three reports, Phillip Hill covers presentations from Fraunhofer IPMS, and Acuity Brands Lighting

Displaybank US Conference, September 15, 2010, Santa Clara, California; Phillip Hill covers presentations from Plastic Logic, and Qualcomm MEMS Technologies Inc.

Organic and Large Area Electronics, June 14-15, 2010, Brussels, Belgium; In the second of four reports, Phillip Hill covers this EU Organic and Large Area Electronics (OLAE) cluster meeting with presentations from ENEA, TNO (x2), Centro Ricerche FIAT, and VTT (x2)

SID Display Week, May 25-28, 2010, Seattle, Washington; In this third report of four, Phillip Hill covers presentations from day three of the conference. Papers from Fujitsu Laboratories Ltd., Samsung Advanced Institute of Technology, Samsung Electronics/Konkuk University, Samsung Mobile Display (x2), Sony Corporation, Eastman Kodak, Industrial Technology Research Institute (ITRI), Bridgestone Corporation/Kyushu University, Toshiba Corporation, West Virginia University/Grote Industries Inc., Eastman Kodak/Semprius Inc., and Industrial Technology Research Institute/National Chiao Tung University

Printed Electronics Europe, April 13-14, 2010, Dresden, Germany; In this third of four reports, Phillip Hill covers presentations from Nano ePrint Ltd, Sharp Laboratories of America, Cubic Security Systems Inc., and adt Deutschland GmbH

LOPE-C Dialogue: Klaus Hecker, Stephan Klotz, Wolfgang Clemens, Gerhard Klink, and Thomas Kolbusch

Printed Electronics: Killer applications by Peter Harrop

The Last Word: Dear Santa… What I really want for Christmas is...by Chris Williams

Issue 55

Letter from the publisher: Flexible minds…by Mark Fihn

News from around the world: Armstrong World Industries/UDC, Plextronics, Toshiba, IMEC, A*STAR SIMTech, RUSNANO/Plastic Logic, Samsung, Ministry of Finance, Cambrios/Plextronics, ITRI, Displaybank, Corning, SouthWest NanoTechnologies, Thinfilm/PARC, Toppan Printing, NovaCentrix, Wake Forest University, E Ink, 3M/Printechnologics, UK Technology Strategy Board, 3M, NanoMarkets, UDC/US Army, Ascent Solar/DisaSolar, NEC, Roth & Rau MicroSystems/Holst Centre, TDK, QD Vision/Solvay, National Tsing Hua University, and University of Michigan

Electronics Conference & Exhibition, October 19-21, 2010, Dresden, Germany; In the first of four reports, Phillip Hill covers presentations from InnoPhysics/Fontys University of Applied Sciences, Fraunhofer-Institute for Photonic Microsystems (IPMS), Technische Universität Dresden, and Leibniz-Institut für Polymerforschung

OLEDs World Summit, September 27-29, 2010, San Francisco, California; In the first of three reports, Phillip Hill covers presentations from Bardsley Consulting, Cambridge Display Technology, US Department of Energy, Flexible Display Center at Arizona State University, DisplaySearch, and Cambrios

IMI Ink Jet Technological Showcase, September 8-9, 2010, Baltimore, Maryland; In the second of two reports, Phillip Hill covers presentations from Printed Electronics Now, and SunChemical

Organic and Large Area Electronics Meeting, June 14-15, 2010, Brussels, Belgium; In the first of four reports, Phillip Hill covers this EU Organic and Large Area Electronics (OLAE) cluster meeting with presentations from INFSO, Siemens AG, Thales Avionics LCD, Fraunhofer Institute for Photonic Microsystems (IPMS), IMEC (x2), VTT, Energy Research Centre of The Netherlands (ECN), and VDI/VDE Innovation+Technik GmbH

LOPE-C, May 31-June 2, 2010, Frankfurt, Germany; In this third report, Phillip Hill covers day two of the event with presentations from Merck Chemicals Ltd, Plextronics, Friedrich-Schiller University, FUJIFILM Dimatix, PolyIC, Hewlett-Packard/Phicot Inc, Applied Materials, University of California, VTT Technical Research Centre of Finland, Yonsei University, PChem Associates, and CDT/Sumitomo Chemical

Smart Fabrics, April 14-16, 2010, Miami, Florida; In the third of four reports, Phillip Hill covers presentations from Kimberly-Clark Corporation, Textile Testing & Innovation, EY Technologies, and Smart Garment People

FINETECH JAPAN, April 14-16, 2010, Tokyo, Japan; In the second of three reports, Phillip Hill covers presentations from Merck Chemical Limited, E Ink, and Epistar Corporation

Flexible Electronics & Displays Conference, February 1-4, 2010, Phoenix, Arizona; In the fourth report on this FlexTech Alliance event, Phillip Hill covers presentations from University of Illinois at Urbana/Champaign, Philips Research Europe, Endicott Interconnect Technologies, HP Laboratories, and Novacentrix

IDW ’09, December 9-11, 2009, Miyazaki, Japan; In this fifth of five reports, Phillip Hill covers this conference organized by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the sessions on MEMS, OLEDs, and PDPs. Presentations from University of Cambridge/Nokia Research Centre, Sungkyunkwan University, Korea University/KAIST, Shinoda Plasma Co., Ltd., and Imaging Systems Technology/University of Toledo

Printed Electronics USA, December 1-4, 2009, San Jose, California; In the fifth of five reports, Phillip Hill covers presentations from Navigant Consulting, Asahi Kasei E materials Corporation, NanoMas Technologies, and University of Michigan

Paper Electronics by Peter Harrop

OLEDs and ITO: Will there be a falling out? by Lawrence Gasman

The Last Word: In vino veritas…by Chris Williams

Display Industry Calendar  

Issue 53/54

Double Issue

Letter from the publisher: Flexing some muscle...by Mark Fihn

News from around the world: UIUC/Northwestern Universities, HIGHBIOPOL, PLACE-it Project, Vorbeck Materials, Tsinghua University, Merck, IMRE, Bayer/Osaka University, Kyushu Institute of Technology, Bayer MaterialScience, Applied Materials, DoE, cintelliq, Displaybank, iSuppli, FlexTech Alliance, Organic/Plastic Electronics Research Alliance, sim4tec, LG, Samsung, Plastic Logic, Applied Nanotech, NorTech, Citala, NDSU, Heliatek/FHR, Fraunhofer IPMS, Konarka/IPRI, Eight19, Ascent Solar, FiberCell, Illuminex, SoloPower, Solarmer Energy, New Energy, Ascent Solar, Nanosys/Samsung Electronics, NREL, Nuon/Helianthos, Georgia Institute of Technology, University of Cincinnati, Corning, Rhyme&Reason, CuteCircuit, Luminex, Agent/Konica Minolta, TOPDRAWER Project, Philips, Coherent/Holst Centre, Novaled, GE, Global Research/Konica Minolta, GE Global Research, PETEC, NanoMarkets, Databeans, STELLA Workshop, Aveso, Dynamics, GSI Technologies/NTERA, Teijin Chemicals, Teijin/NanoGram, Darmstadt University of Technology/Heidelberg, H.C. Starck/Heraeus, ETH Zurich, Dublin City University, Mitsubishi Electric, AU Optronics, eMagin, Dow Electronic Materials, UCLA, Pixled, Industrial Technology Research Institute, Carl Zeiss, Applied Nanotech/Ishihara Chemical, NovaCentrix, Bayer MaterialScience/Holst Centre, ConocoPhillips/Center for Organic Photonics and Electronics, Sigma-Aldrich Materials Science, FlexTech Alliance/Clemson,  FlexTech Alliance/NYX, ImTech, Polyonics, Polyera, Graphene Laboratories/CVD Equipment Corporation, InVisage, Florida State University/Optomec, Phicot, University of Illinois, HP, Rice University, and Northwestern University

IMI Ink Jet Technological Showcase, September 8-9, 2010, Baltimore, Maryland; Phillip Hill covers presentations from ST Media Group International, Integration Technology, and Pivotal Resources

Korea Display Conference, July 8-9, 2010, Seoul, South Korea; Phillip Hill covers presentations from iriver, and Interpark

Large-area, Organic and Printed Electronics, May 31-June 2, 2010, Frankfurt, Germany; In this second report, Phillip Hill covers day two of the event with presentations from National University of Ireland, InnoPhysics BV, Enfucell, Lumedy Ltd, G24i, Sony Corporation, NTERA Limited, PETEC (Printable Electronics Technology Centre), and Industrial Technology Research Institute

The Future of Lighting and Backlighting Conference, May 26, 2010, Seattle, Washington; Phillip Hill covers presentations from this IMS/SID organized event: UDC, and Novaled

SID Display Week, May 25-28, 2010, Seattle, Washington; In this second report, Phillip Hill covers presentations from day two of the conference. Papers from Bundesdruckerei GmbH/Samsung Mobile Display, Brunel University/Printed Electronics Ltd, DuPont Displays, QD Vision, Inc., Plastic Logic Ltd., Liquavista BV/Philips Applied Technologies, and Gamma Dynamics/University of Cincinnati

Printed Electronics & Membrane Switch Symposium, May 18-20, 2010, Phoenix, Arizona; In the second of two reports, Phillip Hill covers this SGIA-organized event with presentations from KIWO Inc., MacDermid Autotype Inc., Typotec, and Imagetek Consulting International

Printed Electronics Summit, May 10-11, 2010, San Jose, California; In this second report of three, Phillip Hill covers presentations from Ravensburger, SKYShades, Thin Film Electronics, and Solicore

Smart Fabrics, April 14-16, 2010, Miami, Florida; In the second of four reports, Phillip Hill covers presentations from École Polytechnique de Montréal, Enlighted Designs, Inc., and IHOFMANN

Printed Electronics Europe, April 13-14, 2010, Dresden, Germany; In this second of five reports, Phillip Hill covers presentations from Konkuk University, Ascent Solar, Fraunhofer IST/Fraunhofer IPMS/Fraunhofer ISC, Greatcell Solar SA, Neuber GmbH, and Canatu

FINETECH JAPAN, April 14-16, 2010, Tokyo, Japan; In the first of three reports, Phillip Hill covers presentations from Corning Display Technologies, Samsung Advanced Institute of Technology, YAS Co. Ltd., and ITRI

Flexible Electronics & Displays Conference, February 1-4, 2010, Phoenix, Arizona; In the third of five reports on this FlexTech Alliance event, Phillip Hill covers presentations from Palo Alto Research Center, Imaging Systems Technology, US Army Armaments Research Development and Engineering Center (ARDEC), E Ink Corporation, and Blue Spark Technologies

IDW ’09, December 9-11, 2009, Miyazaki, Japan; In this fourth of five reports, Phillip Hill covers this conference organized by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the sessions on flexible displays, input technologies, and OLED displays. Presentations from Holst/TNO/Swansea University, KAIST, Nara Institute of Science and Technology (NAIST), Samsung Electronics (SAIT), Samsung Mobile Display, and Kanazawa Institute of Technology

Printed Electronics USA, December 1-4, 2009, San Jose, California; In the fourth of five reports, Phillip Hill covers presentations from Add-Vision, Kent Displays, Plextronics, Centrotherm Photovoltaics AG, and IBM T. J. Watson Research Center

Plastic Electronics Europe Conference, October 27-29, 2009, Dresden, Germany; In this fourth of four reports, Phillip Hill covers this Pira International event with presentations from Technische Universiteit Eindhoven, Image Lab Corp., Nanyang Technological University, Nanyang Technological University, Fraunhofer Institute for Applied Polymer Research (IAP), 3M, Solar Coating Machinery, and DuPont Teijin Films

A paradigm shift for the $25 billion outdoor advertising industry by Raghu Das

Thoughts on transparent conductors by Lawrence Gasman and Paul Markowitz

Life – now in 3D! by Jutta E. Rasp

The Last Word: Nature abhors a vacuum! But it ain’t necessarily so…by Chris Williams

Display Industry Calendar  

Issue 51/52

Double Issue

Letter from the publisher: Why we cover eBook readers in this newsletter… by Mark Fihn

News from around the world: Universal Display, UNI-SOLAR, Plextronics, QD Vision, CHA Industries, Methode Development Company, PARC, McGill University/INRS, Sulfurcell, Environment MEPs, Georgia Tech/UIUC/NRL, Innventia, NineSigma, Sony, NIST, Corning, Ferro, Novaled, Princeton University, Duke University, Merck, Kent Displays, DuPont, Advantech, Korean Ministry of Knowledge Economy, Visionox, PETEC, Solutia, FUJIFILM Dimatix, WAC Lighting, HP, Stanford University, Wake Forest University, Rutgers/Linkoping/Umea Universities, Institute for Nanostructured Materials CNR Bologna, Spire Corporation, Armor, and Sunic/Flexible Display Center

Large-area, Organic and Printed Electronics Convention, May 31-June 2, 2010, Frankfurt, Germany; In this first report, Phillip Hill covers presentations from Philips, Nokia Research Centre, Centro Ricerche Fiat, Mekoprint Electronics A/S, BASF Future Business, Lumedy Ltd, GSI Technologies, and Add-Vision

SID Display Week, May 25-28, 2010, Seattle, Washington; Phillip Hill covers presentations from day one of the conference. Papers from Hong Kong University of Science and Technology, Advanced Display Technology GmbH (ADT)/Pforzheim University/Bartels Mikrotechnik GmbH, Nemoptic/Motif, Inc./Uppsala University, ZBD Displays Limited, Princeton University/Universal Display Corporation, ETRI/NeoView Kolon Co. Ltd, Samsung Electronics/Samsung Mobile Display, Industrial Technology Research Institute/National Taipei University of Technology/National Sun Yat-Sen University, and NDIS Corporation/Hoseo University

SID DisplaySearch Business Conference, May 24, 2010, Seattle, Washington; Phillip Hill covers presentations from Universal Display Corporation, DuPont OLED Displays, AU Optronics Corporation, and DisplaySearch

Printed Electronics & Membrane Switch Symposium, May 18-20, 2010, Phoenix, Arizona; In the first of two reports, Phillip Hill covers this SGIA-organized event with presentations from Conductive Compounds, Inc., Sefar, Inc./Heraeus Materials Technology, Nicomatic North America, and IIMAK

Printed Electronics Summit, May 10-11, 2010, San Jose, California; In this first report of three, Phillip Hill covers presentations from Dyesol, Palo Alto Research Center, Eeonyx Corporation, New Venture Research Corporation, and David Fyfe Consulting

Smart Fabrics, April 14-16, 2010, Miami, Florida; In the first of four reports, Phillip Hill covers presentations from Nyx, London College of Fashion, CSIRO Materials Science and Engineering, Dublin City University, and Qinetiq North America

Printed Electronics Europe, April 13-14, 2010, Dresden, Germany; In this first report, Phillip Hill covers presentations from IDTechEx, iRex Technologies, Valtion Teknillinen Tutkimuskeskus (VTT Technical Research Centre), and Solarion AG

Conference on Human Factors in Computing Systems, April 10-15, 2010, Atlanta, Georgia; Phillip Hill covers presentations from Hong Kong Polytechnic University, Carnegie Mellon University/Microsoft Research, KAIST, Deutsche Telekom Laboratories, Carnegie Mellon University, University of St. Thomas, and Queen’s University

Flexible Electronics & Displays Conference, February 1-4, 2010, Phoenix, Arizona; In the second of five reports on this FlexTech Alliance event, Phillip Hill covers presentations from Marc Chason and Associates, Universal Display Corporation, Eastman Kodak, Samsung Mobile Display, Applied Materials, Teijin/NanoGram, NanoMas Technologies/Binghamton University, MC10, and American Semiconductor

Power Saving for Displays, January 26-27, 2010, Oxford, England; Phillip Hill covers this Sharp/SID hosted event with presentations from ZBD, and Liquavista

IDW ’09, December 9-11, 2009, Miyazaki, Japan; In this third report, Phillip Hill covers this conference organized by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the session on flexible displays. Presentations from Hong Kong University of Science and Technology, Southern Taiwan University/MIRDC, Ricoh Co., Ltd., Bridgestone Corporation/Kyushu University, Tera-Barrier Films, Vitex Systems Inc, AU Optronics Corporation, Industrial Technology Research Institute, Semprius Inc./Eastman Kodak/University of Illinois at Urbana-Champaign, and Dai Nippon Printing

Printed Electronics USA, 09 December 1-4, 2009, San Jose, California; In the third of four reports, Phillip Hill covers presentations from Agfa, Fractal Antenna Systems, Hewlett-Packard, Inpria, Samsung Advanced Institute of Technology, Cambridge University, and US Air Force Research Laboratory

Organic Semiconductor Conference, September 28-30, 2009, London, England; In this fourth report of four, Phillip Hill covers presentations from this cintelliq-organized event: NanoTerra, Institute of Nanostructured Materials and Photonics, Institut für Nanostrukturierte Materialien und Photonik/Institut für Silicatforschung, H.C. Starck Clevios GmbH, and PETEC

Symposium on Flexible Organic Electronics, July 8-10, 2009, Halkidiki, Greece; In the third of three reports, Phillip Hill summarizes research papers from Instituto de Telecomunicações/Instituto Superior de Engenharia de Lisboa/Universidade de Coimbra/Instituto Superior Técnico, Aristotle University of Thessaloniki/Vanderbilt University, Korea Electronics Technology Institute, Fraunhofer-Institute for Applied Polymer Research, Helmholtz-Zentrum Berlin für Materialien und Energie GmbH, Angers University/National Hellenic Research Foundation, Aristotle University of Thessaloniki, University of Cambridge/University College London/Nokia Research Centre, Aristotle University of Thessaloniki/University of Liverpool, Soonchunhyang University, Cardiff University/Technical Research Centre of Finland/Institute of Nanostructured Materials and Photonics, Åbo Akademi University, Physical Electronics, VTT Technical Research Centre of Finland, University of Bucharest/Institute for Space Sciences/National Institute for Laser, Plasma and Radiation Physics/Institute for Nonferrous and Rare Metals, Ilmenau University of Technology/Laser Zentrum Hannover/SK Kassetten GmbH, Université de Limoges (x2), Université de Toulouse, and Democritus University of Thrace

Google Nexus One shifting from AMOLED to LCD by Jin Kim

Cutting costs of large-area devices by Paula Doe

Building the market for OLED: SID 2010 by Barry Young

The booming RFID business in 2010 by Peter Harrop

Parallel universe by Jutta E. Rasp

The Last Word: Can we save the world? We’re a bit too busy at the moment… by Chris Williams

Display Industry Calendar

Issue 49/50

Double Issue

Letter from the publisher: \ˈflek-sə-bəl\ by Mark Fihn

News from around the world: Cornell University, Stanford University, University of California at Berkeley, UIUC/University of Pennsylvania, University of Illinois, Fraunhofer Institute, Hiroshima University, MIT, Rice University, Harvard University, UW-Madison, NIST, NIST/NDSU, University of Florida, Philips/Holst Centre, Holst Centre, St Andrews University, Flashwear, Italian Institute of Technology/Istituto per i Processi Chimico-Fisici CNR/University of Messina, Qualcomm, LG Display, AIST, Holst Centre/NeoDec, Mimaki Engineering, Caltech, Innovalight, GE, GE/Konica Minolta, Novaled, Novaled/Trilux, Novaled/Ingo Maurer, Zumtobel, Philips Research/Eindhoven University of Technology, Apple, Mie Industry, Sony/Kyocera, Tottori University/Oike, IDTechEx, DuPont Microcircuit Materials, Sirris/Optomec, Solarmer/Joel Berman Glass Studios, Merck/Plastic Logic, Venture Research Corporation, Solarbuzz, NineSigma, National Nanotechnology Initiative, DisplaySearch, cintelliq, Universal Display, CDT/CIT, Ambicare, Tomark/Hanita, Hitachi High-Technologies/XeroCoat, Global Solar Energy, Universität Freiburg, GigOptix, 3Plast, Cambrios, and Vitex Systems

DisplaySearch US FPD Conference, March 2-3, 2010, San Diego, California; Phillip Hill covers presentations from Samsung Mobile Display, The NPD Group, and Qualcomm MEMS Technologies, Inc.

Flexible Electronics & Displays Conference, February 1-4, 2010, Phoenix, Arizona; In the first of five reports on this FlexTech Alliance event, Phillip Hill covers presentations from Konarka, PARC (Palo Alto Research Center), US Army Research Laboratory, NanoMarkets, NextWindow, Kent Displays, JFMagic, and General Technical Services 

TEI, January 25-27, 2010, Cambridge, Massachusetts; In the second of two reports, Phillip Hill covers presentations from Concordia University/École Polytechnique de Montréal, The University of Waikato, and Technische Universität Darmstadt

IDW ’09, December 9-11, 2009, Miyazaki, Japan; In this second report, Phillip Hill covers this conference organized by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the session on electronic paper. Presentations from DNP/KDDI R&D Lab, Industrial Technology Research Institute (ITRI) (x3), Kent State University, Pforzheim University/Bartels Mikrotechnik GmbH/Advanced Display Technology (ADT), and Kuraray Co. Ltd.

Printed Electronics USA 09, December 1-4, 2009, San Jose, California; In the second of four reports, Phillip Hill covers presentations from Kimberly-Clark Corporation, Plastic Logic, Semprius Inc., Sipix Imaging Inc., G24 Innovations, Intel Labs, Optomec, Organic Spintronics, OTB Solar, and Solarmer Energy

Flexible & Stretchable Electronics Workshop, November 16-18, 2009, Ghent, Belgium; In this third of three reports, Phillip Hill covers posters from this event organized by the STELLA project and IMEC: Ghent University, Hightec AG, and University of Ulster at Jordanstown

Plastic Electronics Europe Conference, October 27-29, 2009, Dresden, Germany; In this third of four reports, Phillip Hill covers this PIRA International event with presentations from FIAT Research Center, Frost & Sullivan, Holst Centre, National University of Singapore, and Royal College of Art/Arrow Science Consulting

Organic Semiconductor Conference, September 28-30, 2009, London, England; In this third report of four, Phillip Hill covers presentations from this cintelliq-organized event: IMEC, Imperial College London, Technical University of Denmark, DuPont Teijin Films, CDT, Brunel University, and EUIT Telecomunicación/Universidad Rey Juan Carlos/Universidad Miguel Hernández/Universidad Politécnica de Madrid

Eurodisplay 2009/IDRC, September 14-17, 2009, Rome, Italy; In the second of two reports, Phillip Hill covers presentations from Applied Nanotech Inc., Ghent University, Crysoptix KK/Kontrakt Ltd/Institute of Crystallography RAS, Industrial Technology Research Institute (ITRI), and Korea University/Hoseo University/Dongjin Semichem Co.

Conference on Nanosciences & Nanotechnologies, July 13-15, 2009, Thessaloniki, Greece; In this second of two reports on this 6th international conference, Phillip Hill summarizes papers from University of Bucharest/Institute for Space Sciences/National Institute for Laser, Plasma and Radiation Physics/Institute for Nonferrous and Rare Metals/Nationale Institute of Research and Development for Optoelectronics, Aristotle University of Thessaloniki (x3), University of Minho/Fraunhofer-Institut Silicatforschung (ISC), National Institute for Optoelectronics, National Hellenic Research Foundation, and Theoretical and Physical Chemistry Institute/Josef Stefan Institute

Symposium on Flexible Organic Electronics, July 8-10, 2009, Halkidiki, Greece; In the second of three reports, Phillip Hill summarizes papers from AIXTRON AG, HORIBA Jobin Yvon, Fraunhofer FEP, Institute of Nanostructured Materials and Photonics/Cardiff University/Technical Research Center of Finland/Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Instituto de Telecomunicações/Instituto Superior de Engenharia de Lisboa/Instituto Superior Técnico, Columbia University, New University of Lisbon, NTERA, CEA/Liten, Technische Universität Dresden, Heliatek GmbH, Karlsruhe Institute of Technology, Holst Centre/TNO, Printed Electronics Arena, and Aristotle University of Thessaloniki

WTEC Workshop, June 30, 2009, Arlington, Virginia; A panel of experts discussed current directions in flexible hybrid electronics in a public workshop organized by the World Technology Evaluation Center, after completing their study to examine the worldwide status and trends in this field, sponsored by the United States National Science Foundation (NSF) and the Office of Naval Research (ONR). Phillip Hill covers this workshop on international assessment of research and development in flexible hybrid electronics with discussions involving University of Texas at Austin, Palo Alto Research Center, Printovate Inc., University of Minnesota, Texas State University, Northwestern University, ONR, and NSF.

Large-area Organic & Printed Electronics Convention, June 23-24, 2009, Frankfurt, Germany; In this fifth report of five, Phillip Hill covers presentations from Giesecke & Devrient, Acreo AB, University of California, Bayer MaterialScience, and Fraunhofer Institute for Applied Polymer Research 

Organic and printed electronics to counter piracy by Klaus Hecker

Time for a dose of market realism in Printed Electronics by Lawrence Gasman

Early printed electronics revisited by Peter Harrop

“Cornu Copia”: Technologies that spoil the user and save the environment by Jutta E. Rasp

The Last Word: “Never mind the quality, feel the width!” by Chris Williams

Display Industry Calendar

Issue 47/48

Double Issue

Letter from the publisher: Record attendance at the FlexTech Alliance conference… by Mark Fihn

News from around the world: FLEXI Awards, IDTechEx, Holst Centre/IMEC/TNO, 3M Display and Graphics, Taiyo America, NanoGram, Fraunhofer Institute, SonoPlot, Extrusion Dies Industries, AIST, Displaybank, NanoMarkets, DisplaySearch, Uni-Pixel, Organic Electronics Association, PETEC/Flexible Display Center, Technology Strategy Board, Art Technology, Department of Energy/UDC, Modistech, So-Light Project, Sony, University of Stuttgart, University of Maine, Texas Instruments, LG Display, Prime View, Skiff, Cambrios, NASA, Petr Kubik, VDMA, Fraunhofer ILT, IBM, NPL, Princeton University, LOMOX, Flexpoint, Nano ePrint/Novalia, Nokia, Unidym, Frost & Sullivan, Semprius/Siemens, New Energy Technologies, Infinite Power Solutions, Innovalight, Tomark/Hanita, Cambridge University/Manchester University/Ludwig-Maximilians University, and University of California, Berkeley

Tangible, Embedded and Embodied Interaction Conference, January 25-27, 2010, Cambridge, Massachusetts; In the first of two reports, Phillip Hill covers presentations from MIT Media Lab (x2), Concordia University, and Carnegie Mellon University

IDW ’09, December 9-11, 2009, Miyazaki, Japan ; In this first report, Phillip Hill covers this conference organized by The Institute of Image Information and Television Engineers, and The Society for Information Display, with papers from the sessions on active matrix displays, and electronic paper. Presentations from CNR-IMM, Sony Corporation, Japan Chemical Innovation Institute/Konica Minolta Technology Center/Toppan Printing Co., Ltd./DIC Corporation/ADEKA Corporation/AIST, NHK Science & Technical Research Laboratories, University of Seoul, Philips Research, iRex Technologies, and Chiba University

Printed Electronics USA 09, December 1-4, 2009, San Jose, California; There were 50-or-so presentations from this IDTechEx-organized conference. Some have already been published in our sister newsletters High Resolution and Touch Panel, and will be in the upcoming issue of Display Standard later this month. In the first of four reports, Phillip Hill covers other presentations specifically flex-related from Adidas Wearable Sport Electronics, IDTechEx (x2), Cubic Security Systems Inc., and InkSure Technologies

Flexible & Stretchable Electronics Workshop, November 16-18, Ghent, Belgium; In this second of three reports, Phillip Hill covers this event organized by the STELLA project and IMEC: presentations from Technische Universität Berlin/Fraunhofer IZM, Arizona State University, IMEC/University of Ghent, Urgo, and IMEC

Plastic Electronics Europe Conference, October 27-29, 2009, Dresden, Germany; In this second of four reports, Phillip Hill covers this PIRA International event with presentations from University of Gent, CreaPhys GmbH, ETH Zurich, Daimler, Varta Microbattery, and Ntera

OLEDs World Summit, September 30–October 1, 2009, San Francisco, California; At this Intertech/PIRA-OLED Association event, in this second of two reports, Phillip Hill covers presentations from L-3 Communications Displays Group, Acuity Brands Lighting, TU Dresden, Novaled, Nanosys, and ULVAC. Steve Jurichich covers additional presentations from AUO, Eastman Kodak, Applied Materials, and Add-Vision

Organic Semiconductor Conference, September 28-30, 2009, London, England; In this second report of three, Phillip Hill covers presentations from this cintelliq-organized event: Palo Alto Research Center, Technical University of Denmark/Technische Universität Braunschweig/ Technische Universität München/Walter Schottky Institut, Indian Institute of Technology Bombay, PrintoCent, Fraunhofer Institute for Photonic Microsystems, Silvaco Europe, sim4tec GmbH/ Institut für Angewandte Photophysik, and Botest Systems GmbH

Eurodisplay 2009/IDRC, September 14-17, Rome, Italy; In the first of two reports, Phillip Hill covers presentations from Nottingham Trent University/Plasma Quest Limited, LG Display R&D Center, Hewlett Packard/Phicot Inc., Sony Corporation, and Japan Broadcasting Corporation (NHK)

Symposium on Flexible Organic Electronics, July 8-10, 2009, Halkidiki, Greece; In the first of three reports, Phillip Hill summarizes papers from Laboratoire de Chimie des Polymères Organiques, Fraunhofer Institute for Applied Polymer Research, Imperial College London/Queen Mary College London/ETH Zürich, Imperial College London, University of Patras/Technological–Educational Institute of Patras, Technion-Israel Institute of Technology/University of California, University of Cambridge/Nokia Research Centre/University College London/Xerox Research Centre of Canada/Nanyang Technological University, VDI/VDE Innovation+Technik GmbH, Technical University of Lodz, Aristotle University of Thessaloniki/Technical University of Lodz, CEA-Liten/Chemnitz University of Technology/ACREO AB, Aristotle University of Thessaloniki, VTT, Huntsman Advanced Materials, Plastic Electronics Foundation, University of Tokyo, University of Calabria/Instituto de Ciencia de Materiales de Madrid/Universidad de Zaragoza, Istituto per lo Studio dei Materiali Nanostrutturati (ISMN)/Istituto per i Processi Chimico Fisici/Northwestern University, Aristotle University of Thessaloniki/Fraunhofer-Institut für Silicatforschung (ISC)/Fraunhofer-Institut für Verfahrenstechnik und Verpackung (IVV)/Alcan Technology & Management, Holst Centre/Philips Research Laboratories, and Georgia Institute of Technology/University of Arizona

Conference on Nanosciences & Nanotechnologies, July 13-15, 2009, Thessaloniki, Greece; In this first of three reports on this 6th international conference, Phillip Hill summarizes papers from the European Commission, Cornell University, Imperial College London (x2), Aristotle University of Thessaloniki, University of Bucharest/National Institute for Materials Physics, University of California Berkeley, University of Ioannina/University of Patras, University of Ulster, and University of Minho

Large-area Organic & Printed Electronics Convention, June 23-24, 2009, Frankfurt, Germany; In this fourth report of five, Phillip Hill covers presentations from PolyPhotonix, Certego GmbH, Photonics Research Institute AIST, Industrial Technology Research Institute (ITRI), University of Tokyo, and PETEC

SID Display Week Symposium, June 2-5, 2009, San Antonio, Texas; In this fifth report of five, Phillip Hill covers posters from Samsung Mobile Display/YAS Co., Ltd, Industrial Technology Research Institute/National Chiao Tung University, Seiko Epson Corporation, Nanyang Technological University/Institute of Microelectronics, Chunghwa Picture Tubes, Samsung Advanced Institute of Technology/ Sungkyunkwan University, Pohang University of Science and Technology (POSTECH), Kent State University, Korea University/Electronics and Telecommunications Research Institute, Kyung Hee University/Unidym Inc., Seiko Epson Corporation, and Industrial Technology Research Institute (ITRI)

Is there room for OLEDs in Solid-State Lighting? by Norman Bardsley

A nanomaterial-based rival to ITO just over the horizon by Lawrence Gasman

Printed RFID in 2010 by Peter Harrop

“Citius, Altius, Fortius”… by Jutta E. Rasp

The Last Word: Watch out, watch out: There’s an Apple about… by Chris Williams

Display Industry Calendar

Issue 45/46

Double Issue

Letter from the publisher: Another Asian industry… by Mark Fihn

News from around the world: Marjan Kooroshnia, Lynne Bruning, Kirk Mueller, CuteCircuit, Atton Conrad, Philips, Pixel Qi, Delta, Qualcomm, MOEA/ ITRI, ITRI/AUO/Elan, ITRI, Kodak/LG, Barnes & Noble/Spring Design, Aluratek, Sharp, Applied Materials/Merck/Braunschweig University, University of Pennsylvania, Nano ePrint, IDTechEx, Plastic Electronics Foundation, University of Rome, Fraunhofer, Stanford, MIT, Intertech/PIRA, Toppan Printing/Tomoegawa, QD Vision, Xerox Research Centre of Canada, NanoMarkets, Grote, FlexTech Alliance, FlexTech Alliance/South Dakota School of Mines, NEMO Project, G24i, Solarmer, Unidym/Samsung, Emue Technologies, GSI Technologies/NanoChromics, and Liquavista/Applied Materials

Flexible & Stretchable Electronics Workshop, November 16-18, Ghent, Belgium; In this first of three reports, Phillip Hill covers this event organized by the STELLA project and IMEC: presentations from Freudenberg Forschungsdienste KG, University of Illinois at Urbana/Champaign, Ghent University, Harvard University, IMEC, Daimler, and Philips Applied Technologies 

Plastic Electronics Europe Conference, October 27-29, 2009, Dresden, Germany; Phillip Hill covers this Pira International event with presentations from Imperial College, Sincrotone, Stanford University, European Commission, plastic electronic GmbH, VTT Technical Research Centre of Finland, OLED Association, AGC Glass Europe, University of Pisa, Philips, Semprius, NanoMarkets, Polymer Vision, Novaled, Palo Alto Research Center, Max Planck Institute for Solid State Research, University of Cambridge

Symposium on Vehicle Displays, October 15-16, 2009, Dearborn, Michigan; Phillip Hill covers presentations from General Motors, AU Optronics, and Corning

OLEDs World Summit, September 30–October 1, 2009, San Francisco, California; At this IntertechPira/OLED Association event, in this first of two reports, Phillip Hill covers presentations from Aixtron, Semprius, Ignis, QD Vision, DisplaySearch, CDT, and Corning Display Technologies; Steve Jurichich covers additional presentations from Samsung, DisplaySearch, and UDC

Organic Semiconductor Conference, September 28-30, 2009, London, England; Phillip Hill covers presentations from this cintelliq-organized event: European Commission, Philips, Panasonic Electric Works Co. Ltd., cintelliq, Zumtobel, Universal Display Corporation, Fraunhofer Institute for Photonic Microsystems/Fraunhofer Institute for Applied Optics and Precision Engineering/Mobintech A/S/Universität Köln/Microoled/University of Edinburgh, Sungkyunkwan University, Kyung Hee University, Heliatek, Konarka, Fraunhofer Institute for Applied Polymer Research, Cryscade Solar Ltd., Institute for Microstructural Sciences/Institute for Chemical Process and Environmental Technology, Carben Semicon Ltd./Cryscade Solar Ltd., PolyIC, and Max Planck Institute for Solid State Research

Towards 5-micron patterning for plastic electronics, July 15, 2009, Manchester, England by Eifion Jewell 

SMART Packaging: Adding functionality to printed packaging, July 8, 2009, Nottingham, England by Eifion Jewell 

Large-area Organic & Printed Electronics Convention, June 23-24, 2009, Frankfurt, Germany; In this third report of three, Phillip Hill covers presentations from Schreiner VarioLight, IDTechEx, COPACO, PolyIC, manroland, CROSSLINK, Bizerba Solutions Inc., Stora Enso Oyj, Novaled, Philips Research Laboratory, Fraunhofer-Institut für Photonische Mikrosysteme IPMS, FUJIFILM Dimatix, Coatema, TNO Holst Centre, GSI Technologies, VTT Technical Research Centre of Finland, H.C. Starck Clevios GmbH, and Orgacon

Plastic Electronics Asia, June 8-10, 2009, Taipei, Taiwan; In this third report of three, Phillip Hill covers presentations from Universal Display Corporation, Flexible Display Center (FDC) at Arizona State University, IMEC, SiPix Imaging, Bridgestone Corporation, Dyesol Industries, University of Hong Kong, National Taiwan University, Hong Kong Polytechnic University, and Electronics and Telecommunications Research Institute

SID Display Week Symposium, June 2-5, 2009, San Antonio, Texas; There were almost 100 papers or posters this year covering flexible displays from companies and universities alike, a considerable increase on 2008. In this fourth report of five, Phillip Hill covers papers and posters from Motorola/University of Cincinnati, Samsung Mobile Display, eMagin Corporation/US Army Research, AU Optronics Corp., Industrial Technology Research Institute (ITRI), Hewlett-Packard Labs/Hewlett-Packard Co., Stanford University, DuPont Displays Inc./Dainippon Screen Manufacturing, Princeton University, Samsung Mobile Display, Industrial Technology Research Institute, Flexible Display Center at Arizona State University/Universal Display Corporation/Army Research Laboratory, Samsung Mobile Display/EnSilTech Co., Hong Kong University of Science and Technology, Palo Alto Research Center, Tokai University/Brother Industries, Korea University/Cheil Industries Inc., and ZBD Displays Ltd

Printed Electronics Europe, April 7-8, 2009, Dresden, Germany; In the third of three reports, Phillip Hill covers this IDTechEx-organized event with presentations from SBf Spezialleuchten Wurzen GmbH, Sefar AG, Sony Corporation, Ecole Polytechnique Fédérale de Lausanne, Thin Film Electronics, Toumaz Technology Ltd., Trident Industrial Inkjet, Cambridge University/Plasma Quest Ltd., University of Southampton, and VTT

Smart Fabrics Conference, March 10-12, 2009, Rome, Italy; In this fourth of four reports, Phillip Hill covers presentations from Puma AG, University of Art and Industrial Design, Philips Lumalive, Arrow Science Consulting/Royal College of Art, Smartex, Fibretronic Limited, and Solarmer Energy

Flexible Electronics & Displays Conference, February 2-5, 2009, Phoenix, Arizona; In this fourth report of four from this FlexTech Alliance event, Phillip Hill covers presentations from South Dakota School of Mines and Technology, LG Display R&D Center, Japan Broadcasting Corporation (NHK), University of California Berkeley/Industrial Technology Research Institute, Applied Materials/Oregon State University, Princeton University, and NexTech FAS

Printed electronics needs new design rules  by Peter Harrop

Poly-OLED Case Study -- Part 2: The “Work” behind the scenes by Paul Patterson

Is printed electronics a victim of the economy? by Louis Bollens

Organic Photovoltaics nearing mass production by Klaus Hecker

The Last Word: Party time for the UK’s plastic electronics community by Chris Williams

Display Industry Calendar

Issue 43/44

Double Issue

Letter from the publisher: Polymer Vision unfolds… by Mark Fihn

News from around the world: Institute of Physics, Novaled, Universal Display, Entertainment Weekly, iNEMI, Honda, Cambridge NanoTech, Pacific Northwest National Laboratory, Vitex Systems, FUJIFILM Dimatix, RAHN, University of Washington, Inteligensa/Aveso, HP Labs, Philips, Tred Products, Uni-Pixel, FlexTech/Uni-Pixel Displays, Tera-Barrier Films, Arizona State University/University of Oulu, Tyfone, Rogers Corporation, Blue Spark/Novalia, Sony, IDTechEx, Pressmart, MFLEX/Pelikon, Prime View/E Ink, PTB, McMaster University, University of New South Wales, University of Texas, Energy Conversion Devices, DuPont/Applied Materials, Honeywell, KAUST, Seoul National University, dz card/Aveso, RIKEN, University of Illinois, RF Code, Plextronics/Novaled, LG, Future-Shape, Methode Electronics, DNP, NanoMarkets, Intertech/PIRA, Displaybank, DisplaySearch, and In-Stat

Emerging Display Technologies Conference, September 3, 2009, San Jose, California; Phillip Hill covers presentations from DisplaySearch, Corning, Liquavista, and E Ink

Large-area Organic & Printed Electronics Convention, June 23-24, 2009, Frankfurt, Germany; In this second report, Phillip Hill covers presentations from Plastic Logic, Plextronics, Osram Opto Semiconductors, Polyera Corporation/Palo Alto Research Center, University of Manchester, NanoMas Technologies/Binghamton University, Fraunhofer Institute Applied Polymer Research IAP, Chemnitz University of Technology, Sunchon National University/Printed Electronics Research Institute/University of California at Berkeley, Chemnitz University of Technology/CEA-Liten/ACREO, Plextronics, Risø DTU, Fraunhofer-Institut für Silicatforschung ISC, Fraunhofer Institute for Process Engineering and Packaging IVV, Jacobs University, Holst Centre/TNO Science and Industry/Philips Research, Holst Centre, Joanneum Research/Graz University of Technology, Hewlett Packard Laboratories/Phicot, Konkuk University, Laser Zentrum Hannover/Ilmenau University of Technology, Fraunhofer Institute for Reliability and Microintegration IZM, Jeju National University, and Neotech Services MTP

Plastic Electronics Asia, June 8-10, 2009, Taipei, Taiwan; In this second report of three, Phillip Hill covers presentations from National Cheng Kung University, National Chiao Tung University, ITRI, Kodak, Kyung Hee University, Konarka, Sungkyunkwan University, Toin University of Yokohama/Peccell Technologies, and Fraunhofer Institute for Photonic Microsystems

SID Display Week Symposium, June 2-5, 2009, San Antonio, Texas; There were nearly 100 papers this year covering flexible displays from companies and universities alike, a considerable increase on 2008. In this third report, Phillip Hill covers day three papers from Seiko Epson Corporation, Princeton University, DuPont Displays, Samsung Electronics, Ecole Polytechnique Palaiseau/ Université Paris Diderot, Sony Corporation, Palo Alto Research Center, Pohang University of Science and Technology, Hewlett-Packard, Honeywell Electronic Materials/Cambridge Display Technology, Flexible Display Center at Arizona State University/University of Texas at Dallas, Fujitsu Laboratories, and Bridgestone Corporation/Kyushu University

IMI Ink Jet Technology Showcase, June 2-3, 2009, Zurich, Switzerland; Phillip Hill covers presentations from ImageXpert, imaging Technology international Corporation, Olivetti, Sensient Colors, and Cambridge University

SIGGRAPH, August 3-7, 2009, New Orleans, Louisiana; There were one or two presentations relating to flexible substrates at this conference. In this report, Phillip Hill covers presentations from Concordia University/Ecole Polytechnique de Montréal, and Keio-NUS CUTE Center & Mixed Reality Lab of Singapore

FINETECH JAPAN, April 15-17, 2009, Tokyo, Japan; Phillip Hill covers presentations from SiPix, cintelliq, Philips Lighting, Novaled, Saint-Gobain Vitrage, and GE Consumer & Industrial

Printed Electronics Europe, April 7-8, 2009, Dresden, Germany; In the second of three reports, Phillip Hill covers this IDTechEx-organized event with presentations from Heliatek, University of Applied Sciences (HTWK), IDTechEx, Leibniz-Institut für FestKorper und Werkstoffforschung, Interactive Wear, Medixine, Merck Chemicals, Graz University of Technology, Nokia Research Centre, NovaCentrix, NXT, Prime View International, and VTT

Photovoltaics Beyond Conventional Silicon, April 7-8, 2009, Dresden, Germany; In the second of two reports, Phillip Hill covers this IDTechEx-organized event with presentations from Ecole Polytechnique Fédérale de Lausanne, TU Ilmenau, University of Potsdam, University of Southampton, and Würth Solar

Smart Fabrics Conference, March 10-12, 2009, Rome, Italy; In this third of four reports, Phillip Hill covers presentations from Indarra.dtx, De Montfort University, University of Minnesota, Luminex, Linköping University, and Smart Life Technologies

Flexible Electronics & Displays Conference, February 2-5, 2009, Phoenix, Arizona; In this third report of four from this FlexTech Alliance event, Phillip Hill covers presentations from IMEC, Soligie, University of California at Berkeley, NDSU Center for Nanoscale Science and Engineering, IIMAK, State University of New York at Binghamton, Kent Display, Northfield Automation Systems, MicroContinuum, Etched In Time Inc., NanoMas Technologies, and Parelec

Interview with David Chapman from Xaar

Packaging that appeals to all the senses by Peter Harrop

New organic dye developed in China by Daniel Rogers

Poly-OLED Case Study, part 1 by Paul Patterson

Flexible Substrates for Solid-State Lighting by Norman Bardsley

The Last Word: A hop, step, and jump…by Chris Williams

Display Industry Calendar

Issue 41/42

Double Issue

Letter from the publisher: Polymer Vision folds… by Mark Fihn

News from around the world: Sony, Samsung, iRex, Plastic Logic/Olive Software, Barnes & Noble, Bridgestone, Vorbeck Materials, Evident Technologies, Harvard, Philips, Bundesdruckerei Group, University of Tokyo, MIT, TDK, Corning/Soitec, Universal Display, NovaCentrix, Hague/Solterra, Advanced Diamond Technologies, National Tsing Hua University, SRI International/Showa Denko, KAIST, LG/Samsung, OCZ Technology, Smart Textiles Salon, Philips Lumalive, Fraunhofer IZM, University of Texas at Austin/Versatilis, e-Smart Technologies, Phosphor Watches, FlexTech Alliance/Solarmer Energy, FlexTech Alliance/Etched in Time, Polytos, Blue Spark Technologies, Chiba University, NanoGram Corporation, Hong Kong University of Science and Technology, Power Paper, University of Arizona, University of California at Berkeley, Ascent Solar, Intertech/PIRA, DisplaySearch, NanoMarkets, CARO, PETEC, DELO, Shinoda, and CARO

Korea Display Conference; June 25-26, 2009, Seoul, South Korea; Phillip Hill covers presentations from LG Display, Display and Nanosystem Laboratory (DIANA), and Electronics & Telecommunications Research Institute (ETRI)

Large-area Organic & Printed Electronics Convention; June 23-24, 2009, Frankfurt, Germany; In this first report, Phillip Hill covers four of the keynotes from the Organic Electronics Association, the European Commission, Airbus Deutschland, and Merck Chemicals

PrintoCent Inaugural Seminar; June 9, 2009, Oulu, Finland; Phillip Hill covers presentations from Orion Diagnostica, PilotFactory, Oulu Innovation, and PrintoCent

Plastic Electronics Asia 2009; June 8-10, 2009, Taipei, Taiwan; In this first report of three, Phillip Hill covers presentations from SAFC-Pharmorphix, VTT, ITRI, Soligie, Plastic Electronics Foundation, National Chiao Tung University, Prelonic Technologies, Sunchon National University, Dai Nippon Printing, and Material Design Factory

SID Display Week Symposium 2009; June 2-5, 2009 San Antonio, Texas; There were nearly 100 papers this year covering flexible displays from companies and universities alike, a considerable increase on 2008. In this second report, Phillip Hill covers day two papers from Semiconductor Energy Laboratory, Electronics and Telecommunications Research Institute, Hewlett-Packard Labs, Industrial Technology Research Institute (x3), Idemitsu Kosan Co., Universal Display Corporation/Samsung Mobile Display, Toshiba Matsushita Display Technology, Novaled AG/Eastman Kodak, and Liquavista

IMI Ink Jet Technology Showcase; June 2-3, 2009, Zurich, Switzerland; Phillip Hill covers presentations from Agfa, Amica Software, Ardege, Pivotal Resources. Atexco, Digital Dots, Collins Ink Corporation, EXFO-LSI, IT Strategies, and Integration Technology

SGIA Printed Electronics Symposium; May 5-7, 2009, Overland Park, Kansas; Phillip Hill covers presentations from Madico, Crosslink, Add-Vision, Mark Andy Inc., Soligie, Murakami Screen USA, Inc., Richmond Graphic Products, and Preco

FINETECH Japan; April 15-17, 2009, Tokyo, Japan; Phillip Hill covers presentations from E Ink Asia, Dai Nippon Printing, AKT, Yamagata University, iSuppli Japan, Kodak Japan Ltd., Toshiba Mobile Display, Sony Corp., Casio Computer Co., Ltd., Kyushu University, DuPont Displays, Corning Holding Japan G.K., LG Display, Japan Broadcasting Corp., and National Institute of Advanced Industrial Science and Technology

Printed Electronics Europe 2009; April 7-8, Dresden, Germany; In the first of three reports, Phillip Hill covers this IDTechEx-organized event with presentations from Agfa, Alcan Packaging, Applied Nanotech, Centrotherm, Roth&Rau, Daimler, EMPA, and Future Shape

Photovoltaics: Beyond Conventional Silicon; April 7-8, 2009, Dresden, Germany; In the first of two reports, Phillip Hill covers this IDTechEx-organized event with presentations from Heliatek, IDTechEx, iTi, Nokia, Heriot Watt University, and SBf

Smart Fabrics Conference; March 10-12, 2009, Rome, Italy; In this second of three reports, Phillip Hill covers presentations from University of Pavia, D’Appolonia, Philips Research Europe, EeonTex Corp., CSEM, and IMEC

Electronic Displays Conference; March 4-5, 2009, Nuremberg, Germany; Phillip Hill covers a handful of presentations relating to OLEDs from this conference organized by Design & Electronik in Germany: Novaled, Fraunhofer Institute for Photonic Microsystems/Optrex Europe, Epson Europe Electronics GmbH, and Texas Instruments Deutschland GmbH

Flexible Electronics & Displays Conference; February 2-5, Phoenix, Arizona; In this second report from this FlexTech Alliance event, Phillip Hill covers presentations from Plastic Logic, Samsung Electronics, E Ink, LG Displays, Konarka, DuPont Teijin Films, PowerFilm Inc., Binghamton University, Palo Alto Research Center, and Philips Research Technical University

FlexTech Alliance Business & Investment Summit; February 2, 2009, Phoenix, Arizona; Mark Fihn covers presentations from Mark Andy, Kent Displays, Uni-Pixel Displays and Optomec

Plastic Electronics Conference and Showcase; October 28-29, 2008, Berlin, Germany; In this third report, Phillip Hill covers presentations from the European Commission, TNO, VTT Technical Research Centre of Finland, Ohmatex, TITV, University of Pisa, Peratech, Eindhoven University of Technology, Interactive Wear AG, and Conductive Inkjet Technology

Rising from the ashes by Peter Harrop

Printed electronics use more inorganics and composites by Raghu Das

Organic and Printed electronics: OE-A demonstrators illustrate the potential by Klaus Hecker

Where's the “Flex” in Flexible Displays? by Steve Sechrist

The Last Word: An inside view – A great application for a Plastic Electronic System… by Chris Williams

Display Industry Calendar

Issue 39+40

Double Issue

Letter from the publisher: e-Skins… by Mark Fihn

News from around the world: Prime View International/E Ink, NEC Electronics, E Ink, ZBD, HP, Amazon, Samsung, Plastic Logic, Interead/Cybook, txtr, Samsung/LG, NanoMarkets, Displaybank, FlexTech Alliance, DisplaySearch, Printable Electronics Technology Centre, OE-A, NHK, IGNIS Innovation, ETRI, Universal Display Corporation, Dresden University/Novaled, Bayer MaterialScience/Add-Vision, FDC/Universal Display Corporation, NIST, Purdue University, University of California Riverside, University of Tokyo, MIT, Southampton University, Creative Materials, University of Rochester, Fraunhofer Institute, Sungkyunkwan University/University of Nevada, Polymer Vision/University of Cincinnati, Siemens, TopLED, UCLA/Stanford, Seiko Epson, DuPont Displays, Ennova Direct, Philips, Bridgestone, DNP, Asahi Kasei, UCLA, Tokyo University/Japan Science and Technology Agency, UDC/Samsung Mobile Display, Stanford University, Drexel University, Flexible Display Center, Polymertronics, NICT, Georgie Davies, Hong Kong Polytechnic University, Fraunhofer/TU Berlin, Carnegie Mellon University, Infinite Power Solution, Umeå University, Konarka/Arch Aluminum & Glass, SRS Energy/US Tile, University of California at Santa Barbara, Southampton University, QD Soleil, Ascent Solar, Solarmer Energy, PNNL/Vitex, and Cytec Industries/IMEC

SID Display Week Symposium 2009, June 2-5, San Antonio, Texas

  + OLEDs highlight Display Week by Joe Runde

  + Pictorial Summary of Flexible Displays at SID photos by Jurgen Daniel  

  + Summaries of conference proceedings. Phillip Hill covers presentations from covers all the papers from day one of the symposium: Sharp Laboratories of Europe/Sharp Corp., Kent Displays, Add-Vision, Sony, iRex Technologies, Samsung Mobile Display, Universal Display Corporation/LG Display/L3 Communications, Prime View International, Polymer Vision, Versatilis, LG Display, University of Illinois, AIST/Japan Chemical Innovation Institute/Konica Minolta Technology Center/Toppan Printing/DIC Corporation/ADEKA Corporation, and IMEC

Smart Fabrics Conference, March 10-12, 2009, Rome, Italy; Phillip Hill covers presentations from Clothing Plus, Atelier Fede, EU Commission, CeNTI, Ohmatex, University of Pisa (x2), Dublin City University, and TITV

Flexible Electronics & Displays Conference, February 2-5, Phoenix, Arizona; Phillip Hill covers presentations from DisplaySearch, Nerac, HelioVolt, Universal Display Corporation, GSI Technologies, Philips, Renata Batteries, and PVI

OLEDs World Summit, November 10-12, 2008, La Jolla, California; In this third of three reports on this Intertech/PIRA conference, Phillip Hill covers presentations from Tokki Corporation, FUJIFILM Dimatix, Universal Display Corporation, Kodak, Novaled, Corning, Ignis Innovation, and EMD Chemicals

Plastic Electronics Conference and Showcase, October 28-29, Berlin, Germany; In this second report, Phillip Hill covers this conference organized by the Plastic Electronics Foundation and Intertech/PIRA with presentations from Georgia Institute of Technology, University of Western Sydney, Institut de Ciencia de Materials de Barcelona, Heliatek, Acuity Brands Lighting, Cambridge University, and Solarcoating Machinery

Silicon Valley Photovoltaics Society (SVPVS) by Jurgen Daniel

Cost reduction advances for manufacturing flexible displays and electronics by Abbie Gregg

ITO Market Opportunities: Liner Notes From NanoMarkets' Webinar by Lawrence Gasman

Flexible printed LCDs by Peter Harrop

e-Paper Display Technology and Market by Sarah Han

The Last Word: Let there be light! by Chris Williams

Display Industry Calendar

Issue 38

Letter from the publisher: Slowed growth at the FlexTech Alliance conference… by Mark Fihn

News from around the world: Fujitsu, Plastic Logic, Motion Display, Philips, Innovative Glass Corp, Toshiba/Panasonic, Kodak, IDTechEx, Displaybank, OLED100.eu, Panasonic, Novaled, DNP, Adhesives Research, Arradiance, NovaCentrix, Silke Hilsing, OMET /Sonoco Institute, Kanazawa Institute of Technology, Pacific Northwest National Laboratory, Agfa Materials/Holst Centre, Modistech, CMEL/UDC, Printable Electronics Technology Centre, Plextronics, HP/Arizona State University, AIST, University of Toronto/Opalux, Nanoco Technologies, QD Vision, Max Planck Institute, SAIT, Unidym, MIT, Sumitomo/Cambrios/Chisso, USC, Yale, Optomec, Stanford University/Samsung, University of Illinois at Urbana-Champaign, NanoGram/Teijin, Kent State University, NIST, University of Warwick, Tsinghua University, Stanford, NEC, PolyIC, OrganicID, Northwestern University, CSIRO, and Sencera

FlexTech Alliance Business & Investment Summit, February 2, 2009, Phoenix, Arizona; Mark Fihn covers presentations from the US Army, HelioVolt, IPS, Plextronics, Polyera, and Nyx

IDTechEx Printed Electronics USA, December 3-4, 2008, San Jose, California; Phillip Hill covers presentations from AJJER, Asahi Kasei Chemicals, CDT, Chisso, DuPont, Eikos, iTi, NanoMas, NovaCentrix, and Soligie

Flexible Displays and Electronics Conference, November 13-14, 2008, La Jolla, California; Phillip Hill covers presentations from iRex, Add-Vision, PARC, Plastic Logic, Sipix, and Kent Displays

OLEDs World Summit, November 10-12, 2008, La Jolla, California; Phillip Hill covers presentations from Novaled, Technology Project Development, Vitex Systems, and Aixtron

Global Plastic Electronics Conference and Showcase, October 28-29, Berlin, Germany; In this first report of three, Phillip Hill covers presentations from Princeton University, MIT, CENIMAT, Institut für Mikroelektronik Stuttgart, Fraunhofer IPMS, VTT, 3M Display, and ZoLo Designs

SID Display Week Symposium, May 20-23, 2008, Los Angeles, California; Phillip Hill covers presentations from KAIST, KDDI R&D Laboratories Inc/Tokai University, NCTU/CPT/Everlight, Kookmin University/Q-sys, Hoseo University, HP Lab, SAIT, and Kent Displays

Interview with Aimin Song from Nano ePrint

Solar cells – more applications emerging by Harry Zervos

ITO and alternative transparent conductor markets by Lawrence Gasman

A time for lemonade… your next flat panel may just be solar by Steve Sechrist

The Last Word: In memory of Chuck Pearson by Mark Fihn

Display Industry Calendar

Issue 37

Letter from the publisher: ITO – doomsday stories…by Mark Fihn

News from around the world: Queen’s University, Carnegie Mellon University/SMART Technologies, Samsung, Nokia, Antenna Design, Tai Chiem, Campus of the Future, Marc Nardangeli, UDC, illumiNITE, Powerlase, Philips Research, US Department of Energy/Universal Display, Hitachi, MacDermid Autotype, TTP/ImageXpert, Ulbrich, NanoGram/Teijin, Amazon, Plastic Logic, Sony/Google, Novaled/Holst Centre, IDTechEx, NanoMarkets, DisplaySearch, Displaybank, FlexTech Alliance, Epurex Films, Creative Materials, Northwestern University/UIUC, University of Wisconsin-Madison, University of Southern California, Polyera/BASF, Vitex Systems, LC-Tec Displays, Merck/Yissum, Merck, Cymbet/Konarka, BioSolar, T-Solar, AUO, and Infinite Power Solutions

DisplaySearch US FPD Conference, March 2-4, 2009, La Jolla, California; Phillip Hill covers presentations from DisplaySearch, Yole Développement, E Ink, UDC, and Kodak

Plastic and Thin Film Photovoltaics, December 8-9, 2008, Barcelona, Spain;  In this second of two reports on this Intertech/PIRA conference, Phillip Hill covers presentations from Universitat Jaume 1, Konarka, Johannes-Kepler-Universität, New and Renewable Energy Centre, Risø National Laboratory for Sustainable Energy, and DuPont Teijin Films

ISFED Symposium, November 13-14, 2008, Hsinchu, Taiwan; Phillip Hill covers this conference co-organized by ITRI, reporting on presentations from Thin Film Electronics, Seoul National University, Plextronics, and Sunchon National University

Organic Semiconductor Conference, September 29 – October 1, 2008, Frankfurt, Germany; Norman Bardsley covers presentations from Polymer Vision, Palo Alto Research Center, Liquavista, Acreo, University of Muenster, VTT, and Displaybank

SID Mobile Displays Conference 2008, September 23-24, San Diego, California; Phillip Hill covers the flexible aspects of this conference with presentations from Plastic Logic, DuPont OLED Displays, and WaveFront Technologies

Core issues of flexible display technique by Sarah Han

Is industrial inkjet recession-proof? by Mike Willis

Flexible touch screen debuts on a flexible display by Arthur Berman

The gate for OTFT and Tan Dun by Jutta Rasp

The Last Word: Next steps… by Chris Williams

Display Industry Calendar

Issue 35+36

Double Issue

Letter from the publisher: Innovation, pricing, and commoditization…by Mark Fihn

News from around the world: GE Research, Rogers, MFLEX, Loop.pH, Thin Film Electronics, Flash Wear, GlowFur, LumiGram, Luminex, CeeLite, University of Michigan, Planar Energy Devices, Konarka, Konarka/Total, Kovio, prelonic, Liquavista/ Seymourpowell, OQO, Nemoptic/Seiko Instruments, Soligie/Acreo, MIT, QD Vision/In-Q-Tel, TRADIM, ROLLED, ITRI, Queen Mary College, Georgia Institute of Technology, BASF/Osram, e-Smart Technologies, Bundesdruckerei/Samsung, Rockwell Collins, AEVIOM, CombOLED, Add-Vision, Ohio State University/AIXTRON, Department of Defense/Endicott Interconnect Technologies, Pixtronix, Entrust/InCard, IPB, Shanghai University/SVA Electro, Tokyo University, Soligie/Blue Spark, Samsung, HP, Kopin, IDTechEx, Displaybank, Oerlikon Solar, OASYS, Centre for Organic Photonics and Electronics, Applied Materials, Signet Solar, DisplaySearch, CDT/Semprius, Orbotech, GE, FlexTech Alliance/Akron Polymer Systems, Optomec, NIST, SFC/Universal Display Corporation, Sencera, Flexible Display Center, IMEC/Plextronics, Nano-C, Fraunhofer ISE, IDTechEx, NanoMarkets, BASF/Jessup, UT Dallas, Plextronics, Vutec, United Keys, and ESI/Zygo

Plastic and Thin Film Photovoltaics, December 8-9, 2008, Barcelona, Spain; In this first of two reports on this Intertech/PIRA conference, Phillip Hill covers presentations from Alcan Packaging, Wake Forest University, Heliatek, Imperial College London, and PIRA International

IDTechEx Printed Electronics USA 08, December 3-4, 2008, San Jose, California; In this first report of three, Phillip Hill covers presentations from Acreo, Blue Spark Technologies, Infinite Power Solutions, Northrop Grumman Corporation, Rogers Corporation, Stora Enso, Structural Graphics, Terepac, and Toumaz Technology

ISFED Symposium, November 13-14, 2008, Hsinchu, Taiwan; Phillip Hill covers this conference co-organized by ITRI, reporting on presentations from Samsung Electro-Mechanics, AIST, Teijin DuPont Films, and the Organic Electronics Association

10th Annual OLEDs World Summit, November 10-12, 2008, La Jolla, California; In this first of three reports on this Intertech/PIRA conference, Phillip Hill covers presentations from iSuppli, Canaccord Adams, CDT, Bundesdruckerei, and MED/University of Edinburgh/Fraunhofer Institute for Applied Optics and Precision Mechanics/Mobintech/University of Cologne/Fraunhofer Institute for Photonic Microsystems

Thin-Film Transistors, November 13, 2008, La Jolla, California; Phillip Hill covers this Intertech/PIRA conference with presentations from CDT, Evonik Industries, Stanford University, and Georgia Institute of Technology

Flexible Displays and Electronics Conference, November 13-14, 2008, La Jolla, California; In this first of two reports on this Intertech/PIRA conference, Phillip Hill covers presentations from the OLED Association, FlexTech Alliance, Nokia, UKDL, Nyx, and Liquavista

IDTechEx Printed Electronics Asia 08, October 8-9, 2008, Tokyo, Japan; In this second report of two, Phillip Hill covers presentations from Hewlett-Packard/PowerFilm Solar, IDTechEx, National Chiao Tung University, NXT, PixDro, Samsung Advanced Institute of Technology, Sony, Thin Film Electronics, Cambridge University/Plasma Quest, University of Tokyo, and Waseda University

LIGHTSHIFT: LED Solutions Mean Business, September 24, 2008, Toronto, Ontario; Phillip Hill covered this meeting on LED signage and lighting applications for our sister publications but reports here on a presentation relating to flexible printed electronics from PolyPhotonix

3rd Annual Displaybank San Jose Conference, September 9, 2008, Santa Clara, California; Phillip Hill covers presentations from SiPix, Displaybank, and Signet Solar

Displaybank Korea Display Conference, July 2-4, 2008, Seoul, South Korea; Phillip Hill covers presentations from LG Chemical and LG Display

SID Display Week 2008 Symposium, May 20-23, 2008 Los Angeles, California; In this fourth report, Phillip Hill covers presentations from Ricoh Innovations, Kyung Hee University/Samsung SDI, Kyung Hee University, Kent Displays/Kent State University, University of Stuttgart, NEC LED Technologies, and Hong Kong University of Science and Technology

Smart Fabrics 2008, May 5-7, 2008, Charleston, South Carolina; In this final report, Mark Fihn covers presentations from Eleksen, International Fashion Machines, Weel Technologies, Textronics, Bourne Research, and Lumalive

Brilliant images and luminescent wallpapers; Introduction to LOPE-C, Frankfurt, Germany, June 23-25, 2009

Activities on printed electronics starting up in Belgium by Louis Bollens

Competitive advantages of Lightsheet technology by John Daniels

Perspectives on organic electronics and manufacturing by Lawrence Gasman

Ends and beginnings… by Jutta E. Rasp

The Last Word … and the First Word! by Chris Williams

Display Industry Calendar

Issue 33+34

Double Issue

Letter from the publisher: Lights, touch, and e-Readers…by Mark Fihn

News from around the world: NKK, Kodak, Philips, Fraunhofer, Michigan/Princeton Universities, TITV Greiz, Liquid Fiber Displays, Samsung SDI, Sony/Max-Planck-Institute, NEC LCD Technologies, iRex, Brother Industries, Hanvon, AUO, Sharp, Vodafone, Alps Electric, Hodogaya/Novaled, DuPont Displays, Samsung, Solvay, ROLLED Project, Zhongxian Tech, UKDL, Dresden Technical University, OE-A, Yano Research, DisplaySearch, NanoMarkets, Displaybank, Intertech-PIRA, NanoMarkets, FlexTech Alliance, cintelliq, MicroEmissive Displays, PolyPhotonix, Microoled/CEA-LETI, Funai, Hague Corp/Solterra Renewable Technologies, Rohm/Lumiotec, Blue Spark/NTERA, BMBF, BCC Research, QD Vision/In-Q-Tel, Linköping University/Jilin University, NanoGram/TEL, CompSolar, Purdue University, Center of Materials Research, CPFilms, Kent State, Plastic Logic, NTERA/GSI Technologies, National Cheng Kung University/National Chiayi University, Solicore/InCard, Georgia Tech, DuPont Teijin Films/Holst Centre, CSIRO, Merck/OLED-T, Merck, PakSense, Kovio, TransCore, Peratech, Kumoh National Institute of Technology, DuPont Microcircuit Materials, Applied Nanotech/Optomec, Optomec, and Dainippon Screen

IDTechEx Printed Electronics Asia 08, October 8-9, 2008, Tokyo. Japan

• Highlights from IDTechEx Printed Electronics Asia 2008 by Raghu Das

• Presentation summaries from IDTechEx Printed Electronics Asia 2008; In this first of two editions, presentations from BASF, Bridgestone, E Ink, Frontier Carbon Corporation, G24i, Gifu University, H.C. Stark, Imperial College London, iTi, and Nano ePrint.

Organic Semiconductor Conference, September 29 – October 1, 2008, Frankfurt, Germany; Norman Bardsley covers presentations from ARM Holdings, Add Vision, Thorn Lighting, Holst Center, Philips Research Labs, DuPont, and the Fraunhofer Institut for Photonic Microsystems

SID UK & Ireland Chapter, Bistable Displays, June 25, 2008, Bristol, England; Phillip Hill reports on presentations from Hewlett-Packard Laboratories, Nemoptic, ZBD Displays, University College London, AEG MIS, Magink Display Technologies, Philips Research Laboratories, iRex Technologies

IDTechEx Photovoltaics USA, June 17-18, 2008, Denver, Colorado; In this second of two reports, Phillip Hill covers presentations from Oak Ridge National Laboratory, Optomec, Quantenna, Soliant Energy, Helsinki University of Technology, Vitex Systems, and MIT

OLEDs – The Future of Architectural Lighting, June 16, 2008, London, England

SID Display Week 2008 Symposium, May 20-23, Los Angeles, California; In this third report, Phillip Hill covers presentations from LG Display, DuPont Displays, Agfa Gevaert, Philips Research Laboratories, Ricoh Innovations, Pforzheim University/Bartels Mikrotechnik/ADT Deutschland, ITRI, Kent Displays, Hong Kong University of Science and Technology, Polymer Vision, and Konica Minolta

Smart Fabrics 2008, May 5-7, Charleston, South Carolina; In this second report, Mark Fihn covers presentations Intertech-PIRA’s annual Smart Fabrics conference from Enlighted Designs, nyx Illuminated Clothing, The North Face, and Zephyr Technology

Highlights from IDTechEx RFID Europe 2008, Cambridge, England by Peter Harrop

Interview with Wolfgang Mildner from PolyIC

Balls and lights for Nuptse East and Times Square by Jutta E. Rasp

E-paper takes off in all directions -- literally! by Paul H.J. Beatty

E-paper hits the news stands by David Lieberman

Last Word: May you live in interesting times! by Chris Williams

Display Industry Calendar

Issue 31+32

Double Issue

Letter from the publisher: Images from Beijing…by Mark Fihn

News from around the world: Esquire, E Ink, Giesecke & Devrient/Aveso, Citala, SiPix, Kent Displays, University of Strathclyde, AIST, Delta Electronics, Sony, Potomac, CDT/Silvaco, Adhesives Research, IAF/AIXTRON, ASM, UDC, Konica Minolta/UDC, PETeC, ASU, Vitex/Novaled, Vitex Systems, NanoMarkets, Applied Materials, NexTechFAS/Abbie Gregg, Sencera, FlexTech Alliance/Sigma Technologies, Global Solar Energy, GE, PrimeStar Solar, BlueChip/Solicore, Merck, HP/Xtreme Energetics, Hanwha Chemical, NanoGram, NanoGram/OTB, Korea Electricity Research Institute, Plextronics/FlexTech Alliance, Plextronics, FlexTech Alliance/Applied Materials, FlexTech Alliance/Raytheon, Lehigh University/FlexTech Alliance, OSRAM, PHOSFOS, PolyNet, OSC, OLLA, OLED-100.eu, Sigma-Aldrich, Plextronics, Northwestern University, Tokyo University, LG Display, Samsung SDI, AUO, Merck/DELO Industrial Adhesives, RIOE, Trident, SunJet, FUJIFILM Dimatix, Optomec/Applied Nanotech Holdings, Displaybank, Rohm and Haas/Dow Chemical, Nanoco/KISCO, Blue Spark Technologies, Westaim, University of Michigan, Novaled, CSIC, Chroma, Liquid Fiber Displays, University of Manchester, Monash University, Princeton, TMD/Idemitsu Kosan, Kent Optronics, LGC/Fluidigm, Veeco, Flexible Display Center, Nanocomp Technologies, IBM, US Department of Energy, Max Planck Institute

IDTechEx Photovoltaics USA, June 17-18, 2008, Denver, Colorado: Phillip Hill covers presentations from Colorado State University, CSEM, IDTechEx, Idaho National Laboratory, ISET, iTi, and Northfield Automation Systems

SID Display Week 2008 Symposium, May 20-23, Los Angeles, California: In this second report, Phillip Hill covers presentations from HP Labs/Iowa Powerfilm, Kyung Hee University/TLI, ASU, UDC/ Kyung Hee University, Samsung, NCTU/ITRI, Shinoda Plasma, ITRI, and Liquidia

Smart Fabrics 2008, May 5-7, Charleston, South Carolina: In this first report, Mark Fihn covers presentations from Venture Development Corporation, University College Dublin, Bourne Research, Material Connexion, Smart Material Corporation, Crosslink, Milliken & Company, and the University of Colorado

UV/EB Technology Conference & Expo 2008, May 4-7, Chicago, Illinois: Phillip Hill covers papers from North Dakota State University, Kent Displays, Sabic Innovative Plastics, Dow Corning, and Cytec Industries

Printed Electronics Europe 2008, 8-9 April, Dresden, Germany: In this second report on the IDTechEx-organized event, Phillip Hill covers presentations from ImageXpert, InkSure Technologies, NanoMas, MAN Roland, NTERA, Stora Enso, and University of Cambridge

2nd Annual Displaybank New York Conference, March 6, 2008, New York City: Phillip Hill covers presentations from Samsung SDI, E Ink, BSW-Solar, Energy and Environmental Technology Applications Center

Grand Challenges for Emerging Technologies, January 30-31, 2008, Cambridge, England: Speakers in this second report by Mark Fihn are from the Nottingham Trent University, Veritas et Visus,

Stuart Evans, HP, Welsh Centre for Printing and Coating, Polymertronics, CIKC, London Centre for Nanotechnology, Kodak, EPSRC, Enterprise Ventures, and NESTA Investments.

USDC 2008 Flexible Microelectronics & Displays, January 21-24, 2008, Phoenix, Arizona: In this first report from the annual USDC event, Mark Fihn covers presentations from Aveso, Cornell University, Soligie, PETeC, University of Tokyo, Samsung, Polymer Vision, Universal Display, Flexible Display Center, ITRI, General Electric Global Research, Princeton University, and HP

Interview with Bob Stevens from the Rutherford Appleton Laboratory

Carbon Nanotube TFTs and Flexible Substrates by Paul H.J. Beatty

All Eyes on Printed Electronics by Peter Harrop

Timing and market development by Norman Bardsley

All-printed 13.56 MHz RFID tags by Craig Cruickshank

Displays flexing but slowly by David Lieberman

Program updates announced for Plastic Electronics Conference by Ed van den Kieboom

E-squire: Esquire's electrophoretic cover takes shape by Ken Werner

Why Papageno would have gone to Beijing…by Jutta E. Rasp

OLED-A update by Joe Runde

The Last Word: OLED-T update -- When words aren’t enough…by Chris Williams

Display Industry Calendar

Issue 30

Letter from the publisher: Pool envy…by Mark Fihn

News from around the world: DuPont/Dainippon Screen, Lumiotec, Samsung SDI/Bundesdruckerei, Georgia Tech, IMRE, Changhong, OLED Association, Lösche Design, GE Global Research, Sumitomo Chemical, Samsung-SDI, Dell, Universal Display Corporation, UDC/Seiko Epson, Toray, Fraunhofer Institute, KDDI, Polymertronics, Merck, CDT/Sumitomo Chemical/Novaled, Dow Corning/USDC, OLED-T, DisplaySearch, UIUC/Northwestern University, DARPA/BIODENT, EMD Chemicals, DOE, LG Display, MIT, Northwestern/Princeton, NIST, ALIO Industries/FUJIFILM Dimatix, AUO, Identita, UINT/Solicore, Infiniscale/Sofileta, PaperDisplay, Harvard, Epson, E Ink, Mitsubishi, Polymer Vision, ZBD, NanoMarkets, IDTechEx, UK Trade & Investment, Frost & Sullivan, University of Illinois, UCSD, PARC, HP, Xtreme Energetics, Sunrgi, Kopin, NanoGram, Sungkyunkwan University and University of Nevada, and Evolved Footwear

SID Display Week 2008 Symposium, May 20-23, Los Angeles, California: Flexible displays were high on the agenda at SID this year with around 80 papers spread across 20 sessions. In this first report, Phillip Hill covers presentations from Nippon Steel, Honeywell/Arizona State University, Brunel University/Elumin8, UDC/Seiko Epson, CSEM, EPFL/University of Latvia/Philips, Dai Nippon Printing, and NHK.

Report on SID Display Week by Robert Simpson

Printed Electronics Europe 2008, April 8-9, Dresden, Germany: In this first report on the IDTechEx-organized event, Phillip Hill covers presentations from Åbo Akademi University, Beltronics, Chisso, Cima Nanotech, Centre for Process Innovation, Heliatek, and Hewlett-Packard

ISFED Conference, December 17-19, 2007, Hsinchu, Taiwan: In the second of two reports, Phillip Hill covers presentations from Fraunhofer FEP, the Organic Electronics Association, and the University of Tokyo

Printed Electronics USA 2007, November 12-15, San Francisco, California: In this second report from this IDTechEx-organized event, Phillip Hill covers presentations from NXT, Optomec, Orfid, PakSense, Solarmer Energy, STMicroelectronics, and Thin Film Electronics

9th Annual OLEDs World Summit, November 6-9, 2007, San Diego, California: This is the third of three reports by Norman Bardsley on the OLEDs World Summit 2007 organized by Intertech-Pira held in La Jolla near San Diego. This report focuses performance targets related to OLEDs.

20 years of experience: preparation and applications of conductive polymers by Louis Bollens

The Last Word: Here we go again (soon)… by Chris Williams

Display Industry Calendar

Issue 28+29

Double Issue

Letter from the publisher: Continued growth at the USDC Flex conference…by Mark Fihn

News from around the world: US Department of Energy,  Fast2Light, CPI/Cenamps, MaDriX, Nanoident, AMAzOLED, CAMM, Heterogeneous Technology Alliance, SSLITA, IDTechEx, Etched in Time/USDC, Honeywell/USDC, USDC/Optomec, DuPont Teijin Films, Evonik/EL-Technologie, FUJIFILM Dimatix, Agilent/FUJIFILM Dimatix, iTi, Tokyo University, Photon Dynamics/Plastic Logic, Endicott Interconnect/Unimicron, EV Group, MicroCat, Digital View, Kent Displays, Innovative Card Technologies/ActivIdentity, SmartDisplayer, Orange, E Ink, Epson/E Ink, Polymer Vision, Nemoptic, Amazon, Toppan Printing/Hitachi, Liquavista, Fraunhofer, Toray Industries, LG Chem/UDC, Merck KGaA, University of Michigan, OLED-T, Bridgestone, Sony, 3DIcon, Sun Yat-Sen University, University of Illinois, Solvay/COPE, Georgia Institute of Technology, CAAN, HP/Crospon, Soligie, Holst Centre, H.C. Stark, Nanosys/Sharp, Bayer MaterialScience/Clariant Masterbatches, Nanocomp Technologies, University of Manchester, Rutgers University, Lund University, Unidym/Nippon Kayaku, Unidym/Ensysce Biosciences, NanoDynamics, Mitsubishi Chemical Holdings, Northwestern University, Purdue, NanoGram, University of Wisconsin, Vitex Systems, Opalux, MicroChem/Nippon Kayaku, Rohm and Haas/Gracel Display, DuPont Teijin Films/Thin Film Electronics, ZINK Imaging/ Alps Electric, ZINK Imaging/Foxconn Technology, Toumaz Technology, Tesco/ZBD, Eurovia, National Cheng Kung University, Fusion Optix, Frost & Sullivan, DisplaySearch, NanoMarkets, Displaybank, Axcess International, QD Vision/In-Q-Tel, QD Vision, TenCate/Xennia, IXYS, Laird Technologies, Molecular Vision/Acrongenomics, University of Tokyo, University of Western Sydney, OSRAM, Kodak/LG Display, Kodak, Ciba/Novaled, GE, Novaled, OSRAM/Ingo Maurer, Sony, Corning, SCHOTT Solar/ersol Thin Film, Idaho National Laboratory/Microcontinuum, SnapWatch, Konarka, Top Floor, Duck Image Studio, Jonas Samson, Nokia/University of Cambridge, Light+Building Fair, Konarka/SKYShades, OPTOTECH, Hibino, Enlighted, GlowFur, LumiGram, and Philips Lumalive/Swarovski

Lighting for Mood, Health & Well-being Workshop, April 1, 2008, London, England: Talks from the following companies, Alcan Packaging, Thorn Lighting, St. Andrews University, and Citylights, are relevant to the interests of readers to the Flexible Substrate…

Grand Challenges for Emerging Technologies, January 30-31, 2008, Cambridge, England: This event featured several speakers that discussed topics related to flexible displays including, the Center for Advanced Photonics & Electronics, Imperial College, Pelikon, Plastic Logic, Gwent Electronic Materials, Cambridge Integrated Knowledge Center, and OIDA.

Flexibly speaking about printed electronics by Tom Cheyney

USDC Flexible Displays Conference awards students for outstanding achievement by Phillip Hill

USDC 2008 Flexible Microelectronics & Displays, January 21-24, 2008, Phoenix, Arizona:  In this first report from the annual USDC event, Mark Fihn covers presentations from DisplaySearch, E Ink, Agile Tag, nFlexion, NanoMarkets, and the UKDL

ISFED Conference, December 17-18, 2007, Hsinchu, Taiwan: This conference was organized by the Industrial Technology Research Institute, Taiwan (ITRI), the National Tsing Hua University (NTHU), and the Organic Electronics Association (OE-A). In the first of two reports, Phillip Hill covers presentations from USDC, Merck Chemicals, Holst Centre, and plastic electronic GmbH

DisplayForum 2007, November 14-15, Prague, Czech Republic: Phillip Hill’s second report on this Meko-organized event covers presentations from Liquavista, Nemoptic, and MicroEmissive Displays

Printed Electronics USA 2007, November 12-15, San Francisco, California: In this first report from this IDTechEx-organized event, Phillip Hill covers presentations from Add-Vision, AGFA, BASF, Beltronics, University of California at Berkeley, CDT, Cubic Transportation Systems, FUJIFILM Dimatix, GSI Technologies, HelioVolt, IDTechEx, University of Manchester, NovaCentrix, and NTERA

9th Annual OLEDs World Summit, November 6-9, San Diego, California: This is the second of three reports by Norman Bardsley on the OLEDs World Summit 2007 organized by Intertech-PIRA held in La Jolla near San Diego. The first report focused on topics directly relating to flexible substrates and those on lighting applications will be discussed in the third report.

SID Display Applications Conference, October 23-25, San Francisco, California: Phillip Hill’s second report from this newly-named conference focused on the engineering aspect of applications covers presentations from Citala, SiPix, and Qualcomm MEMS Technologies

10th Asian Symposium on Information Display, August 2-3, Singapore: Phillip Hill reports on presentations from Kyungpook National University, Kyungil University, Korea University, and Hoseo University

Printed electronics market outlook by Lawrence Gasman

New breakthroughs in electronic inks by Peter Harrop

The future of organic photovoltaics by Harry Zervos

World’s first OLED table light by Jutta Rasp